manufactured by mounting on or connecting to patterned circuits before or during embedding

Industry

CPC
H05K1/186

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/186manufactured by mounting on or connecting to patterned circuits before or during embedding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board with bridge chiplets
- Patent number 12,238,872
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing component embedded circuit board
- Patent number 12,238,871
- Issue date Feb 25, 2025
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Yong-Chao Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and power module
- Patent number 12,217,899
- Issue date Feb 4, 2025
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board and package substrate including same
- Patent number 12,211,781
- Issue date Jan 28, 2025
- LG Innotek Co., Ltd
- Se Woong Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board having embedded component
- Patent number 12,185,478
- Issue date Dec 31, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded circuit board and manufacturing method thereof
- Patent number 12,156,348
- Issue date Nov 26, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding methods for fine-pitch components and corresponding compo...
- Patent number 12,136,580
- Issue date Nov 5, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure and fabrication method thereof
- Patent number 12,133,337
- Issue date Oct 29, 2024
- INNOLUX CORPORATION
- Yi Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and preparation method therefor
- Patent number 12,120,810
- Issue date Oct 15, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed board having improved recognition accuracy
- Patent number 12,108,525
- Issue date Oct 1, 2024
- Yazaki Corporation
- Hidehiko Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and printed circuit board package
- Patent number 12,108,535
- Issue date Oct 1, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kwang Yun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Preventing liquid ingress in a device
- Patent number 12,101,887
- Issue date Sep 24, 2024
- Koninklijke Philips N.V.
- Marinus Arnoldus Martinus Vugts
- F21 - LIGHTING
Information Patent Grant
Component carrier with stack-stack connection for connecting compon...
- Patent number 12,096,555
- Issue date Sep 17, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel molded electronic assemblies with multi-surface conductive co...
- Patent number 12,096,549
- Issue date Sep 17, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,048,088
- Issue date Jul 23, 2024
- GN HEARING A/S
- Thorvaldur Oli Bodvarsson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier comprising at least two components
- Patent number 12,041,721
- Issue date Jul 16, 2024
- AT&S(Chongqing) Company Limited
- Dominik Wilding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabric-mounted components
- Patent number 12,028,982
- Issue date Jul 2, 2024
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded circuit board and manufacturing method thereof
- Patent number 11,991,838
- Issue date May 21, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module
- Patent number 11,942,260
- Issue date Mar 26, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fusing electronic components into three-dimensional objects via add...
- Patent number 11,911,825
- Issue date Feb 27, 2024
- Hewlett-Packard Development Company, L.P.
- Kristopher J. Erickson
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method and system for fabricating cross-layer pattern
- Patent number 11,904,525
- Issue date Feb 20, 2024
- Stratasys Ltd.
- Daniel Dikovsky
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power system
- Patent number 11,881,344
- Issue date Jan 23, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fabric-mounted components
- Patent number 11,864,322
- Issue date Jan 2, 2024
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adapter board, method for manufacturing the same and circuit board...
- Patent number 11,856,702
- Issue date Dec 26, 2023
- SHENNAN CIRCUITS CO., LTD.
- Lixiang Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and package substrate including same
- Patent number 11,842,893
- Issue date Dec 12, 2023
- LG Innotek Co., Ltd
- Se Woong Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and button combinations and methods of making same
- Patent number 11,829,565
- Issue date Nov 28, 2023
- Synaptics Incorporated
- Brett Dunlap
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible electronic structure and method for producing same
- Patent number 11,812,559
- Issue date Nov 7, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Charles Souriau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with buried component and manufacture method thereof
- Patent number 11,792,939
- Issue date Oct 17, 2023
- Unimicron Technology Corp.
- Yu-Shen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with through hole filled with extra plating struc...
- Patent number 11,778,754
- Issue date Oct 3, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Robin Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Component Carrier With Embedded Interposer Laterally Between Electr...
- Publication number 20250071907
- Publication date Feb 27, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
- Publication number 20250056730
- Publication date Feb 13, 2025
- USI Science and Technology (Shenzhen) Co., Ltd.
- MING CHANG TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20250024608
- Publication date Jan 16, 2025
- Innolux Corporation
- Yi Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH EMBEDDED CONDUCTIVE COIN
- Publication number 20250016929
- Publication date Jan 9, 2025
- Microchip Technology Caldicot Limited
- George Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE...
- Publication number 20240373561
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Jung Won PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT MOUNTED ON C...
- Publication number 20240373560
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Seongryul CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT IN A CORE OF...
- Publication number 20240373562
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Seongryul CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240298413
- Publication date Sep 5, 2024
- Nan Ya Printed Circuit Board Corporation
- Cheng-An WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240260197
- Publication date Aug 1, 2024
- IBIDEN CO., LTD.
- Nobuhisa KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CIRCUIT BOARD ASSEMBLIES
- Publication number 20240251507
- Publication date Jul 25, 2024
- Simmonds Precision Products, Inc.
- Jeffrey Ewanchuk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20240234366
- Publication date Jul 11, 2024
- NHK Spring Co., Ltd.
- Ryo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240237221
- Publication date Jul 11, 2024
- IBIDEN CO., LTD.
- Shogo FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power electronic module, power electronic module block, printed cir...
- Publication number 20240222208
- Publication date Jul 4, 2024
- Schweizer Electronic AG
- Thomas GOTTWALD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE AND CONTACT ARRANGEMENT
- Publication number 20240215170
- Publication date Jun 27, 2024
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND APPARATUS
- Publication number 20240194390
- Publication date Jun 13, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240155771
- Publication date May 9, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240147620
- Publication date May 2, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20240136325
- Publication date Apr 25, 2024
- NHK Spring Co., Ltd.
- Ryo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240138071
- Publication date Apr 25, 2024
- IBIDEN CO., LTD.
- Shogo FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240130050
- Publication date Apr 18, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED PACKAGE STRUCTURE, POWER SUPPLY APPARATUS, AND ELECTRONIC...
- Publication number 20240121901
- Publication date Apr 11, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Chunyan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE
- Publication number 20240114623
- Publication date Apr 4, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND POWER MODULE
- Publication number 20240096543
- Publication date Mar 21, 2024
- DELTA ELECTRONICS, INC.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME
- Publication number 20240061537
- Publication date Feb 22, 2024
- SYNAPTICS INCORPORATED
- Brett Dunlap
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20240064901
- Publication date Feb 22, 2024
- Unimicron Technology Corp.
- Yu-Shen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME
- Publication number 20240055340
- Publication date Feb 15, 2024
- LG Innotek Co., Ltd.
- Se Woong NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20240040702
- Publication date Feb 1, 2024
- HITACHI,ASTEMO, LTD.
- Takeshi TOKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabric-Mounted Components
- Publication number 20240032203
- Publication date Jan 25, 2024
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID CIRCULATING COOLING PACKAGE SUBSTRATE AND MANUFACTURING METH...
- Publication number 20230369167
- Publication date Nov 16, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARD-TYPE MEDIUM AND CARD-TYPE MEDIUM MANUFACTURING METHOD
- Publication number 20230359857
- Publication date Nov 9, 2023
- TOPPAN INC.
- Eriko UEHARA
- G06 - COMPUTING CALCULATING COUNTING

manufactured by mounting on or connecting to patterned circuits before or during embedding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board with bridge chiplets

Method for manufacturing component embedded circuit board

Apparatus and power module

Printed circuit board and package substrate including same

Printed circuit board having embedded component

Embedded circuit board and manufacturing method thereof

Embedding methods for fine-pitch components and corresponding compo...

Circuit structure and fabrication method thereof

Circuit board and preparation method therefor

Flexible printed board having improved recognition accuracy

Printed circuit board and printed circuit board package

Preventing liquid ingress in a device

Component carrier with stack-stack connection for connecting compon...

Panel molded electronic assemblies with multi-surface conductive co...

Circuit board

Component carrier comprising at least two components

Fabric-mounted components

Embedded circuit board and manufacturing method thereof

Power module

Fusing electronic components into three-dimensional objects via add...

Method and system for fabricating cross-layer pattern

Structure for embedding and packaging multiple devices by layer and...

Power system

Fabric-mounted components

Adapter board, method for manufacturing the same and circuit board...

Printed circuit board and package substrate including same

Fingerprint sensor and button combinations and methods of making same

Flexible electronic structure and method for producing same

Substrate with buried component and manufacture method thereof

Component carrier with through hole filled with extra plating struc...

Patents Applicationslast 30 patents

Component Carrier With Embedded Interposer Laterally Between Electr...

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

CIRCUIT STRUCTURE

SUBSTRATE WITH EMBEDDED CONDUCTIVE COIN

SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE...

PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT MOUNTED ON C...

PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT IN A CORE OF...

CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME

WIRING SUBSTRATE

ELECTRICAL CIRCUIT BOARD ASSEMBLIES

CIRCUIT BOARD AND MANUFACTURING METHOD

METHOD FOR MANUFACTURING WIRING SUBSTRATE

Power electronic module, power electronic module block, printed cir...

ELECTRONIC MODULE AND CONTACT ARRANGEMENT

POWER MODULE AND APPARATUS

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD

CIRCUIT BOARD AND MANUFACTURING METHOD

METHOD FOR MANUFACTURING WIRING SUBSTRATE

EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

EMBEDDED PACKAGE STRUCTURE, POWER SUPPLY APPARATUS, AND ELECTRONIC...

HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE

APPARATUS AND POWER MODULE

FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME

CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME

POWER SEMICONDUCTOR DEVICE

Fabric-Mounted Components

LIQUID CIRCULATING COOLING PACKAGE SUBSTRATE AND MANUFACTURING METH...

CARD-TYPE MEDIUM AND CARD-TYPE MEDIUM MANUFACTURING METHOD