Manufacturing methods

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H01L24/64

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/64Manufacturing methods

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Conductive micro pin
- Patent number 11,101,232
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ying-Jui Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Test structure and manufacturing method therefor
- Patent number 10,600,700
- Issue date Mar 24, 2020
- Semiconductor Manufacturing (Shanghai) International Corporation
- YiPing Mao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Using MEMS fabrication incorporating into LED device mounting and a...
- Patent number 10,403,804
- Issue date Sep 3, 2019
- Epistar Corporation
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 10,383,572
- Issue date Aug 20, 2019
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 10,258,279
- Issue date Apr 16, 2019
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 10,130,302
- Issue date Nov 20, 2018
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 10,096,564
- Issue date Oct 9, 2018
- J-DEVICES CORPORATION
- Toshiyuki Inaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using MEMS fabrication incorporating into LED device mounting and a...
- Patent number 10,026,882
- Issue date Jul 17, 2018
- Epistar Corporation
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing structured sintered connection layers, and sem...
- Patent number 9,887,173
- Issue date Feb 6, 2018
- Robert Bosch GmbH
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level die to package and die to die interconnects suspended o...
- Patent number 9,837,372
- Issue date Dec 5, 2017
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI package and method for making same
- Patent number 9,818,698
- Issue date Nov 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 9,773,751
- Issue date Sep 26, 2017
- International Business Machines Corporation
- John U. Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method of substrate to substrate bonding for three di...
- Patent number 9,418,961
- Issue date Aug 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-transfer structure
- Patent number 9,308,571
- Issue date Apr 12, 2016
- Alcatel Lucent
- Roger Scott Kempers
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Hidden plating traces
- Patent number 9,209,159
- Issue date Dec 8, 2015
- SanDisk Technologies Inc.
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device connection
- Patent number 9,202,838
- Issue date Dec 1, 2015
- Ian Radley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and method of manufacturing the same
- Patent number 9,196,596
- Issue date Nov 24, 2015
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and process for fabricating semiconductor packages
- Patent number 9,165,841
- Issue date Oct 20, 2015
- Intel Corporation
- Thorsten Meyer
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Leadframe system with warp control mechanism and method of manufact...
- Patent number 9,123,712
- Issue date Sep 1, 2015
- Stats Chippac Ltd.
- Byung Tai Do
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device channels
- Patent number 9,105,639
- Issue date Aug 11, 2015
- International Business Machines Corporation
- David H. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device channels
- Patent number 9,099,471
- Issue date Aug 4, 2015
- International Business Machines Corporation
- David H. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 9,087,825
- Issue date Jul 21, 2015
- Macronix International Co., Ltd.
- Hang-Ting Lue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device channels
- Patent number 9,076,848
- Issue date Jul 7, 2015
- International Business Machines Corporation
- David H. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device channels
- Patent number 9,070,751
- Issue date Jun 30, 2015
- International Business Machines Corporation
- David H. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for obtaining three-dimensional actin structures and uses th...
- Patent number 9,070,702
- Issue date Jun 30, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Christophe Gabriel
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Heat-transfer structure
- Patent number 8,963,323
- Issue date Feb 24, 2015
- Alcatel Lucent
- Roger Scott Kempers
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Wafer-level packaged device having self-assembled resilient leads
- Patent number 8,692,367
- Issue date Apr 8, 2014
- Maxim Integrated Products, Inc.
- Chiung C. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package with integrated subst...
- Patent number 8,623,707
- Issue date Jan 7, 2014
- Cisco Technology, Inc.
- Andrew V. Kearney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 8,609,554
- Issue date Dec 17, 2013
- Macronix International Co., Ltd.
- Hang-Ting Lue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method of substrate to substrate bonding for three di...
- Patent number 8,528,802
- Issue date Sep 10, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Dies and Devices with a Coil for Inductive Coupling
- Publication number 20230102133
- Publication date Mar 30, 2023
- Martin OSTERMAYR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MICRO PIN
- Publication number 20190074259
- Publication date Mar 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Jui HUANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING
- Publication number 20180344245
- Publication date Dec 6, 2018
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND A...
- Publication number 20180301609
- Publication date Oct 18, 2018
- EPISTAR CORPORATION
- Guan Ru He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CORRECTING ESTIMATED FORCE OF BONDING APPARATUS
- Publication number 20180164171
- Publication date Jun 14, 2018
- Samsung Electronics Co., Ltd.
- YOUNGHO HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING
- Publication number 20180005982
- Publication date Jan 4, 2018
- International Business Machines Corporation
- John U. Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20170317045
- Publication date Nov 2, 2017
- J-DEVICES CORPORATION
- Toshiyuki INAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING FLEXIBLE LEADS
- Publication number 20150214179
- Publication date Jul 30, 2015
- INFINEON TECHNOLOGIES AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY CONNECTED INTEGRATED CIRCUITS
- Publication number 20150145136
- Publication date May 28, 2015
- Honeywell International Inc.
- Ronald J. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR OBTAINING THREE-DIMENSIONAL ACTIN STRUCTURES AND USES TH...
- Publication number 20150048513
- Publication date Feb 19, 2015
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATVIES
- Jean-Christophe Gabriel
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
EMI Package and Method for Making Same
- Publication number 20150024547
- Publication date Jan 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140367849
- Publication date Dec 18, 2014
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CHANNELS
- Publication number 20140264889
- Publication date Sep 18, 2014
- International Business Machines Corporation
- David H. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CHANNELS
- Publication number 20140264942
- Publication date Sep 18, 2014
- International Business Machines Corporation
- David H. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CHANNELS
- Publication number 20140273440
- Publication date Sep 18, 2014
- International Business Machines Corporation
- David H. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CHANNELS
- Publication number 20140273439
- Publication date Sep 18, 2014
- International Business Machines Corporation
- David H. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PATTERN DESIGN FOR SEMICONDUCTOR DEVICES AND METHOD OF UTILIZI...
- Publication number 20140253137
- Publication date Sep 11, 2014
- MACRONIX INTERNATIONAL CO., LTD.
- Yen Chuang
- G01 - MEASURING TESTING
Information Patent Application
Method for Producing Structured Sintered Connection Layers, and Sem...
- Publication number 20140225274
- Publication date Aug 14, 2014
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND PROCESS FOR FABRICATING SEMICONDUCTOR PACKAGES
- Publication number 20140106507
- Publication date Apr 17, 2014
- Intel Mobile Communications GmbH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method for Manufacturing the Same
- Publication number 20140035140
- Publication date Feb 6, 2014
- Macronix International Co., Ltd.
- Hang-Ting Lue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method of Substrate to Substrate Bonding for Three Di...
- Publication number 20130320071
- Publication date Dec 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTEGRATED SUBSTRATE THERMAL SLUG
- Publication number 20130210196
- Publication date Aug 15, 2013
- Cisco Technology, Inc.
- Andrew V. Kearney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI Package AND METHOD FOR MAKING SAME
- Publication number 20130082364
- Publication date Apr 4, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method for Manufacturing the Same
- Publication number 20120181684
- Publication date Jul 19, 2012
- Macronix International Co., Ltd.
- Hang-Ting Lue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIDDEN PLATING TRACES
- Publication number 20120164828
- Publication date Jun 28, 2012
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTEGRATED SUBSTRATE THERMAL SLUG
- Publication number 20120063096
- Publication date Mar 15, 2012
- Andrew V. Kearney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Connection
- Publication number 20110260279
- Publication date Oct 27, 2011
- Kromek Limited
- Ian Radley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGED DEVICE HAVING SELF-ASSEMBLED RESILIENT LEADS
- Publication number 20110198745
- Publication date Aug 18, 2011
- MAXIM INTEGRATED PRODUCTS, INC.
- Chiung C. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device and method of manufacturing the same
- Publication number 20110042812
- Publication date Feb 24, 2011
- DENSO CORPORATION
- Kimiharu Kayukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING AN ELECTRICALLY CONDUCTING MECHANICAL INTERCONNEC...
- Publication number 20100308473
- Publication date Dec 9, 2010
- Centre Nat De La Recherche Scientifique
- Patrice Simon
- B82 - NANO-TECHNOLOGY

Manufacturing methods

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conductive micro pin

Test structure and manufacturing method therefor

Using MEMS fabrication incorporating into LED device mounting and a...

Via and trench filling using injection molded soldering

Via and trench filling using injection molded soldering

Via and trench filling using injection molded soldering

Manufacturing method of semiconductor package

Using MEMS fabrication incorporating into LED device mounting and a...

Method for producing structured sintered connection layers, and sem...

Wafer-level die to package and die to die interconnects suspended o...

EMI package and method for making same

Via and trench filling using injection molded soldering

Apparatus and method of substrate to substrate bonding for three di...

Heat-transfer structure

Hidden plating traces

Semiconductor device connection

Interposer and method of manufacturing the same

System and process for fabricating semiconductor packages

Leadframe system with warp control mechanism and method of manufact...

Semiconductor device channels

Semiconductor device channels

Semiconductor structure and method for manufacturing the same

Semiconductor device channels

Semiconductor device channels

Method for obtaining three-dimensional actin structures and uses th...

Heat-transfer structure

Wafer-level packaged device having self-assembled resilient leads

Method of fabricating a semiconductor package with integrated subst...

Semiconductor structure and method for manufacturing the same

Apparatus and method of substrate to substrate bonding for three di...

Patents Applicationslast 30 patents

Semiconductor Dies and Devices with a Coil for Inductive Coupling

CONDUCTIVE MICRO PIN

VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING

USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND A...

METHOD OF CORRECTING ESTIMATED FORCE OF BONDING APPARATUS

VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE INCLUDING FLEXIBLE LEADS

VERTICALLY CONNECTED INTEGRATED CIRCUITS

METHOD FOR OBTAINING THREE-DIMENSIONAL ACTIN STRUCTURES AND USES TH...

EMI Package and Method for Making Same

INTERPOSER AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE CHANNELS

SEMICONDUCTOR DEVICE CHANNELS

SEMICONDUCTOR DEVICE CHANNELS

SEMICONDUCTOR DEVICE CHANNELS

TEST PATTERN DESIGN FOR SEMICONDUCTOR DEVICES AND METHOD OF UTILIZI...

Method for Producing Structured Sintered Connection Layers, and Sem...

SYSTEM AND PROCESS FOR FABRICATING SEMICONDUCTOR PACKAGES

Semiconductor Structure and Method for Manufacturing the Same

Apparatus and Method of Substrate to Substrate Bonding for Three Di...

SEMICONDUCTOR PACKAGE WITH INTEGRATED SUBSTRATE THERMAL SLUG

EMI Package AND METHOD FOR MAKING SAME

Semiconductor Structure and Method for Manufacturing the Same

HIDDEN PLATING TRACES

SEMICONDUCTOR PACKAGE WITH INTEGRATED SUBSTRATE THERMAL SLUG

Semiconductor Device Connection

WAFER-LEVEL PACKAGED DEVICE HAVING SELF-ASSEMBLED RESILIENT LEADS

Electronic device and method of manufacturing the same

METHOD FOR MAKING AN ELECTRICALLY CONDUCTING MECHANICAL INTERCONNEC...