Manganese [Mn] as principal constituent

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H01L2224/13649

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13649Manganese [Mn] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages
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- Issue date Jul 4, 2017
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) integrated circuit with enhanced copper-to-c...
- Patent number 8,546,956
- Issue date Oct 1, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) integrated circuit with enhanced copper-to-c...
- Patent number 8,431,436
- Issue date Apr 30, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130200520
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- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130113106
- Publication date May 9, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
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- Publication date Nov 29, 2012
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