Manufacture or treatment of parts

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/48Manufacture or treatment of parts

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Interposers for microelectronic devices
- Patent number 12,230,583
- Issue date Feb 18, 2025
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,230,590
- Issue date Feb 18, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate z-disaggregation with liquid metal interconnects
- Patent number 12,230,564
- Issue date Feb 18, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anodizing method and manufacturing method for an anisotropic conduc...
- Patent number 12,227,863
- Issue date Feb 18, 2025
- FUJIFILM Corporation
- Yoshinori Hotta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor package stress balance structures and related methods
- Patent number 12,230,502
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding device
- Patent number 12,230,511
- Issue date Feb 18, 2025
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to enable 30 microns pitch EMIB or below
- Patent number 12,230,563
- Issue date Feb 18, 2025
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-device graded embedding package substrate and manufacturing m...
- Patent number 12,230,581
- Issue date Feb 18, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Immersion direct cooling modules
- Patent number 12,230,551
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,230,609
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package device
- Patent number 12,230,558
- Issue date Feb 18, 2025
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package, and semiconductor pa...
- Patent number 12,230,580
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic component package including th...
- Patent number 12,230,586
- Issue date Feb 18, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Koo Woong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 12,224,247
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic inductor device and method
- Patent number 12,224,253
- Issue date Feb 11, 2025
- Intel Corporation
- Xin Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adaptive structure for thermal regulation and optimization
- Patent number 12,224,223
- Issue date Feb 11, 2025
- Raytheon Company
- Edward L. Hieb
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Packaged component with composite pin structure and manufacturing m...
- Patent number 12,224,228
- Issue date Feb 11, 2025
- PANJIT INTERNATIONAL INC.
- Yung-Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having cavities at an interface of an encapsul...
- Patent number 12,224,251
- Issue date Feb 11, 2025
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic core inductors in interposer
- Patent number 12,224,252
- Issue date Feb 11, 2025
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnecting method, interconnect device and method for for...
- Patent number 12,224,267
- Issue date Feb 11, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 12,224,180
- Issue date Feb 11, 2025
- Nexperia B.V.
- Ricardo Yandoc
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for low inductance phase switch for inverter fo...
- Patent number 12,225,696
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for adaptive gate driver for inverter for elect...
- Patent number 12,220,992
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,224,183
- Issue date Feb 11, 2025
- Chipbond Technology Corporation
- Shrane-Ning Jenq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with grooved die pad
- Patent number 12,224,229
- Issue date Feb 11, 2025
- Kabushiki Kaisha Toshiba
- Kyo Tanabiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed hybrid bonding structures and methods of forming the same
- Patent number 12,224,261
- Issue date Feb 11, 2025
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-cut lead-frame for integrated circuit (IC) packages
- Patent number 12,224,181
- Issue date Feb 11, 2025
- Texas Instruments Incorporated
- Tiange Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out structure for light-emitting diode (LED) device and lightin...
- Patent number 12,224,182
- Issue date Feb 11, 2025
- Lumileds, LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency package implementing a window frame with edge plati...
- Patent number 12,224,217
- Issue date Feb 11, 2025
- MACOM Technology Solutions Holdings, Inc.
- Richard Wilson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250062174
- Publication date Feb 20, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A COR...
- Publication number 20250062203
- Publication date Feb 20, 2025
- QUALCOMM Incorporated
- Hi Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND WIRING SUBSTRATE INCLUDED IN THE SAME
- Publication number 20250062244
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- KANG JOON LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY STRUCTURE FOR A MULTI-CHIP SEMICONDUCTOR PACKAGE
- Publication number 20250062280
- Publication date Feb 20, 2025
- GENERAL ELECTRIC COMPANY
- Ljubisa D. Stevanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...
- Publication number 20250060676
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20250062298
- Publication date Feb 20, 2025
- JCET Group Co., Ltd.
- Yaojian LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20250062217
- Publication date Feb 20, 2025
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR MANUFACTURING A POWER MODULE
- Publication number 20250062242
- Publication date Feb 20, 2025
- Hitachi Energy Ltd
- Fabian FISCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20250062173
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING A THERMAL CONTACT
- Publication number 20250062179
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062194
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Lung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062199
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH METALLIZATION LAYER(S) THAT INCLUDES AN ADDI...
- Publication number 20250062235
- Publication date Feb 20, 2025
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ASSEMBLING EIC TO PIC TO BUILD AN OPTICAL ENGINE
- Publication number 20250062258
- Publication date Feb 20, 2025
- Avago Technologies International Sales Pte. Limited
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250062188
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250062213
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Gyuho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20250062215
- Publication date Feb 20, 2025
- JCET GROUP CO., LTD.
- Danfeng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250062221
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY HIGH-POWER DENSITY MODULE POWER SUPPLY, PARALLEL COM...
- Publication number 20250062243
- Publication date Feb 20, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD...
- Publication number 20250059347
- Publication date Feb 20, 2025
- FUJIFILM CORPORATION
- Kazuya OOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250062204
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Zuo Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
- Publication number 20250062263
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250054853
- Publication date Feb 13, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyun Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAVILY DOPED SEMICONDUCTOR DEVICES FOR POWER DISTRIBUTION
- Publication number 20250054854
- Publication date Feb 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER ASSEMBLY AND METHOD FOR MAKING A SEMICONDUCTOR ASSEMBLY
- Publication number 20250054819
- Publication date Feb 13, 2025
- Intel Corporation
- Seok Ling LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250054828
- Publication date Feb 13, 2025
- Siliconware Precision Industries Co., Ltd.
- Wei-Shen HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE, METHOD FOR MANUFA...
- Publication number 20250054830
- Publication date Feb 13, 2025
- Mitsubishi Electric Corporation
- Riki KAJIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20250054774
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Hyeyeong Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
- Publication number 20250054775
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN
- Publication number 20250054839
- Publication date Feb 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yushuang YAO
- H01 - BASIC ELECTRIC ELEMENTS

Manufacture or treatment of parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interposers for microelectronic devices

Electronic package and manufacturing method thereof

Package substrate z-disaggregation with liquid metal interconnects

Anodizing method and manufacturing method for an anisotropic conduc...

Semiconductor package stress balance structures and related methods

Method of manufacturing semiconductor devices and corresponding device

Method to enable 30 microns pitch EMIB or below

Multi-device graded embedding package substrate and manufacturing m...

Immersion direct cooling modules

Semiconductor device and method of forming micro interconnect struc...

Semiconductor packages

Package device

Method of manufacturing semiconductor package, and semiconductor pa...

Printed circuit board and electronic component package including th...

Fan-out package having a main die and a dummy die

Magnetic inductor device and method

Adaptive structure for thermal regulation and optimization

Packaged component with composite pin structure and manufacturing m...

Semiconductor device having cavities at an interface of an encapsul...

Magnetic core inductors in interposer

Chip interconnecting method, interconnect device and method for for...

Semiconductor device and a method of manufacturing a semiconductor...

Systems and methods for low inductance phase switch for inverter fo...

Systems and methods for adaptive gate driver for inverter for elect...

Method of manufacturing semiconductor device

Semiconductor device with grooved die pad

Mixed hybrid bonding structures and methods of forming the same

Laser-cut lead-frame for integrated circuit (IC) packages

Fan out structure for light-emitting diode (LED) device and lightin...

Radio frequency package implementing a window frame with edge plati...

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A COR...

SEMICONDUCTOR PACKAGE AND WIRING SUBSTRATE INCLUDED IN THE SAME

POWER OVERLAY STRUCTURE FOR A MULTI-CHIP SEMICONDUCTOR PACKAGE

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

POWER MODULE AND METHOD FOR MANUFACTURING A POWER MODULE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING A THERMAL CONTACT

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PACKAGE SUBSTRATE WITH METALLIZATION LAYER(S) THAT INCLUDES AN ADDI...

METHOD FOR ASSEMBLING EIC TO PIC TO BUILD AN OPTICAL ENGINE

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

HIGH-FREQUENCY HIGH-POWER DENSITY MODULE POWER SUPPLY, PARALLEL COM...

RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD...

INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...

SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

HEAVILY DOPED SEMICONDUCTOR DEVICES FOR POWER DISTRIBUTION

STIFFENER ASSEMBLY AND METHOD FOR MAKING A SEMICONDUCTOR ASSEMBLY

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE, METHOD FOR MANUFA...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS

POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN