Making porous regions on the surface

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/0203Making porous regions on the surface

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wafer processing method
- Patent number 12,315,716
- Issue date May 27, 2025
- Disco Corporation
- Shunichiro Hirosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cutting substrate wafer from indium phosphide crystal bar
- Patent number 12,285,819
- Issue date Apr 29, 2025
- THE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
- Yanlei Shi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-planar semiconductor packaging systems and related methods
- Patent number 12,272,572
- Issue date Apr 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Manufacturing and reuse of semiconductor substrates
- Patent number 12,249,504
- Issue date Mar 11, 2025
- Infineon Technologies AG
- Bernhard Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wafer bonding including edge trimming
- Patent number 12,237,165
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yung-Lung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of workpiece
- Patent number 12,191,138
- Issue date Jan 7, 2025
- Disco Corporation
- Toshio Tsuchiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a composite structure comprising a thin la...
- Patent number 12,033,854
- Issue date Jul 9, 2024
- Soitec
- Yann Sinquin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crystal efficient SiC device wafer production
- Patent number 11,996,330
- Issue date May 28, 2024
- II-VI ADVANCED MATERIALS, LLC
- Adolf Schöner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer, manufacturing method for semiconductor wafer,...
- Patent number 11,984,313
- Issue date May 14, 2024
- Kioxia Corporation
- Takashi Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer configured to recondition a support surface of a wafer holdin...
- Patent number 11,955,368
- Issue date Apr 9, 2024
- Imec VZW
- Thomas Hantschel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-planar semiconductor packaging systems and related methods
- Patent number 11,894,245
- Issue date Feb 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Semiconductor device with a porous portion, wafer composite and met...
- Patent number 11,881,397
- Issue date Jan 23, 2024
- Infineon Technologies AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stress control using backside film deposition and laser anneal
- Patent number 11,842,911
- Issue date Dec 12, 2023
- Yangtze Memory Technologies Co., Ltd.
- Pengan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of porosifying part of a semiconductor wafer
- Patent number 11,810,779
- Issue date Nov 7, 2023
- Infineon Technologies AG
- Sophia Friedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating cavities in silicon carbide and other semicondu...
- Patent number 11,756,783
- Issue date Sep 12, 2023
- HRL Laboratories, LLC
- Eric Prophet
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 11,710,691
- Issue date Jul 25, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully automated wafer debonding system and method thereof
- Patent number 11,670,524
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 11,616,008
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,562,897
- Issue date Jan 24, 2023
- Renesas Electronics Corporation
- Hideki Makiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of electrochemically processing a substrate and integrated c...
- Patent number 11,538,689
- Issue date Dec 27, 2022
- Universite Catholique De Louvain
- Gilles Scheen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a porous portion, wafer composite and met...
- Patent number 11,476,111
- Issue date Oct 18, 2022
- Infineon Technologies AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for partially removing a semiconductor wafer
- Patent number 11,404,262
- Issue date Aug 2, 2022
- Infineon Technologies AG
- Sophia Friedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor surface smoothing and semiconductor arrangement
- Patent number 11,373,857
- Issue date Jun 28, 2022
- Infineon Technologies AG
- Bernhard Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer polishing method
- Patent number 11,342,233
- Issue date May 24, 2022
- Disco Corporation
- Yasuyuki Takeishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foam in ion implantation system
- Patent number 11,222,768
- Issue date Jan 11, 2022
- Varian Semiconductor Equipment Associates, Inc.
- James Alan Pixley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Healing method before transfer of a semiconducting layer
- Patent number 11,195,711
- Issue date Dec 7, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Pablo Acosta Alba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
UV laser slicing of β-Ga2O3 by micro-crack generation and propagation
- Patent number 11,171,055
- Issue date Nov 9, 2021
- The Government of the United States of America, as represented by the Secreta...
- Nadeemullah A. Mahadik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct growth methods for preparing diamond-assisted heat-dissipati...
- Patent number 11,139,176
- Issue date Oct 5, 2021
- Harbin Institute of Technology
- Bing Dai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PROCESSING A SEMICONDUCTOR WAFER
- Publication number 20250183031
- Publication date Jun 5, 2025
- INFINEON TECHNOLOGIES AG
- Bernhard Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE AND MANUFACTURING METHOD THEREOF AS WELL AS SEMICONDUCTOR PACKA...
- Publication number 20250125216
- Publication date Apr 17, 2025
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- YUEH-MING TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR WAFER TREATMENT
- Publication number 20240420946
- Publication date Dec 19, 2024
- Hua Hsu Silicon Materials Co., Ltd.
- Chiao-Yang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
N-TYPE DOUBLE-SIDED SOLAR CELL PREPARATION METHOD
- Publication number 20240405151
- Publication date Dec 5, 2024
- Tongwei Solar (Meishan) Co., Ltd.
- Wenzhou XU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20240297106
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PLACING METHOD
- Publication number 20240274462
- Publication date Aug 15, 2024
- TOKYO ELECTRON LIMITED
- Makoto Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYSTAL EFFICIENT SIC DEVICE WAFER PRODUCTION
- Publication number 20240274468
- Publication date Aug 15, 2024
- Adolf SCHONER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING GAAS WAFER, AND GAAS WAFER GROUP
- Publication number 20240162031
- Publication date May 16, 2024
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Junji SUGIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...
- Publication number 20240153759
- Publication date May 9, 2024
- INFINEON TECHNOLOGIES AG
- Iris MODER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-PLANAR SEMICONDUCTOR PACKAGING SYSTEMS AND RELATED METHODS
- Publication number 20240145266
- Publication date May 2, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
METHOD FOR PREPARING THE RESIDUE OF A DONOR SUBSTRATE, A LAYER OF W...
- Publication number 20240120191
- Publication date Apr 11, 2024
- SOITEC
- Isabelle Huyet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
- Publication number 20240030021
- Publication date Jan 25, 2024
- TOKYO ELECTRON LIMITED
- Yohei YAMASHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Featuring Ridged Architecture
- Publication number 20240014262
- Publication date Jan 11, 2024
- Walter A. Tormasi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate For Epitaxial Growth, Manufacturing Method of the Same, S...
- Publication number 20230411152
- Publication date Dec 21, 2023
- FUJIAN JING' AN OPTOELECTRONICS CO., LTD
- Bohsiang TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20230307343
- Publication date Sep 28, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
- Publication number 20230282494
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETECTING ANALYTES
- Publication number 20230221282
- Publication date Jul 13, 2023
- MONASH UNIVERSITY
- Rajpreet Singh MINHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD
- Publication number 20230207303
- Publication date Jun 29, 2023
- Semiconductor Manufacturing International (Beijing) Corporation
- Qingzhao LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASC PROCESS AUTOMATION DEVICE
- Publication number 20230154767
- Publication date May 18, 2023
- SK SILTRON CO., LTD.
- Ho Yong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230138616
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRESS CONTROL USING BACKSIDE FILM DEPOSITION AND LASER ANNEAL
- Publication number 20230062866
- Publication date Mar 2, 2023
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Pengan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230011018
- Publication date Jan 12, 2023
- RENESAS ELECTRONICS CORPORATION
- Hideki MAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ADJUSTING WAFER SHAPE USING MULTI-DIRECTIONAL ACTUATION F...
- Publication number 20230008350
- Publication date Jan 12, 2023
- TOKYO ELECTRON LIMITED
- Charlotte CUTLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE-GAP SEMICONDUCTOR SUBSTRATE, APPARATUS FOR MANUFACTURING WIDE-...
- Publication number 20220416021
- Publication date Dec 29, 2022
- SPP TECHNOLOGIES CO., LTD.
- Takashi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20220392762
- Publication date Dec 8, 2022
- Disco Corporation
- Shunichiro HIROSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...
- Publication number 20220359194
- Publication date Nov 10, 2022
- INFINEON TECHNOLOGIES AG
- Iris MODER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATION WAFERS AND METHOD OF PRODUCING BONDED WAFERS USING THE SAME
- Publication number 20220319835
- Publication date Oct 6, 2022
- GlobalWafers Japan Co., Ltd.
- Tatsuhiko AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF POROSIFYING PART OF A SEMICONDUCTOR WAFER
- Publication number 20220310380
- Publication date Sep 29, 2022
- Sophia Friedler
- H01 - BASIC ELECTRIC ELEMENTS

Making porous regions on the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer processing method

Method for cutting substrate wafer from indium phosphide crystal bar

Non-planar semiconductor packaging systems and related methods

Manufacturing and reuse of semiconductor substrates

Method for wafer bonding including edge trimming

Semiconductor device and method of forming micro interconnect struc...

Processing method of workpiece

Through-substrate via structure and method of manufacture

Method for manufacturing a composite structure comprising a thin la...

Crystal efficient SiC device wafer production

Semiconductor wafer, manufacturing method for semiconductor wafer,...

Wafer configured to recondition a support surface of a wafer holdin...

Non-planar semiconductor packaging systems and related methods

Semiconductor device with a porous portion, wafer composite and met...

Wafer stress control using backside film deposition and laser anneal

Method of porosifying part of a semiconductor wafer

Method for creating cavities in silicon carbide and other semicondu...

Semiconductor device and method of forming micro interconnect struc...

Fully automated wafer debonding system and method thereof

Through-substrate via structure and method of manufacture

Method of manufacturing semiconductor device

Method of electrochemically processing a substrate and integrated c...

Semiconductor device with a porous portion, wafer composite and met...

Method for partially removing a semiconductor wafer

Semiconductor surface smoothing and semiconductor arrangement

Wafer polishing method

Foam in ion implantation system

Healing method before transfer of a semiconducting layer

UV laser slicing of β-Ga2O3 by micro-crack generation and propagation

Direct growth methods for preparing diamond-assisted heat-dissipati...

Patents Applicationslast 30 patents

METHOD OF PROCESSING A SEMICONDUCTOR WAFER

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

DIE AND MANUFACTURING METHOD THEREOF AS WELL AS SEMICONDUCTOR PACKA...

METHOD FOR WAFER TREATMENT

N-TYPE DOUBLE-SIDED SOLAR CELL PREPARATION METHOD

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PLACING METHOD

CRYSTAL EFFICIENT SIC DEVICE WAFER PRODUCTION

METHOD OF PRODUCING GAAS WAFER, AND GAAS WAFER GROUP

SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...

NON-PLANAR SEMICONDUCTOR PACKAGING SYSTEMS AND RELATED METHODS

METHOD FOR PREPARING THE RESIDUE OF A DONOR SUBSTRATE, A LAYER OF W...

LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

Semiconductor Featuring Ridged Architecture

Substrate For Epitaxial Growth, Manufacturing Method of the Same, S...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF

METHOD FOR DETECTING ANALYTES

SEMICONDUCTOR PACKAGING METHOD

ASC PROCESS AUTOMATION DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

WAFER STRESS CONTROL USING BACKSIDE FILM DEPOSITION AND LASER ANNEAL

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF ADJUSTING WAFER SHAPE USING MULTI-DIRECTIONAL ACTUATION F...

WIDE-GAP SEMICONDUCTOR SUBSTRATE, APPARATUS FOR MANUFACTURING WIDE-...

WAFER PROCESSING METHOD

SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...

LAMINATION WAFERS AND METHOD OF PRODUCING BONDED WAFERS USING THE SAME

METHOD OF POROSIFYING PART OF A SEMICONDUCTOR WAFER