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Manganese [Mn] as principal constituent
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H01L2224/13649
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ELECTRICITY
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Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/13649
Manganese [Mn] as principal constituent
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last 30 patents
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Patent Grant
Semiconductor packages
Patent number
9,698,088
Issue date
Jul 4, 2017
Samsung Electronics Co., Ltd.
Heungkyu Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional (3D) integrated circuit with enhanced copper-to-c...
Patent number
8,546,956
Issue date
Oct 1, 2013
International Business Machines Corporation
Son V. Nguyen
H01 - BASIC ELECTRIC ELEMENTS
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Three-dimensional (3D) integrated circuit with enhanced copper-to-c...
Patent number
8,431,436
Issue date
Apr 30, 2013
International Business Machines Corporation
Son V. Nguyen
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
Publication number
20130200520
Publication date
Aug 8, 2013
International Business Machines Corporation
Son V. Nguyen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
Publication number
20130113106
Publication date
May 9, 2013
International Business Machines Corporation
Son V. Nguyen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGES
Publication number
20120299197
Publication date
Nov 29, 2012
Samsung Electronics Co., Ltd.
Heungkyu KWON
H01 - BASIC ELECTRIC ELEMENTS