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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/0203
Making porous regions on the surface
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last 30 patents
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Patent Grant
Wafer configured to recondition a support surface of a wafer holdin...
Patent number
11,955,368
Issue date
Apr 9, 2024
Imec VZW
Thomas Hantschel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Non-planar semiconductor packaging systems and related methods
Patent number
11,894,245
Issue date
Feb 6, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information
Patent Grant
Semiconductor device with a porous portion, wafer composite and met...
Patent number
11,881,397
Issue date
Jan 23, 2024
Infineon Technologies AG
Iris Moder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer stress control using backside film deposition and laser anneal
Patent number
11,842,911
Issue date
Dec 12, 2023
Yangtze Memory Technologies Co., Ltd.
Pengan Yin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of porosifying part of a semiconductor wafer
Patent number
11,810,779
Issue date
Nov 7, 2023
Infineon Technologies AG
Sophia Friedler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for creating cavities in silicon carbide and other semicondu...
Patent number
11,756,783
Issue date
Sep 12, 2023
HRL Laboratories, LLC
Eric Prophet
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and method of forming micro interconnect struc...
Patent number
11,710,691
Issue date
Jul 25, 2023
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fully automated wafer debonding system and method thereof
Patent number
11,670,524
Issue date
Jun 6, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Cheng-Fei Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through-substrate via structure and method of manufacture
Patent number
11,616,008
Issue date
Mar 28, 2023
Semiconductor Components Industries, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
11,562,897
Issue date
Jan 24, 2023
Renesas Electronics Corporation
Hideki Makiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of electrochemically processing a substrate and integrated c...
Patent number
11,538,689
Issue date
Dec 27, 2022
Universite Catholique De Louvain
Gilles Scheen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with a porous portion, wafer composite and met...
Patent number
11,476,111
Issue date
Oct 18, 2022
Infineon Technologies AG
Iris Moder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for partially removing a semiconductor wafer
Patent number
11,404,262
Issue date
Aug 2, 2022
Infineon Technologies AG
Sophia Friedler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor surface smoothing and semiconductor arrangement
Patent number
11,373,857
Issue date
Jun 28, 2022
Infineon Technologies AG
Bernhard Goller
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Wafer polishing method
Patent number
11,342,233
Issue date
May 24, 2022
Disco Corporation
Yasuyuki Takeishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Foam in ion implantation system
Patent number
11,222,768
Issue date
Jan 11, 2022
Varian Semiconductor Equipment Associates, Inc.
James Alan Pixley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Healing method before transfer of a semiconducting layer
Patent number
11,195,711
Issue date
Dec 7, 2021
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Pablo Acosta Alba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
UV laser slicing of β-Ga2O3 by micro-crack generation and propagation
Patent number
11,171,055
Issue date
Nov 9, 2021
The Government of the United States of America, as represented by the Secreta...
Nadeemullah A. Mahadik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Direct growth methods for preparing diamond-assisted heat-dissipati...
Patent number
11,139,176
Issue date
Oct 5, 2021
Harbin Institute of Technology
Bing Dai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Out-of-plane deformable semiconductor substrate, method of making a...
Patent number
11,127,585
Issue date
Sep 21, 2021
King Abdullah University of Science and Technology
Adrián César Cavazos Sepulveda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device and manufacturing met...
Patent number
11,087,971
Issue date
Aug 10, 2021
Taiwan Semiconductor Manufacturing Company Ltd.
Yung-Lung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer with beveled edge region and method for analyzing shape of th...
Patent number
11,056,403
Issue date
Jul 6, 2021
SK SILTRON CO., LTD.
Woo Sung Lee
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Thinned semiconductor wafer
Patent number
11,018,092
Issue date
May 25, 2021
Semiconductor Components Industries, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having high mechanical strength
Patent number
10,991,660
Issue date
Apr 27, 2021
ALPHA ANC OMEGA SEMICONDUCTOR (CAYMAN) LTD.
Long-Ching Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
10,957,607
Issue date
Mar 23, 2021
Taiwan Semiconductor Manufacturing Company Ltd.
Wei-Sheng Yun
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Through-substrate via structure and method of manufacture
Patent number
10,950,534
Issue date
Mar 16, 2021
Semiconductor Components Industries, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming cantilevered protrusion...
Patent number
10,903,154
Issue date
Jan 26, 2021
Semiconductor Components Industries, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silicon carbide single crystal substrate and method for manufacturi...
Patent number
10,872,759
Issue date
Dec 22, 2020
Sumitomo Electric Industries, Ltd.
Kyoko Okita
C30 - CRYSTAL GROWTH
Information
Patent Grant
Controlled residence CMP polishing method
Patent number
10,861,702
Issue date
Dec 8, 2020
Rohm and Haas Electronic Materials CMP Holdings
John Vu Nguyen
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Semiconductor device and method of forming micro interconnect struc...
Patent number
10,825,764
Issue date
Nov 3, 2020
Semiconductor Components Industries, LLC
Francis J. Carney
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Patents Applications
last 30 patents
Information
Patent Application
NON-PLANAR SEMICONDUCTOR PACKAGING SYSTEMS AND RELATED METHODS
Publication number
20240145266
Publication date
May 2, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. SEDDON
B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information
Patent Application
METHOD FOR PREPARING THE RESIDUE OF A DONOR SUBSTRATE, A LAYER OF W...
Publication number
20240120191
Publication date
Apr 11, 2024
SOITEC
Isabelle Huyet
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
Publication number
20240030021
Publication date
Jan 25, 2024
TOKYO ELECTRON LIMITED
Yohei YAMASHITA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor Featuring Ridged Architecture
Publication number
20240014262
Publication date
Jan 11, 2024
Walter A. Tormasi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrate For Epitaxial Growth, Manufacturing Method of the Same, S...
Publication number
20230411152
Publication date
Dec 21, 2023
FUJIAN JING' AN OPTOELECTRONICS CO., LTD
Bohsiang TSENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
Publication number
20230307343
Publication date
Sep 28, 2023
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Francis J. CARNEY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
Publication number
20230282494
Publication date
Sep 7, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Cheng-Fei Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR DETECTING ANALYTES
Publication number
20230221282
Publication date
Jul 13, 2023
MONASH UNIVERSITY
Rajpreet Singh MINHAS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGING METHOD
Publication number
20230207303
Publication date
Jun 29, 2023
Semiconductor Manufacturing International (Beijing) Corporation
Qingzhao LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASC PROCESS AUTOMATION DEVICE
Publication number
20230154767
Publication date
May 18, 2023
SK SILTRON CO., LTD.
Ho Yong LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20230138616
Publication date
May 4, 2023
Samsung Electronics Co., Ltd.
Minjung Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER STRESS CONTROL USING BACKSIDE FILM DEPOSITION AND LASER ANNEAL
Publication number
20230062866
Publication date
Mar 2, 2023
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
Pengan Yin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230011018
Publication date
Jan 12, 2023
RENESAS ELECTRONICS CORPORATION
Hideki MAKIYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF ADJUSTING WAFER SHAPE USING MULTI-DIRECTIONAL ACTUATION F...
Publication number
20230008350
Publication date
Jan 12, 2023
TOKYO ELECTRON LIMITED
Charlotte CUTLER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIDE-GAP SEMICONDUCTOR SUBSTRATE, APPARATUS FOR MANUFACTURING WIDE-...
Publication number
20220416021
Publication date
Dec 29, 2022
SPP TECHNOLOGIES CO., LTD.
Takashi YAMAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER PROCESSING METHOD
Publication number
20220392762
Publication date
Dec 8, 2022
Disco Corporation
Shunichiro HIROSAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...
Publication number
20220359194
Publication date
Nov 10, 2022
INFINEON TECHNOLOGIES AG
Iris MODER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LAMINATION WAFERS AND METHOD OF PRODUCING BONDED WAFERS USING THE SAME
Publication number
20220319835
Publication date
Oct 6, 2022
GlobalWafers Japan Co., Ltd.
Tatsuhiko AOKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF POROSIFYING PART OF A SEMICONDUCTOR WAFER
Publication number
20220310380
Publication date
Sep 29, 2022
Sophia Friedler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN LA...
Publication number
20220270875
Publication date
Aug 25, 2022
SOITEC
Yann Sinquin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CRYSTAL EFFICIENT SIC DEVICE WAFER PRODUCTION
Publication number
20220223476
Publication date
Jul 14, 2022
ASCATRON AB
Adolf SCHÖNER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WAFER, MANUFACTURING METHOD FOR SEMICONDUCTOR WAFER,...
Publication number
20220216051
Publication date
Jul 7, 2022
KIOXIA Corporation
Takashi KOIKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND HOT PLATE
Publication number
20220130666
Publication date
Apr 28, 2022
Fuji Electric Co., Ltd.
Kohichi HASHIMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSING METHOD OF WORKPIECE
Publication number
20220108882
Publication date
Apr 7, 2022
Disco Corporation
Toshio TSUCHIYA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR CUTTING SUBSTRATE WAFER FROM INDIUM PHOSPHIDE CRYSTAL BAR
Publication number
20220072660
Publication date
Mar 10, 2022
THE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
Yanlei SHI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING MET...
Publication number
20210358740
Publication date
Nov 18, 2021
Taiwan Semiconductor Manufacturing company Ltd.
YUNG-LUNG LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NON-PLANAR SEMICONDUCTOR PACKAGING SYSTEMS AND RELATED METHODS
Publication number
20210343555
Publication date
Nov 4, 2021
Semiconductor Components Industries, LLC
Michael J. SEDDON
B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information
Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
Publication number
20210167002
Publication date
Jun 3, 2021
Semiconductor Components Industries, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER POLISHING METHOD
Publication number
20210098316
Publication date
Apr 1, 2021
Disco Corporation
Yasuyuki TAKEISHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WAFER, MANUFACTURING METHOD FOR SEMICONDUCTOR WAFER,...
Publication number
20210066068
Publication date
Mar 4, 2021
Kioxia Corporation
Takashi KOIKE
H01 - BASIC ELECTRIC ELEMENTS