Manufacturing methods of high density interconnect preforms

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/19Manufacturing methods of high density interconnect preforms

Industries

Patents Grantslast 30 patents

Information Patent Grant
Stacked via structure
- Patent number 11,973,023
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an upper conductive structure having multilayer...
- Patent number 11,973,050
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,973,037
- Issue date Apr 30, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,973,042
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Jingu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,973,039
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Chia-Hao Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplet first architecture for die tiling applications
- Patent number 11,973,041
- Issue date Apr 30, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with improved antenna patterns performance
- Patent number 11,973,038
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct contact interconnect structure without capture pads a...
- Patent number 11,973,051
- Issue date Apr 30, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 11,967,563
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device and method for fabricating a packaged...
- Patent number 11,967,562
- Issue date Apr 23, 2024
- Infineon Technologies AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabricating method thereof
- Patent number 11,961,867
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,961,789
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna apparatus and method
- Patent number 11,961,809
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a wafer-level chip-scale...
- Patent number 11,961,764
- Issue date Apr 16, 2024
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,961,813
- Issue date Apr 16, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,961,814
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,955,348
- Issue date Apr 9, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
- Patent number 11,955,434
- Issue date Apr 9, 2024
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,953,740
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stacking using chip to wafer bonding
- Patent number 11,955,462
- Issue date Apr 9, 2024
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming vertical interconnect st...
- Patent number 11,955,467
- Issue date Apr 9, 2024
- STATS ChipPAC Pte. Ltd.
- Junghwan Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced info POP and method of forming thereof
- Patent number 11,955,460
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,948,926
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die and package structure
- Patent number 11,948,904
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,948,890
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and method of forming the same
- Patent number 11,948,862
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,464
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,942,433
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package
- Patent number 11,942,434
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Sangkyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,435
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED INTEGRATED CIRCUIT DIES AND INTERCONNECT STRUCTURES
- Publication number 20240145515
- Publication date May 2, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Swarnal BORTHAKUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240145433
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturiing Co., Ltd.
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240145256
- Publication date May 2, 2024
- Resonac Corporation
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240145397
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Jeongho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE
- Publication number 20240136299
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240138071
- Publication date Apr 25, 2024
- IBIDEN CO., LTD.
- Shogo FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
InFO-POP Structures with TIVs Having Cavities
- Publication number 20240136298
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Dp., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
- Publication number 20240128208
- Publication date Apr 18, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128195
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Sangwoong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE RECONSTITUTION AND HIGH-DENSITY INTERCONNECTS FOR EMBEDDED CHIPS
- Publication number 20240128222
- Publication date Apr 18, 2024
- Neuralink Corp.
- Supin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
- Publication number 20240128227
- Publication date Apr 18, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Perceval COUDRAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER PACKAGE AND METHOD OF FABRICATING STIFFENER PACKAGE
- Publication number 20240120211
- Publication date Apr 11, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS FOR MICROELECTRONIC DEVICES
- Publication number 20240120283
- Publication date Apr 11, 2024
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Package with Electrically Isolating Dielectric Liner
- Publication number 20240120248
- Publication date Apr 11, 2024
- INFINEON TECHNOLOGIES AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF AN INTEGRATED CIRCUIT IN A CHIP SCALE BALL GRID ARRAY
- Publication number 20240113062
- Publication date Apr 4, 2024
- Azimuth Industrial Company, Inc.
- David Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Discrete Blocks
- Publication number 20240113080
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240113071
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ACTIVE MOLD PACKAGE AND METHOD THEREFOR
- Publication number 20240105660
- Publication date Mar 28, 2024
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Semiconductor Device and Method
- Publication number 20240105631
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jeng-An Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION METALLIZATION AND METHOD T...
- Publication number 20240105659
- Publication date Mar 28, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE, AND CHIP SYSTEM
- Publication number 20240105678
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240105682
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REINFORCED DIELECTRIC AND METHOD THEREFOR
- Publication number 20240105658
- Publication date Mar 28, 2024
- NXP B.V.
- Tsung Nan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240105662
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Jungho SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240096642
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096760
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240096816
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096851
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Unbyoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE
- Publication number 20240097090
- Publication date Mar 21, 2024
- CORETRONIC CORPORATION
- Ming-Chuan Chih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNEC...
- Publication number 20240096809
- Publication date Mar 21, 2024
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Manufacturing methods of high density interconnect preforms

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked via structure

Method for forming an upper conductive structure having multilayer...

Package structure and manufacturing method thereof

Semiconductor package

Semiconductor device package and method of manufacturing the same

Chiplet first architecture for die tiling applications

Package structure with improved antenna patterns performance

Molded direct contact interconnect structure without capture pads a...

Fan-out package having a main die and a dummy die

Packaged semiconductor device and method for fabricating a packaged...

Electronic device package and fabricating method thereof

Semiconductor package and manufacturing method thereof

Antenna apparatus and method

Semiconductor device and method of making a wafer-level chip-scale...

RF devices with enhanced performance and methods of forming the same

Integrated circuit package and method

RF devices with enhanced performance and methods of forming the same

Ultra small molded module integrated with die by module-on-wafer as...

Package structure

Package stacking using chip to wafer bonding

Semiconductor device and method of forming vertical interconnect st...

Advanced info POP and method of forming thereof

Integrated circuit package and method

Die and package structure

Semiconductor package and method

Package structures and method of forming the same

Semiconductor package and method

Integrated circuit package and method

Method of manufacturing a semiconductor package

Semiconductor package and method

Patents Applicationslast 30 patents

STACKED INTEGRATED CIRCUIT DIES AND INTERCONNECT STRUCTURES

INTEGRATED CIRCUIT PACKAGE AND METHOD

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE

METHOD FOR MANUFACTURING WIRING SUBSTRATE

InFO-POP Structures with TIVs Having Cavities

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...

SEMICONDUCTOR PACKAGE

DIE RECONSTITUTION AND HIGH-DENSITY INTERCONNECTS FOR EMBEDDED CHIPS

SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE

STIFFENER PACKAGE AND METHOD OF FABRICATING STIFFENER PACKAGE

INTERPOSERS FOR MICROELECTRONIC DEVICES

Embedded Package with Electrically Isolating Dielectric Liner

ASSEMBLY OF AN INTEGRATED CIRCUIT IN A CHIP SCALE BALL GRID ARRAY

Semiconductor Device with Discrete Blocks

Integrated Circuit Package and Method

SEMICONDUCTOR DEVICE WITH ACTIVE MOLD PACKAGE AND METHOD THEREFOR

Three-Dimensional Semiconductor Device and Method

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION METALLIZATION AND METHOD T...

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE, AND CHIP SYSTEM

MEMORY PACKAGES AND METHODS OF FORMING SAME

SEMICONDUCTOR DEVICE WITH REINFORCED DIELECTRIC AND METHOD THEREFOR

SEMICONDUCTOR PACKAGE

METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE

MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNEC...