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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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Making porous regions on the surface
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Patents Grants
last 30 patents
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Patent Grant
Wafer processing method
Patent number
12,315,716
Issue date
May 27, 2025
Disco Corporation
Shunichiro Hirosawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for cutting substrate wafer from indium phosphide crystal bar
Patent number
12,285,819
Issue date
Apr 29, 2025
THE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
Yanlei Shi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Non-planar semiconductor packaging systems and related methods
Patent number
12,272,572
Issue date
Apr 8, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information
Patent Grant
Manufacturing and reuse of semiconductor substrates
Patent number
12,249,504
Issue date
Mar 11, 2025
Infineon Technologies AG
Bernhard Goller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for wafer bonding including edge trimming
Patent number
12,237,165
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Company Ltd.
Yung-Lung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming micro interconnect struc...
Patent number
12,230,559
Issue date
Feb 18, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Processing method of workpiece
Patent number
12,191,138
Issue date
Jan 7, 2025
Disco Corporation
Toshio Tsuchiya
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Through-substrate via structure and method of manufacture
Patent number
12,119,294
Issue date
Oct 15, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a composite structure comprising a thin la...
Patent number
12,033,854
Issue date
Jul 9, 2024
Soitec
Yann Sinquin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Crystal efficient SiC device wafer production
Patent number
11,996,330
Issue date
May 28, 2024
II-VI ADVANCED MATERIALS, LLC
Adolf Schöner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor wafer, manufacturing method for semiconductor wafer,...
Patent number
11,984,313
Issue date
May 14, 2024
Kioxia Corporation
Takashi Koike
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer configured to recondition a support surface of a wafer holdin...
Patent number
11,955,368
Issue date
Apr 9, 2024
Imec VZW
Thomas Hantschel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Non-planar semiconductor packaging systems and related methods
Patent number
11,894,245
Issue date
Feb 6, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information
Patent Grant
Semiconductor device with a porous portion, wafer composite and met...
Patent number
11,881,397
Issue date
Jan 23, 2024
Infineon Technologies AG
Iris Moder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer stress control using backside film deposition and laser anneal
Patent number
11,842,911
Issue date
Dec 12, 2023
Yangtze Memory Technologies Co., Ltd.
Pengan Yin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of porosifying part of a semiconductor wafer
Patent number
11,810,779
Issue date
Nov 7, 2023
Infineon Technologies AG
Sophia Friedler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for creating cavities in silicon carbide and other semicondu...
Patent number
11,756,783
Issue date
Sep 12, 2023
HRL Laboratories, LLC
Eric Prophet
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and method of forming micro interconnect struc...
Patent number
11,710,691
Issue date
Jul 25, 2023
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fully automated wafer debonding system and method thereof
Patent number
11,670,524
Issue date
Jun 6, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Cheng-Fei Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through-substrate via structure and method of manufacture
Patent number
11,616,008
Issue date
Mar 28, 2023
Semiconductor Components Industries, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
11,562,897
Issue date
Jan 24, 2023
Renesas Electronics Corporation
Hideki Makiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of electrochemically processing a substrate and integrated c...
Patent number
11,538,689
Issue date
Dec 27, 2022
Universite Catholique De Louvain
Gilles Scheen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with a porous portion, wafer composite and met...
Patent number
11,476,111
Issue date
Oct 18, 2022
Infineon Technologies AG
Iris Moder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for partially removing a semiconductor wafer
Patent number
11,404,262
Issue date
Aug 2, 2022
Infineon Technologies AG
Sophia Friedler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor surface smoothing and semiconductor arrangement
Patent number
11,373,857
Issue date
Jun 28, 2022
Infineon Technologies AG
Bernhard Goller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer polishing method
Patent number
11,342,233
Issue date
May 24, 2022
Disco Corporation
Yasuyuki Takeishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Foam in ion implantation system
Patent number
11,222,768
Issue date
Jan 11, 2022
Varian Semiconductor Equipment Associates, Inc.
James Alan Pixley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Healing method before transfer of a semiconducting layer
Patent number
11,195,711
Issue date
Dec 7, 2021
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Pablo Acosta Alba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
UV laser slicing of β-Ga2O3 by micro-crack generation and propagation
Patent number
11,171,055
Issue date
Nov 9, 2021
The Government of the United States of America, as represented by the Secreta...
Nadeemullah A. Mahadik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Direct growth methods for preparing diamond-assisted heat-dissipati...
Patent number
11,139,176
Issue date
Oct 5, 2021
Harbin Institute of Technology
Bing Dai
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF PROCESSING A SEMICONDUCTOR WAFER
Publication number
20250183031
Publication date
Jun 5, 2025
INFINEON TECHNOLOGIES AG
Bernhard Goller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
Publication number
20250149424
Publication date
May 8, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Francis J. CARNEY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
Publication number
20250149425
Publication date
May 8, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Francis J. CARNEY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE AND MANUFACTURING METHOD THEREOF AS WELL AS SEMICONDUCTOR PACKA...
Publication number
20250125216
Publication date
Apr 17, 2025
ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
YUEH-MING TUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR WAFER TREATMENT
Publication number
20240420946
Publication date
Dec 19, 2024
Hua Hsu Silicon Materials Co., Ltd.
Chiao-Yang Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
N-TYPE DOUBLE-SIDED SOLAR CELL PREPARATION METHOD
Publication number
20240405151
Publication date
Dec 5, 2024
Tongwei Solar (Meishan) Co., Ltd.
Wenzhou XU
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
Publication number
20240297106
Publication date
Sep 5, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PLACING METHOD
Publication number
20240274462
Publication date
Aug 15, 2024
TOKYO ELECTRON LIMITED
Makoto Fujiwara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CRYSTAL EFFICIENT SIC DEVICE WAFER PRODUCTION
Publication number
20240274468
Publication date
Aug 15, 2024
Adolf SCHONER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF PRODUCING GAAS WAFER, AND GAAS WAFER GROUP
Publication number
20240162031
Publication date
May 16, 2024
DOWA ELECTRONICS MATERIALS CO., LTD.
Junji SUGIURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...
Publication number
20240153759
Publication date
May 9, 2024
INFINEON TECHNOLOGIES AG
Iris MODER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NON-PLANAR SEMICONDUCTOR PACKAGING SYSTEMS AND RELATED METHODS
Publication number
20240145266
Publication date
May 2, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. SEDDON
B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information
Patent Application
METHOD FOR PREPARING THE RESIDUE OF A DONOR SUBSTRATE, A LAYER OF W...
Publication number
20240120191
Publication date
Apr 11, 2024
SOITEC
Isabelle Huyet
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
Publication number
20240030021
Publication date
Jan 25, 2024
TOKYO ELECTRON LIMITED
Yohei YAMASHITA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor Featuring Ridged Architecture
Publication number
20240014262
Publication date
Jan 11, 2024
Walter A. Tormasi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrate For Epitaxial Growth, Manufacturing Method of the Same, S...
Publication number
20230411152
Publication date
Dec 21, 2023
FUJIAN JING' AN OPTOELECTRONICS CO., LTD
Bohsiang TSENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
Publication number
20230307343
Publication date
Sep 28, 2023
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Francis J. CARNEY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
Publication number
20230282494
Publication date
Sep 7, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Cheng-Fei Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR DETECTING ANALYTES
Publication number
20230221282
Publication date
Jul 13, 2023
MONASH UNIVERSITY
Rajpreet Singh MINHAS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGING METHOD
Publication number
20230207303
Publication date
Jun 29, 2023
Semiconductor Manufacturing International (Beijing) Corporation
Qingzhao LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASC PROCESS AUTOMATION DEVICE
Publication number
20230154767
Publication date
May 18, 2023
SK SILTRON CO., LTD.
Ho Yong LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20230138616
Publication date
May 4, 2023
Samsung Electronics Co., Ltd.
Minjung Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER STRESS CONTROL USING BACKSIDE FILM DEPOSITION AND LASER ANNEAL
Publication number
20230062866
Publication date
Mar 2, 2023
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
Pengan Yin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230011018
Publication date
Jan 12, 2023
RENESAS ELECTRONICS CORPORATION
Hideki MAKIYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF ADJUSTING WAFER SHAPE USING MULTI-DIRECTIONAL ACTUATION F...
Publication number
20230008350
Publication date
Jan 12, 2023
TOKYO ELECTRON LIMITED
Charlotte CUTLER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIDE-GAP SEMICONDUCTOR SUBSTRATE, APPARATUS FOR MANUFACTURING WIDE-...
Publication number
20220416021
Publication date
Dec 29, 2022
SPP TECHNOLOGIES CO., LTD.
Takashi YAMAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER PROCESSING METHOD
Publication number
20220392762
Publication date
Dec 8, 2022
Disco Corporation
Shunichiro HIROSAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...
Publication number
20220359194
Publication date
Nov 10, 2022
INFINEON TECHNOLOGIES AG
Iris MODER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LAMINATION WAFERS AND METHOD OF PRODUCING BONDED WAFERS USING THE SAME
Publication number
20220319835
Publication date
Oct 6, 2022
GlobalWafers Japan Co., Ltd.
Tatsuhiko AOKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF POROSIFYING PART OF A SEMICONDUCTOR WAFER
Publication number
20220310380
Publication date
Sep 29, 2022
Sophia Friedler
H01 - BASIC ELECTRIC ELEMENTS