Manufacturing methods of high density interconnect preforms

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H01L24/19

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/19Manufacturing methods of high density interconnect preforms

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,211,802
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener package and method of fabricating stiffener package
- Patent number 12,211,705
- Issue date Jan 28, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 12,211,801
- Issue date Jan 28, 2025
- Parabellum Strategic Opportunities Fund LLC
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with shunt and patterned metal trace
- Patent number 12,211,800
- Issue date Jan 28, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic component package including th...
- Patent number 12,211,816
- Issue date Jan 28, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young Kuk Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
- Patent number 12,211,817
- Issue date Jan 28, 2025
- Rohm Co., Ltd.
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,205,854
- Issue date Jan 21, 2025
- Innolux Corporation
- Yeong-E Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,205,903
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and manufacuring method thereof
- Patent number 12,205,934
- Issue date Jan 21, 2025
- Diodes Incorporated
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,199,060
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Changbo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical devices and methods of manufacture
- Patent number 12,199,046
- Issue date Jan 14, 2025
- Faraday Semi, Inc.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package, package-on-package structure, and manuf...
- Patent number 12,198,996
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,199,024
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method
- Patent number 12,199,051
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna apparatus and method
- Patent number 12,191,265
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging semiconduct...
- Patent number 12,191,163
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing electronic component device and laminated film...
- Patent number 12,183,686
- Issue date Dec 31, 2024
- Resonac Corporation
- Tomoaki Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,183,690
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with composite bottle-shaped through...
- Patent number 12,183,705
- Issue date Dec 31, 2024
- NANYA TECHNOLOGY CORPORATION
- Sheng-Hui Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process control for package formation
- Patent number 12,183,728
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 12,183,691
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including antenna
- Patent number 12,183,694
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having bridge structure for connection between se...
- Patent number 12,183,681
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double resist structure for electrodeposition bonding
- Patent number 12,183,708
- Issue date Dec 31, 2024
- International Business Machines Corporation
- Koki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package and method of forming a die package
- Patent number 12,176,283
- Issue date Dec 24, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative photosensitive resin composition, production method for po...
- Patent number 12,174,539
- Issue date Dec 24, 2024
- Asahi Kasei Kabushiki Kaisha
- Takeki Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive with brain-like elasticity and integrality based on sta...
- Patent number 12,176,902
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metal removal for conductive interconnects in integrated...
- Patent number 12,176,214
- Issue date Dec 24, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with photonic die and method
- Patent number 12,176,270
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Heterogeneous Fan-Out Structure and Method of Manufacture
- Publication number 20250038087
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Preparation Method of Chip Package Structure and Package Structure
- Publication number 20250022827
- Publication date Jan 16, 2025
- Guangdong Fozhixin Microelectronics Technology Research Co., Ltd
- Xiangang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH GLASS CORE SUBSTRATE AND METHOD OF FABRI...
- Publication number 20250022859
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH DAISY CHAIN AND A METHOD OF MANUFACTUR...
- Publication number 20250015034
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- TSE-WEI LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING SAME
- Publication number 20250015066
- Publication date Jan 9, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Xiaochen XUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-INTERCONNECT
- Publication number 20250015031
- Publication date Jan 9, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREFORMED UNIT OF FAN-OUT CHIP-EMBEDDED PACKAGING PROCESS AND APPLI...
- Publication number 20250015036
- Publication date Jan 9, 2025
- LINGSEN PRECISION INDUSTRIES, LTD.
- Yu-Chia CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006686
- Publication date Jan 2, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Hun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES
- Publication number 20250006697
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429192
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- CHAJEA JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
- Publication number 20240421131
- Publication date Dec 19, 2024
- Lodestar Licensing Group LLC
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE
- Publication number 20240421096
- Publication date Dec 19, 2024
- VIA TECHNOLOGIES, INC.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240412982
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Method
- Publication number 20240404968
- Publication date Dec 5, 2024
- SHENZHEN SIPTORY TECHNOLOGY CO., LTD
- Dongdong Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL-LEVEL SEMICONDUCTOR PACKAGING METHOD
- Publication number 20240404974
- Publication date Dec 5, 2024
- PEP INNOVATION PTE LTD.
- Munirathinam Senthil Kumar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Multi-Die Package Structures Including Redistribution Layers
- Publication number 20240404992
- Publication date Dec 5, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PROCESS FOR SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240404973
- Publication date Dec 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mohamad Ashraf bin Mohd Arshad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES HAVING SIGNAL ROUTING STRUCTURES AT BONDING INTERFACES
- Publication number 20240404976
- Publication date Dec 5, 2024
- Lodestar Licensing Group LLC
- Akira Goda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING COMPOSITION, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATIN...
- Publication number 20240404898
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia Hao Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404904
- Publication date Dec 5, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UPPER CONDUCTIVE STRUCTURE HAVING MULTILAYER STACK TO DECREASE FABR...
- Publication number 20240404975
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240395725
- Publication date Nov 28, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Myung Jea Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES, PACKAGED SEMICONDUCTOR DEVICES, AND METHOD...
- Publication number 20240395782
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240395791
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240395727
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240395756
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395566
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240395721
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...
- Publication number 20240395792
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20240395757
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS

Manufacturing methods of high density interconnect preforms

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure and method of fabricating the same

Stiffener package and method of fabricating stiffener package

Chip package and method of forming the same

Semiconductor package with shunt and patterned metal trace

Printed circuit board and electronic component package including th...

Semiconductor device and manufacturing method for semiconductor device

Electronic device

Semiconductor package and manufacturing method thereof

Electronic component package and manufacuring method thereof

Semiconductor device and method of fabricating the same

Multi-die package structures including redistribution layers

Electrical devices and methods of manufacture

Integrated fan-out package, package-on-package structure, and manuf...

Semiconductor device and method of manufacture

Integrated circuit structure and method

Antenna apparatus and method

Packaged semiconductor devices and methods of packaging semiconduct...

Method for producing electronic component device and laminated film...

Semiconductor package

Semiconductor device structure with composite bottle-shaped through...

Process control for package formation

Semiconductor structure and method of forming the same

Semiconductor package including antenna

Package structure having bridge structure for connection between se...

Double resist structure for electrodeposition bonding

Die package and method of forming a die package

Negative photosensitive resin composition, production method for po...

Logic drive with brain-like elasticity and integrality based on sta...

Selective metal removal for conductive interconnects in integrated...

Package structure with photonic die and method

Patents Applicationslast 30 patents

Heterogeneous Fan-Out Structure and Method of Manufacture

Preparation Method of Chip Package Structure and Package Structure

SEMICONDUCTOR PACKAGE WITH GLASS CORE SUBSTRATE AND METHOD OF FABRI...

SEMICONDUCTOR STRUCTURE WITH DAISY CHAIN AND A METHOD OF MANUFACTUR...

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING SAME

3D-INTERCONNECT

PREFORMED UNIT OF FAN-OUT CHIP-EMBEDDED PACKAGING PROCESS AND APPLI...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...

MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Packaging Method

PANEL-LEVEL SEMICONDUCTOR PACKAGING METHOD

Multi-Die Package Structures Including Redistribution Layers

WAFER LEVEL PROCESS FOR SEMICONDUCTOR DEVICE PACKAGE

MEMORY DEVICES HAVING SIGNAL ROUTING STRUCTURES AT BONDING INTERFACES

MOLDING COMPOSITION, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATIN...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

UPPER CONDUCTIVE STRUCTURE HAVING MULTILAYER STACK TO DECREASE FABR...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

INTERCONNECT STRUCTURES, PACKAGED SEMICONDUCTOR DEVICES, AND METHOD...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE