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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/48
Manufacture or treatment of parts
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Patents Grants
last 30 patents
Information
Patent Grant
Method for forming a semiconductor package structure
Patent number
11,978,698
Issue date
May 7, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Zengyan Fan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and formation method of package containing chip structure...
Patent number
11,978,722
Issue date
May 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Offset interposers for large-bottom packages and large-die package-...
Patent number
11,978,730
Issue date
May 7, 2024
Intel Corporation
Russell K. Mortensen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device multilevel package substrate for improved electro...
Patent number
11,978,699
Issue date
May 7, 2024
Texas Instruments Incorporated
Sylvester Ankamah-Kusi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die with embedded communication cavity
Patent number
11,978,948
Issue date
May 7, 2024
Intel Corporation
Vijay K. Nair
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
11,978,695
Issue date
May 7, 2024
Samsung Electronics Co., Ltd.
Sang-uk Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Encapsulated package including device dies connected via interconne...
Patent number
11,978,714
Issue date
May 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Kuo-Chiang Ting
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and formation method of chip package with protective lid
Patent number
11,978,715
Issue date
May 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Meng-Tsung Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package device with dedicated heat-dissipation featur...
Patent number
11,972,998
Issue date
Apr 30, 2024
Shunsin Technology (Zhong Shan) Limited
Shun-Hsing Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor package including correctin...
Patent number
11,972,966
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Gyujin Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Self-aligned contact openings for backside through substrate vias
Patent number
11,973,006
Issue date
Apr 30, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Jeffrey Peter Gambino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate having porous dielectric layer
Patent number
11,973,017
Issue date
Apr 30, 2024
Texas Instruments Incorporated
Jaimal Mallory Williamson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,973,037
Issue date
Apr 30, 2024
Powertech Technology Inc.
Shang-Yu Chang Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,973,042
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Jingu Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
11,973,001
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composite substrate and method for manufacturing same, and circuit...
Patent number
11,973,002
Issue date
Apr 30, 2024
DENKA COMPANY LIMITED
Atsushi Sakai
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Chip packaging method and chip package unit
Patent number
11,973,010
Issue date
Apr 30, 2024
Richtek Technology Corporation
Hao-Lin Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module with semiconductor packages mounted on metal frame
Patent number
11,973,012
Issue date
Apr 30, 2024
Infineon Technologies Austria AG
Andreas Grassmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing substrate structure with filling material f...
Patent number
11,973,014
Issue date
Apr 30, 2024
Siliconware Precision Industries Co., Ltd.
Chang-Fu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and method of manufacturing the same
Patent number
11,973,039
Issue date
Apr 30, 2024
Advanced Semiconductor Engineering, Inc.
Chia-Hao Sung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chiplet first architecture for die tiling applications
Patent number
11,973,041
Issue date
Apr 30, 2024
Intel Corporation
Srinivas Pietambaram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stud bump for wirebonding high voltage isolation barrier connection
Patent number
11,973,052
Issue date
Apr 30, 2024
Texas Instruments Incorporated
Chien-Chang Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure with improved antenna patterns performance
Patent number
11,973,038
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Fang-Yu Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer with warpage-relief trenches
Patent number
11,973,040
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Tsung-Yang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silica-containing substrates with vias having an axially variable s...
Patent number
11,972,993
Issue date
Apr 30, 2024
Corning Incorporated
Rachel Eileen Dahlberg
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package
Patent number
11,967,549
Issue date
Apr 23, 2024
Samsung Electronics Co., Ltd.
Jung Ho Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer stacking structure and manufacturing method thereof
Patent number
11,967,558
Issue date
Apr 23, 2024
Powerchip Semiconductor Manufacturing Corporation
Shou-Zen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Info packages including thermal dissipation blocks
Patent number
11,967,591
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Yu-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tie bar removal for semiconductor device packaging
Patent number
11,967,507
Issue date
Apr 23, 2024
NXP USA, INC.
Richard Te Gan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Giga interposer integration through Chip-On-Wafer-On-Substrate
Patent number
11,967,546
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
FAN-OUT PACKAGING FOR A MULTICHIP PACKAGE
Publication number
20240145457
Publication date
May 2, 2024
Micron Technology, Inc.
Faxing CHE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC INTERCONNECT AND METHOD OF FORMING THE SAME
Publication number
20240145365
Publication date
May 2, 2024
Intel Corporation
Bok Eng CHEAH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC ASSEMBLY WITH POWER MODULE INTERPOSER AND METHODS OF FOR...
Publication number
20240145368
Publication date
May 2, 2024
Intel Corporation
Jackson Chung Peng KONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING BODY, MOUNTING SUBSTRATE, WIRING-EQUIPPED WIRING TRANSFER PL...
Publication number
20240145374
Publication date
May 2, 2024
Panasonic Intellectual Property Management Co., Ltd.
Takayoshi NIRENGI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
Publication number
20240145384
Publication date
May 2, 2024
Micron Technology, Inc.
Akira Kaneko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20240145322
Publication date
May 2, 2024
Medtronic, Inc.
Chunho KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package with Heat Dissipation Structure and Method for Forming the...
Publication number
20240145342
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Tung-Liang Shao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE EDGE PASSIVE COMPONENT ARRAY FOR IMPROVED POWER INTEGRITY
Publication number
20240145450
Publication date
May 2, 2024
Intel Corporation
Chin Lee KUAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
Publication number
20240145361
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
WONBIN SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240145396
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Sehoon JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240145397
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Jeongho LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE DIMENSIONAL INTEGRATED CIRCUIT WITH INTERCONNECT NETWORK LAYER
Publication number
20240145459
Publication date
May 2, 2024
Silicon Genesis Corporation
Michael I. CURRENT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240145350
Publication date
May 2, 2024
MEDIATEK INC.
Pu-Shan HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
Publication number
20240145356
Publication date
May 2, 2024
DAI NIPPON PRINTING CO., LTD.
Masahiro NAGATA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND ASSOCIATED METHODS WITH SOLDER MASK OPEN...
Publication number
20240145405
Publication date
May 2, 2024
Micron Technology, Inc.
Avishesh Dhakal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERFACE INTERCONNECT STRUCTURE FOR EFFICIENT HEAT DISSIPATION OF...
Publication number
20240145336
Publication date
May 2, 2024
DALIAN UNIVERSITY OF TECHNOLOGY
Mingliang Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
Publication number
20240145351
Publication date
May 2, 2024
STMicroelectronics S.r.l
Matteo DE SANTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING SUCH SEMICONDUC...
Publication number
20240145354
Publication date
May 2, 2024
NEXPERIA B.V.
Arnel Taduran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER POWER CORRIDOR
Publication number
20240145394
Publication date
May 2, 2024
Intel Corporation
Poh Boon KHOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240136271
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
KEUNYOUNG LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20240136293
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE
Publication number
20240136299
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Device and Chip Packaging Method
Publication number
20240136304
Publication date
Apr 25, 2024
Honor Device Co., Ltd.
Xueping Guo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED HIGH VOLTAGE MOSFET DEVICE WITH CONNECTION CLIP AND MANUFA...
Publication number
20240136260
Publication date
Apr 25, 2024
STMicroelectronics S.r.l.
Cristiano Gianluca STELLA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT SUBSTRATE, METHOD OF MAKING THE SAME, AND SEMICONDUCTO...
Publication number
20240136265
Publication date
Apr 25, 2024
Shinko Electric Industries Co., Ltd.
Kei MURAYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY
Publication number
20240136270
Publication date
Apr 25, 2024
International Business Machines Corporation
Francesco PREDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES
Publication number
20240136272
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Eunsu Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
Publication number
20240136292
Publication date
Apr 25, 2024
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240136201
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Yuseon HEO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMMON LEAD FRAME, SEMICONDUCTOR DEVICE, METHOD FOR FORMING A COMMO...
Publication number
20240136258
Publication date
Apr 25, 2024
RENESAS ELECTRONICS CORPORATION
Junichi NITA
H01 - BASIC ELECTRIC ELEMENTS