manufactured by mounting on or connecting to patterned circuits before or during embedding

Industry

CPC
H05K1/186

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/186manufactured by mounting on or connecting to patterned circuits before or during embedding

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power module
- Patent number 11,942,260
- Issue date Mar 26, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fusing electronic components into three-dimensional objects via add...
- Patent number 11,911,825
- Issue date Feb 27, 2024
- Hewlett-Packard Development Company, L.P.
- Kristopher J. Erickson
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method and system for fabricating cross-layer pattern
- Patent number 11,904,525
- Issue date Feb 20, 2024
- Stratasys Ltd.
- Daniel Dikovsky
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power system
- Patent number 11,881,344
- Issue date Jan 23, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fabric-mounted components
- Patent number 11,864,322
- Issue date Jan 2, 2024
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adapter board, method for manufacturing the same and circuit board...
- Patent number 11,856,702
- Issue date Dec 26, 2023
- SHENNAN CIRCUITS CO., LTD.
- Lixiang Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and package substrate including same
- Patent number 11,842,893
- Issue date Dec 12, 2023
- LG Innotek Co., Ltd
- Se Woong Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and button combinations and methods of making same
- Patent number 11,829,565
- Issue date Nov 28, 2023
- Synaptics Incorporated
- Brett Dunlap
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible electronic structure and method for producing same
- Patent number 11,812,559
- Issue date Nov 7, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Charles Souriau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with buried component and manufacture method thereof
- Patent number 11,792,939
- Issue date Oct 17, 2023
- Unimicron Technology Corp.
- Yu-Shen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with through hole filled with extra plating struc...
- Patent number 11,778,754
- Issue date Oct 3, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Robin Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Control device and manufacturing method of control device
- Patent number 11,765,817
- Issue date Sep 19, 2023
- Mitsubishi Electric Corporation
- Yutaka Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate having electric component embedded therein
- Patent number 11,765,833
- Issue date Sep 19, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myeong Hui Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel-molded electronic assemblies
- Patent number 11,751,338
- Issue date Sep 5, 2023
- Vicor Corporation
- Patrizio Vinciarelli
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with a stepped cavity and a stepped component ass...
- Patent number 11,749,573
- Issue date Sep 5, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 11,729,914
- Issue date Aug 15, 2023
- Shinko Electric Industries Co. Ltd.
- Hiroshi Taneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a packaged circuit structure
- Patent number 11,683,888
- Issue date Jun 20, 2023
- Leading Interconnect Semiconductor Technology Qinhuangdao Co, Ltd.
- Chun-Chieh Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure with interconnection between chips and packaging...
- Patent number 11,670,520
- Issue date Jun 6, 2023
- Unimicron Technology Corp.
- Jia Shiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,658,151
- Issue date May 23, 2023
- Fuji Electric Co., Ltd.
- Kenshi Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assembly for use in electronic contact lens
- Patent number 11,656,483
- Issue date May 23, 2023
- Tectus Corporation
- Donald Arthur Ice
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure embedded substrate
- Patent number 11,659,665
- Issue date May 23, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ho Hyung Ham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite part with integral electronic instrumentation circuit and...
- Patent number 11,639,916
- Issue date May 2, 2023
- SAFRAN
- Sabri Janfaoui
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power module and method for delivering power to electronic device
- Patent number 11,626,237
- Issue date Apr 11, 2023
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device
- Patent number 11,605,495
- Issue date Mar 14, 2023
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaged integrated circuit with interposing functionality and meth...
- Patent number 11,605,569
- Issue date Mar 14, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabric-mounted components
- Patent number 11,576,262
- Issue date Feb 7, 2023
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prepregs and laminates having a UV curable resin layer
- Patent number 11,558,962
- Issue date Jan 17, 2023
- Isola USA Corp.
- Roland Schönholz
- B32 - LAYERED PRODUCTS
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,551,989
- Issue date Jan 10, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device module
- Patent number 11,546,996
- Issue date Jan 3, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jung Mok Jang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240147620
- Publication date May 2, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20240136325
- Publication date Apr 25, 2024
- NHK Spring Co., Ltd.
- Ryo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240138071
- Publication date Apr 25, 2024
- IBIDEN CO., LTD.
- Shogo FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240130050
- Publication date Apr 18, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED PACKAGE STRUCTURE, POWER SUPPLY APPARATUS, AND ELECTRONIC...
- Publication number 20240121901
- Publication date Apr 11, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Chunyan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE
- Publication number 20240114623
- Publication date Apr 4, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND POWER MODULE
- Publication number 20240096543
- Publication date Mar 21, 2024
- DELTA ELECTRONICS, INC.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME
- Publication number 20240061537
- Publication date Feb 22, 2024
- SYNAPTICS INCORPORATED
- Brett Dunlap
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20240064901
- Publication date Feb 22, 2024
- Unimicron Technology Corp.
- Yu-Shen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME
- Publication number 20240055340
- Publication date Feb 15, 2024
- LG Innotek Co., Ltd.
- Se Woong NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20240040702
- Publication date Feb 1, 2024
- HITACHI,ASTEMO, LTD.
- Takeshi TOKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabric-Mounted Components
- Publication number 20240032203
- Publication date Jan 25, 2024
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID CIRCULATING COOLING PACKAGE SUBSTRATE AND MANUFACTURING METH...
- Publication number 20230369167
- Publication date Nov 16, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARD-TYPE MEDIUM AND CARD-TYPE MEDIUM MANUFACTURING METHOD
- Publication number 20230359857
- Publication date Nov 9, 2023
- TOPPAN INC.
- Eriko UEHARA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CAPACITOR-WIRE-EMBEDDED WIRING BOARD
- Publication number 20230319998
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- SOOJAE PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier with Stack-Stack Connection for Connecting Compon...
- Publication number 20230300982
- Publication date Sep 21, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20230290716
- Publication date Sep 14, 2023
- LG Innotek Co., Ltd.
- Jae Hun JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20230276576
- Publication date Aug 31, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20230254977
- Publication date Aug 10, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Jonathan Silvano de Sousa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230232527
- Publication date Jul 20, 2023
- Murata Manufacturing Co., Ltd.
- Tadashi NOMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGED CIRCUIT STRUCTURE
- Publication number 20230232537
- Publication date Jul 20, 2023
- Leading Interconnect Semiconductor Technology Qinhuangdao Co., Ltd.
- CHUN-CHIEH HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING ELECTRONIC...
- Publication number 20230225092
- Publication date Jul 13, 2023
- Murata Manufacturing Co., Ltd.
- Toru KOMATSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE
- Publication number 20230217593
- Publication date Jul 6, 2023
- LG Innotek Co., Ltd.
- Il Sik NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabric-Mounted Components
- Publication number 20230189445
- Publication date Jun 15, 2023
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE
- Publication number 20230189429
- Publication date Jun 15, 2023
- Murata Manufacturing Co., Ltd.
- Tadashi NOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...
- Publication number 20230189444
- Publication date Jun 15, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOLERANCE COMPENSATION ELEMENT FOR CIRCUIT CONFIGURATIONS
- Publication number 20230189450
- Publication date Jun 15, 2023
- Siemens Aktiengesellschaft
- Rene BLANK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD PACKAGE
- Publication number 20230171895
- Publication date Jun 1, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Yun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230171890
- Publication date Jun 1, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Jae Woong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20230156907
- Publication date May 18, 2023
- GN Hearing A/S
- Thorvaldur Oli Bodvarsson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

manufactured by mounting on or connecting to patterned circuits before or during embedding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module

Fusing electronic components into three-dimensional objects via add...

Method and system for fabricating cross-layer pattern

Structure for embedding and packaging multiple devices by layer and...

Power system

Fabric-mounted components

Adapter board, method for manufacturing the same and circuit board...

Printed circuit board and package substrate including same

Fingerprint sensor and button combinations and methods of making same

Flexible electronic structure and method for producing same

Substrate with buried component and manufacture method thereof

Component carrier with through hole filled with extra plating struc...

Control device and manufacturing method of control device

Substrate having electric component embedded therein

Panel-molded electronic assemblies

Component carrier with a stepped cavity and a stepped component ass...

Wiring board

Method for manufacturing a packaged circuit structure

Package structure with interconnection between chips and packaging...

Semiconductor device

Electronics assembly for use in electronic contact lens

Connection structure embedded substrate

Composite part with integral electronic instrumentation circuit and...

Power module and method for delivering power to electronic device

Electronic device

Packaged integrated circuit with interposing functionality and meth...

Fabric-mounted components

Prepregs and laminates having a UV curable resin layer

Component carrier and method of manufacturing the same

Electronic device module

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

CIRCUIT BOARD AND MANUFACTURING METHOD

METHOD FOR MANUFACTURING WIRING SUBSTRATE

EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

EMBEDDED PACKAGE STRUCTURE, POWER SUPPLY APPARATUS, AND ELECTRONIC...

HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE

APPARATUS AND POWER MODULE

FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME

CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME

POWER SEMICONDUCTOR DEVICE

Fabric-Mounted Components

LIQUID CIRCULATING COOLING PACKAGE SUBSTRATE AND MANUFACTURING METH...

CARD-TYPE MEDIUM AND CARD-TYPE MEDIUM MANUFACTURING METHOD

CAPACITOR-WIRE-EMBEDDED WIRING BOARD

Component Carrier with Stack-Stack Connection for Connecting Compon...

CIRCUIT BOARD

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

Component Carrier and Method of Manufacturing the Same

ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING THE SAME

PACKAGED CIRCUIT STRUCTURE

ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING ELECTRONIC...

PACKAGE SUBSTRATE

Fabric-Mounted Components

MODULE

STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...

TOLERANCE COMPENSATION ELEMENT FOR CIRCUIT CONFIGURATIONS

PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD PACKAGE

PRINTED CIRCUIT BOARD

CIRCUIT BOARD