Marks applied to semiconductor devices or parts

Industry

CPC
H01L2223/544

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/544Marks applied to semiconductor devices or parts

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Backside metal patterning die singulation system and related methods
- Patent number 12,341,069
- Issue date Jun 24, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin shaping device
- Patent number 12,341,036
- Issue date Jun 24, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy patterns in redundant region of double seal ring
- Patent number 12,341,071
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 12,341,067
- Issue date Jun 24, 2025
- United Microelectronics Corp.
- Meng-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Identification system
- Patent number 12,332,480
- Issue date Jun 17, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Arpan Dasgupta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Physical unclonable function
- Patent number 12,327,798
- Issue date Jun 10, 2025
- International Business Machines Corporation
- Kangguo Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Probe pad with built-in interconnect structure
- Patent number 12,327,770
- Issue date Jun 10, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust mold integrated substrate
- Patent number 12,327,801
- Issue date Jun 10, 2025
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large die wafer, large die and method of forming the same
- Patent number 12,322,707
- Issue date Jun 3, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,322,708
- Issue date Jun 3, 2025
- Renesas Electronics Corporation
- Takehirou Mariko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 12,322,731
- Issue date Jun 3, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate alignment systems and related methods
- Patent number 12,322,632
- Issue date Jun 3, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shifted via-chain electrical-test measurements for hybrid bonding a...
- Patent number 12,322,661
- Issue date Jun 3, 2025
- Tokyo Electron Limited
- Kevin Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and laser marking method
- Patent number 12,322,709
- Issue date Jun 3, 2025
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Kosuke Masuzawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image pickup unit, endoscope, and method of manufacturing image pic...
- Patent number 12,317,629
- Issue date May 27, 2025
- Olympus Medical Systems Corp.
- Junya Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with fuse structure in scribe lane and method of...
- Patent number 12,315,800
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Donghwa Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Wafer positioning method and apparatus
- Patent number 12,315,753
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Cheng Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 12,315,823
- Issue date May 27, 2025
- Kabushiki Kaisha Toshiba
- Yoshiharu Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,315,840
- Issue date May 27, 2025
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting display device
- Patent number 12,317,595
- Issue date May 27, 2025
- LG Display Co., Ltd.
- Hyungju Park
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method for manufacturing display device and apparatus for manufactu...
- Patent number 12,308,259
- Issue date May 20, 2025
- Samsung Display Co., Ltd.
- Dong Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of components onto compact devices using...
- Patent number 12,308,275
- Issue date May 20, 2025
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Overlay mark
- Patent number 12,308,324
- Issue date May 20, 2025
- Winbond Electronics Corp.
- Kuang-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures having a watermark
- Patent number 12,300,627
- Issue date May 13, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Alain Loiseau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Element chip manufacturing method and substrate processing method
- Patent number 12,300,482
- Issue date May 13, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidehiko Karasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bonded semiconductor structure
- Patent number 12,300,660
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit stack verification method and system for perform...
- Patent number 12,293,141
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng Wei Kuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip, processed wafer, and method for manufacturing s...
- Patent number 12,288,720
- Issue date Apr 29, 2025
- Denso Corporation
- Masatake Nagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiled display device
- Patent number 12,288,772
- Issue date Apr 29, 2025
- Samsung Display Co., Ltd.
- Sang Seop Kum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Material processing method and material processing system for perfo...
- Patent number 12,280,445
- Issue date Apr 22, 2025
- Carl Zeiss Microscopy GmbH
- Stephan Hiller
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MODULAR PACKAGE STRUCTURES WITH INTERPOSERS HAVING ALIGNMENT FEATURES
- Publication number 20250192064
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250192065
- Publication date Jun 12, 2025
- Mitsubishi Electric Corporation
- Haruki MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250192029
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Wonkeun CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING ALIGNMENT PATTERN AND MANUFACTURING...
- Publication number 20250192104
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Hung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA
- Publication number 20250192066
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250183168
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR FABRICATION OF INFRARED TRANSPARENT WINDOW...
- Publication number 20250185393
- Publication date Jun 5, 2025
- DRS Network & Imaging Systems, LLC
- Thomas Schimert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM OF OPTICAL NANOSCALE ALIGNMENT
- Publication number 20250183080
- Publication date Jun 5, 2025
- Institut National de la Recherche Scientifique
- Jinyang LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMICON...
- Publication number 20250174473
- Publication date May 29, 2025
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Yoshikuni SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174556
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jitaek OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING STRETCHABLE DISPLAY DEVICE USING SELF-ASSE...
- Publication number 20250176309
- Publication date May 29, 2025
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Doo-Hee CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR PACKA...
- Publication number 20250174571
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Sungwoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Comprising Vertically-Stacked Decks
- Publication number 20250174619
- Publication date May 29, 2025
- Micron Technology, Inc.
- Werner Juengling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174572
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Hyun Ung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR CHIPS HAVING PROTECTED IDENTIFICATION MARKS...
- Publication number 20250174573
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING OVERLAY MARKS
- Publication number 20250167130
- Publication date May 22, 2025
- Micron Technology, Inc.
- Rohit Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER
- Publication number 20250167033
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE AND TRANSISTOR
- Publication number 20250169114
- Publication date May 22, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250167054
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Duckgyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...
- Publication number 20250167065
- Publication date May 22, 2025
- SK HYNIX INC.
- Jun Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER
- Publication number 20250167032
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT PROCESS FOR THE TRANSFER SETUP
- Publication number 20250167053
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SOLDER BALL
- Publication number 20250167128
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A PLURALIT...
- Publication number 20250157922
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS
- Publication number 20250157943
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157942
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jisoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-Emitting Substrate, Backlight Module and Display Device
- Publication number 20250160099
- Publication date May 15, 2025
- Hefei BOE Ruisheng Technology Co., Ltd.
- Kangli Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST JIG, TESTING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR...
- Publication number 20250155490
- Publication date May 15, 2025
- Fuji Electric Co., Ltd.
- Mitsuru YOSHIDA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DICING A SEMICONDUCTOR WAFER STRUCTURE
- Publication number 20250149384
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS

Marks applied to semiconductor devices or parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Backside metal patterning die singulation system and related methods

Resin shaping device

Dummy patterns in redundant region of double seal ring

Manufacturing method of semiconductor device

Identification system

Physical unclonable function

Probe pad with built-in interconnect structure

Robust mold integrated substrate

Large die wafer, large die and method of forming the same

Semiconductor device

Semiconductor package using a coreless signal distribution structure

Substrate alignment systems and related methods

Shifted via-chain electrical-test measurements for hybrid bonding a...

Semiconductor device and laser marking method

Image pickup unit, endoscope, and method of manufacturing image pic...

Semiconductor chip with fuse structure in scribe lane and method of...

Wafer positioning method and apparatus

Semiconductor device

Microelectronic assemblies

Light emitting display device

Method for manufacturing display device and apparatus for manufactu...

Heterogeneous integration of components onto compact devices using...

Overlay mark

Integrated circuit structures having a watermark

Element chip manufacturing method and substrate processing method

Method of forming a bonded semiconductor structure

Integrated circuit stack verification method and system for perform...

Semiconductor chip, processed wafer, and method for manufacturing s...

Tiled display device

Material processing method and material processing system for perfo...

Patents Applicationslast 30 patents

MODULAR PACKAGE STRUCTURES WITH INTERPOSERS HAVING ALIGNMENT FEATURES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE HAVING ALIGNMENT PATTERN AND MANUFACTURING...

SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

METHODS AND SYSTEMS FOR FABRICATION OF INFRARED TRANSPARENT WINDOW...

METHOD AND SYSTEM OF OPTICAL NANOSCALE ALIGNMENT

DICING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMICON...

SEMICONDUCTOR PACKAGE

METHOD FOR MANUFACTURING STRETCHABLE DISPLAY DEVICE USING SELF-ASSE...

INTERPOSER, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR PACKA...

Integrated Assemblies Comprising Vertically-Stacked Decks

SEMICONDUCTOR PACKAGE

PACKAGED SEMICONDUCTOR CHIPS HAVING PROTECTED IDENTIFICATION MARKS...

ELECTRONIC DEVICES COMPRISING OVERLAY MARKS

OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER

COMPOSITE AND TRANSISTOR

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...

OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER

ALIGNMENT PROCESS FOR THE TRANSFER SETUP

SEMICONDUCTOR PACKAGE INCLUDING A SOLDER BALL

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A PLURALIT...

PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS

SEMICONDUCTOR DEVICE

Light-Emitting Substrate, Backlight Module and Display Device

TEST JIG, TESTING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

METHOD FOR DICING A SEMICONDUCTOR WAFER STRUCTURE