Making metal-insulator-metal device

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CPC
Y10S438/957

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S438/00Semiconductor device manufacturing: process

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Y10S438/957Making metal-insulator-metal device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Precision high-frequency capacitor formed on semiconductor substrate
- Patent number 9,136,060
- Issue date Sep 15, 2015
- Vishay Siliconix
- Haim Goldberger
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Memory cells having storage elements that share material layers wit...
- Patent number 8,981,331
- Issue date Mar 17, 2015
- Sandisk 3D LLC
- Yung-Tin Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Memory cells having storage elements that share material layers wit...
- Patent number 8,969,845
- Issue date Mar 3, 2015
- Sandisk 3D LLC
- Yung-Tin Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Select devices including an open volume, and related methods, memor...
- Patent number 8,957,403
- Issue date Feb 17, 2015
- Micron Technology, Inc.
- Bhaskar Srinivasan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Laminate stacked capacitor, circuit substrate with laminate stacked...
- Patent number 8,957,499
- Issue date Feb 17, 2015
- Fujitsu Limited
- Yoshihiko Imanaka
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Reliable contacts
- Patent number 8,916,939
- Issue date Dec 23, 2014
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Hong Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor structure with means for testing metal-insulator-meta...
- Patent number 8,884,288
- Issue date Nov 11, 2014
- Shanghai Huali Microelectronics Corporation
- Qiang Li
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Formation of high sheet resistance resistors and high capacitance c...
- Patent number 8,835,251
- Issue date Sep 16, 2014
- Alpha and Omega Semiconductor Incorporated
- YongZhong Hu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Technique to create a buried plate in embedded dynamic random acces...
- Patent number 8,563,446
- Issue date Oct 22, 2013
- International Business Machines Corporation
- Ashima B. Chakravarti
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Select devices including an open volume, memory devices and systems...
- Patent number 8,541,770
- Issue date Sep 24, 2013
- Micron Technology, Inc.
- Bhaskar Srinivasan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Reliable contacts
- Patent number 8,519,482
- Issue date Aug 27, 2013
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Hong Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Low leakage MIM capacitor
- Patent number 8,470,665
- Issue date Jun 25, 2013
- Micron Technology, Inc.
- Sam Yang
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory cells having storage elements that share material layers wit...
- Patent number 8,389,971
- Issue date Mar 5, 2013
- Sandisk 3D LLC
- Yung-Tin Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Metal gate transistors with raised source and drain regions formed...
- Patent number 8,344,452
- Issue date Jan 1, 2013
- Intel Corporation
- Nick Lindert
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Precision high-frequency capacitor formed on semiconductor substrate
- Patent number 8,324,711
- Issue date Dec 4, 2012
- Vishay Intertechnology, Inc.
- Haim Goldberger
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Capacitive element, method of manufacture of the same, and semicond...
- Patent number 8,264,063
- Issue date Sep 11, 2012
- Fujitsu Limited
- Takeshi Shioga
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Technique to create a buried plate in embedded dynamic random acces...
- Patent number 8,236,710
- Issue date Aug 7, 2012
- International Business Machines Corporation
- Ashima B. Chakravarti
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Metal-insulator-metal (MIM) devices and their methods of fabrication
- Patent number 8,222,077
- Issue date Jul 17, 2012
- CBRITE Inc.
- Xiong Gong
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Methods of fabricating non-volatile memory devices having carbon na...
- Patent number 8,193,030
- Issue date Jun 5, 2012
- Samsung Electronics Co., Ltd.
- Chang-wook Moon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device with shield line disposed between capacitors
- Patent number 8,159,045
- Issue date Apr 17, 2012
- Renesas Electronics Corporation
- Koujirou Matsui
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing M-I-M capacitor of semiconductor device
- Patent number 8,008,148
- Issue date Aug 30, 2011
- Dongbu Hitek Co., Ltd.
- Ho-Yeong Choe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Select devices including an open volume, memory devices and systems...
- Patent number 8,008,162
- Issue date Aug 30, 2011
- Micron Technology, Inc.
- Bhaskar Srinivasan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Precision high-frequency capacitor formed on semiconductor substrate
- Patent number 8,004,063
- Issue date Aug 23, 2011
- Vishay Intertechnology, Inc.
- Haim Goldberger
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming a high impedance antifuse
- Patent number 7,981,731
- Issue date Jul 19, 2011
- International Business Machines Corporation
- John A. Fifield
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Rectangular contact used as a low voltage fuse element
- Patent number 7,977,230
- Issue date Jul 12, 2011
- Texas Instruments Incorporated
- Andrew T. Appel
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Gap capacitors for monitoring stress in solder balls in flip chip t...
- Patent number 7,939,390
- Issue date May 10, 2011
- International Business Machines Corporation
- Stephen P. Ayotte
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wiring structure and wiring designing method
- Patent number 7,935,630
- Issue date May 3, 2011
- Fujitsu Semiconductor Limited
- Motonobu Sato
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fabrication of channel wraparound gate structure for field-effect t...
- Patent number 7,915,167
- Issue date Mar 29, 2011
- Intel Corporation
- Marko Radosavljevic
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Nonvolatile memory devices and methods of fabricating the same
- Patent number 7,884,410
- Issue date Feb 8, 2011
- Samsung Electronics Co., Ltd.
- Chang-wook Moon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Formation of high sheet resistance resistors and high capacitance c...
- Patent number 7,855,422
- Issue date Dec 21, 2010
- Alpha & Omega Semiconductor, Ltd.
- YongZhong Hu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
MEMORY CELLS HAVING STORAGE ELEMENTS THAT SHARE MATERIAL LAYERS WIT...
- Publication number 20140284538
- Publication date Sep 25, 2014
- Yung-Tin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE CONTACTS
- Publication number 20130334616
- Publication date Dec 19, 2013
- GLOBALFOUNDRIER Singapore Pte. Ltd.
- Hong YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW LEAKAGE MIM CAPACITOR
- Publication number 20130285206
- Publication date Oct 31, 2013
- Sam Yang
- G11 - INFORMATION STORAGE
Information Patent Application
SELECT DEVICES INCLUDING AN OPEN VOLUME, AND RELATED METHODS, MEMOR...
- Publication number 20130285110
- Publication date Oct 31, 2013
- Bhaskar Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELLS HAVING STORAGE ELEMENTS THAT SHARE MATERIAL LAYERS WIT...
- Publication number 20130175492
- Publication date Jul 11, 2013
- SanDisk 3D LLC
- Yung-Tin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE CONTACTS
- Publication number 20130075823
- Publication date Mar 28, 2013
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Hong YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE TO CREATE A BURIED PLATE IN EMBEDDED DYNAMIC RANDOM ACCES...
- Publication number 20120228736
- Publication date Sep 13, 2012
- International Business Machines Corporation
- ASHIMA B. CHAKRAVARTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELLS HAVING STORAGE ELEMENTS THAT SHARE MATERIAL LAYERS WIT...
- Publication number 20120091419
- Publication date Apr 19, 2012
- Yung-Tin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE TO CREATE A BURIED PLATE IN EMBEDDED DYNAMIC RANDOM ACCES...
- Publication number 20120086103
- Publication date Apr 12, 2012
- International Business Machines Corporation
- ASHIMA B. CHAKRAVARTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CAPACITOR, AND CAPACITOR, CIRCUIT SUBSTRATE...
- Publication number 20120074521
- Publication date Mar 29, 2012
- Fujitsu Limited
- Yoshihiko Imanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECT DEVICES INCLUDING AN OPEN VOLUME, MEMORY DEVICES AND SYSTEMS...
- Publication number 20110298007
- Publication date Dec 8, 2011
- Micron Technology, Inc.
- Bhaskar Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECISION HIGH-FREQUENCY CAPACITOR FORMED ON SEMICONDUCTOR SUBSTRATE
- Publication number 20110176247
- Publication date Jul 21, 2011
- VISHAY INTERTECHNOLOGY, INC.
- Haim Goldberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF CHANNEL WRAPAROUND GATE STRUCTURE FOR FIELD-EFFECT T...
- Publication number 20110156145
- Publication date Jun 30, 2011
- Marko Radosavljevic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of fabricating non-volatile memory devices having carbon na...
- Publication number 20110117735
- Publication date May 19, 2011
- Chang-wook Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of high sheet resistance resistors and high capacitance c...
- Publication number 20110092035
- Publication date Apr 21, 2011
- YongZhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20110049675
- Publication date Mar 3, 2011
- FUJITSU MICROELECTRONICS LIMITED
- Kouichi NAGAI
- G01 - MEASURING TESTING
Information Patent Application
Precision high-frequency capacitor formed on semiconductor substrate
- Publication number 20100295152
- Publication date Nov 25, 2010
- Vishay Intertechnology, Inc.
- Haim Goldberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CAPACITOR EMBEDDED IN INTERPOSER
- Publication number 20100233359
- Publication date Sep 16, 2010
- Fujitsu Limited
- Takeshi SHIOGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GAP CAPACITORS FOR MONITORING STRESS IN SOLDER BALLS IN FLIP CHIP T...
- Publication number 20100203655
- Publication date Aug 12, 2010
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20100140740
- Publication date Jun 10, 2010
- NEC Electronics Corporation
- Koujirou Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECT DEVICES INCLUDING AN OPEN VOLUME, MEMORY DEVICES AND SYSTEMS...
- Publication number 20100123122
- Publication date May 20, 2010
- Micron Technology, Inc.
- Bhaskar Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CAPACITOR OF SEMICONDUCTOR DEVICE
- Publication number 20090283857
- Publication date Nov 19, 2009
- Ho-Yeong Choe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20090243038
- Publication date Oct 1, 2009
- Fujitsu Microelectronics Limited
- Kouichi NAGAI
- G01 - MEASURING TESTING
Information Patent Application
GAP CAPACITORS FOR MONITORING STRESS IN SOLDER BALLS IN FLIP CHIP T...
- Publication number 20090201626
- Publication date Aug 13, 2009
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Integrated Circuit Devices Having High-Q Wafer Back-S...
- Publication number 20090111235
- Publication date Apr 30, 2009
- Lawrence Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR EMBEDDED IN INTERPOSER, SEMICONDUCTOR DEVICE INCLUDING TH...
- Publication number 20090057827
- Publication date Mar 5, 2009
- Fujitsu Limited
- Takeshi SHIOGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECTANGULAR CONTACT USED AS A LOW VOLTAGE FUSE ELEMENT
- Publication number 20090017609
- Publication date Jan 15, 2009
- TEXAS INSTRUMENTS INCORPORATED
- ANDREW T. APPEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitive element, method of manufacture of the same, and semicond...
- Publication number 20080315358
- Publication date Dec 25, 2008
- FUJITSU LIMITED
- Takeshi Shioga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nonvolatile memory devices and methods of fabricating the same
- Publication number 20080191261
- Publication date Aug 14, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Chang-wook Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND WIRING DESIGNING METHOD
- Publication number 20080179084
- Publication date Jul 31, 2008
- Fujitsu Limited
- Motonobu SATO
- G06 - COMPUTING CALCULATING COUNTING

Making metal-insulator-metal device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Precision high-frequency capacitor formed on semiconductor substrate

Memory cells having storage elements that share material layers wit...

Memory cells having storage elements that share material layers wit...

Select devices including an open volume, and related methods, memor...

Laminate stacked capacitor, circuit substrate with laminate stacked...

Reliable contacts

Semiconductor structure with means for testing metal-insulator-meta...

Formation of high sheet resistance resistors and high capacitance c...

Technique to create a buried plate in embedded dynamic random acces...

Select devices including an open volume, memory devices and systems...

Reliable contacts

Low leakage MIM capacitor

Memory cells having storage elements that share material layers wit...

Metal gate transistors with raised source and drain regions formed...

Precision high-frequency capacitor formed on semiconductor substrate

Capacitive element, method of manufacture of the same, and semicond...

Technique to create a buried plate in embedded dynamic random acces...

Metal-insulator-metal (MIM) devices and their methods of fabrication

Methods of fabricating non-volatile memory devices having carbon na...

Semiconductor device with shield line disposed between capacitors

Method of manufacturing M-I-M capacitor of semiconductor device

Select devices including an open volume, memory devices and systems...

Precision high-frequency capacitor formed on semiconductor substrate

Method of forming a high impedance antifuse

Rectangular contact used as a low voltage fuse element

Gap capacitors for monitoring stress in solder balls in flip chip t...

Wiring structure and wiring designing method

Fabrication of channel wraparound gate structure for field-effect t...

Nonvolatile memory devices and methods of fabricating the same

Formation of high sheet resistance resistors and high capacitance c...

Patents Applicationslast 30 patents

MEMORY CELLS HAVING STORAGE ELEMENTS THAT SHARE MATERIAL LAYERS WIT...

RELIABLE CONTACTS

LOW LEAKAGE MIM CAPACITOR

SELECT DEVICES INCLUDING AN OPEN VOLUME, AND RELATED METHODS, MEMOR...

MEMORY CELLS HAVING STORAGE ELEMENTS THAT SHARE MATERIAL LAYERS WIT...

RELIABLE CONTACTS

TECHNIQUE TO CREATE A BURIED PLATE IN EMBEDDED DYNAMIC RANDOM ACCES...

MEMORY CELLS HAVING STORAGE ELEMENTS THAT SHARE MATERIAL LAYERS WIT...

TECHNIQUE TO CREATE A BURIED PLATE IN EMBEDDED DYNAMIC RANDOM ACCES...

METHOD OF MANUFACTURING CAPACITOR, AND CAPACITOR, CIRCUIT SUBSTRATE...

SELECT DEVICES INCLUDING AN OPEN VOLUME, MEMORY DEVICES AND SYSTEMS...

PRECISION HIGH-FREQUENCY CAPACITOR FORMED ON SEMICONDUCTOR SUBSTRATE

FABRICATION OF CHANNEL WRAPAROUND GATE STRUCTURE FOR FIELD-EFFECT T...

Methods of fabricating non-volatile memory devices having carbon na...

Formation of high sheet resistance resistors and high capacitance c...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Precision high-frequency capacitor formed on semiconductor substrate

METHOD FOR MANUFACTURING CAPACITOR EMBEDDED IN INTERPOSER

GAP CAPACITORS FOR MONITORING STRESS IN SOLDER BALLS IN FLIP CHIP T...

Semiconductor device

SELECT DEVICES INCLUDING AN OPEN VOLUME, MEMORY DEVICES AND SYSTEMS...

METHOD OF MANUFACTURING CAPACITOR OF SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

GAP CAPACITORS FOR MONITORING STRESS IN SOLDER BALLS IN FLIP CHIP T...

Semiconductor Integrated Circuit Devices Having High-Q Wafer Back-S...

CAPACITOR EMBEDDED IN INTERPOSER, SEMICONDUCTOR DEVICE INCLUDING TH...

RECTANGULAR CONTACT USED AS A LOW VOLTAGE FUSE ELEMENT

Capacitive element, method of manufacture of the same, and semicond...

Nonvolatile memory devices and methods of fabricating the same

WIRING STRUCTURE AND WIRING DESIGNING METHOD