Marks applied to semiconductor devices or parts

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H01L2223/544

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/544Marks applied to semiconductor devices or parts

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,211,802
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical measurement tool containing chromatic aberration enhancemen...
- Patent number 12,211,724
- Issue date Jan 28, 2025
- SanDisk Technologies LLC
- Michio Ohi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic component module and method for manufacturing electronic...
- Patent number 12,205,858
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Ryohei Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices
- Patent number 12,207,473
- Issue date Jan 21, 2025
- Lodestar Licensing Group LLC
- Umberto Maria Meotto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,199,093
- Issue date Jan 14, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing device, laser processing system and laser processi...
- Patent number 12,191,168
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Hirotoshi Mori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inspection method
- Patent number 12,191,213
- Issue date Jan 7, 2025
- Disco Corporation
- Naoko Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of semiconductor s...
- Patent number 12,191,263
- Issue date Jan 7, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mengmeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having integral alignment marks with decouplin...
- Patent number 12,191,258
- Issue date Jan 7, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip and manufacturing method therefor, and full-color i...
- Patent number 12,183,868
- Issue date Dec 31, 2024
- FOSHAN NATIONSTAR OPTOELECRONICS CO., LTD.
- Kuai Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated aligned stealth laser for wafer edge trimming process
- Patent number 12,183,571
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and electronic device including the same
- Patent number 12,176,296
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Jung Eun Koo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage contrast metrology mark
- Patent number 12,169,366
- Issue date Dec 17, 2024
- ASML Netherlands B.V.
- Cyrus Emil Tabery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photomask, display device, and manufacturing method thereof
- Patent number 12,170,295
- Issue date Dec 17, 2024
- Samsung Display Co., Ltd.
- Dong Hee Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame reveals with maskless lithography in the manufacture of integ...
- Patent number 12,165,987
- Issue date Dec 10, 2024
- Intel Corporation
- Grant Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including alignment pattern
- Patent number 12,159,842
- Issue date Dec 3, 2024
- Samsung Display Co., Ltd.
- Seungchan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for aligned stitching
- Patent number 12,154,862
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device and mounting method
- Patent number 12,154,811
- Issue date Nov 26, 2024
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of wafer thinning
- Patent number 12,154,783
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 12,154,817
- Issue date Nov 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shift control method in manufacture of semiconductor device
- Patent number 12,148,733
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method of manufacturing the same
- Patent number 12,148,709
- Issue date Nov 19, 2024
- SK hynix Inc.
- Yoo Hyun Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 12,148,630
- Issue date Nov 19, 2024
- Innolux Corporation
- Yeong-E Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligner apparatus
- Patent number 12,148,646
- Issue date Nov 19, 2024
- Kawasaki Jukogyo Kabushiki Kaisha
- Haruhiko Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase etch control in forming three-dimensional memory device
- Patent number 12,142,575
- Issue date Nov 12, 2024
- Yangtza Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,142,576
- Issue date Nov 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,142,574
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
- Patent number 12,142,553
- Issue date Nov 12, 2024
- Intel Corporation
- Arnab Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and method of manufacturing the same, semiconducto...
- Patent number 12,144,120
- Issue date Nov 12, 2024
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038042
- Publication date Jan 30, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038122
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250038123
- Publication date Jan 30, 2025
- SK HYNIX INC.
- Yoo Hyun NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE, LIGHT-EMITTING DIODE CHIPLET AND LIGHT-EMITTI...
- Publication number 20250029934
- Publication date Jan 23, 2025
- XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
- Gong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTO...
- Publication number 20250031315
- Publication date Jan 23, 2025
- DAI NIPPON PRINTING CO., LTD.
- Ryohei KASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seal Ring Structure with Alignment Mark
- Publication number 20250029880
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ling Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING DESIGN ENABLING IN-LINE TESTING OF SILICON BRIDGES FOR S...
- Publication number 20250029908
- Publication date Jan 23, 2025
- Intel Corporation
- Arnab SARKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20250022807
- Publication date Jan 16, 2025
- SK HYNIX INC.
- Joon Seuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING MARK ON SEMICONDUCTOR DEVICE
- Publication number 20250015011
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- LIANG-SHIUAN PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE AND METHOD F...
- Publication number 20250015012
- Publication date Jan 9, 2025
- Macronix International Co., Ltd.
- Chin-Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250014981
- Publication date Jan 9, 2025
- Fuji Electric Co., Ltd.
- Kensuke MATSUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20250015010
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wang Kuo LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MARKING SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING SEM...
- Publication number 20250015013
- Publication date Jan 9, 2025
- Mitsubishi Electric Corporation
- Hiroto MATSUBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EMBEDDED PACKAGE AND METHOD OF FORMING A DIE EMBEDDED PACKAGE
- Publication number 20250015008
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Mahadi-Ul HASSAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLIT FIDUCIALS FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT
- Publication number 20250006651
- Publication date Jan 2, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOALIGNMENT OF SEMICONDUCTOR STRUCTURES USING AN OPAQUE HARDMASK
- Publication number 20250006655
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Shruthi Kumara Vadivel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INTEGRAL ALIGNMENT MARKS WITH DECOUPLIN...
- Publication number 20250006657
- Publication date Jan 2, 2025
- NANYA TECHNOLOGY CORPORATION
- SHING-YIH SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL FUNCTIONING ALIGNMENT AND ETCH BIAS STRUCTURES
- Publication number 20250006649
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Frank Robert Libsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250006544
- Publication date Jan 2, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
FIDUCIALS WITH UNDERLYING DUMMY METALLIZATION FOR INTEGRATED CIRCUI...
- Publication number 20250006652
- Publication date Jan 2, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING
- Publication number 20250006678
- Publication date Jan 2, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MACHINE-READABLE CODE IN INTEGRATED CIRCUIT
- Publication number 20250006650
- Publication date Jan 2, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Alain F. Loiseau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIDUCIALS WITH ASSOCIATED LOW-DENSITY METAL ZONES
- Publication number 20250006653
- Publication date Jan 2, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE INCLUDING OVERLAY MARK STRUCTURE
- Publication number 20250006656
- Publication date Jan 2, 2025
- NANYA TECHNOLOGY CORPORATION
- CHUN-YEN WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DECOUPLING UNIT
- Publication number 20250006627
- Publication date Jan 2, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING TEST PATTERN
- Publication number 20250006654
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Seunghye BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240429218
- Publication date Dec 26, 2024
- SAMSUNG DISPLAY CO., LTD.
- OUKJAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429198
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240429176
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- JU-IL CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240429093
- Publication date Dec 26, 2024
- UNITED MICROELECTRONICS CORP.
- Chien-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS

Marks applied to semiconductor devices or parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure and method of fabricating the same

Optical measurement tool containing chromatic aberration enhancemen...

Electronic component module and method for manufacturing electronic...

Memory devices

3D semiconductor devices and structures with metal layers

Laser processing device, laser processing system and laser processi...

Inspection method

Semiconductor structure and manufacturing method of semiconductor s...

Semiconductor device having integral alignment marks with decouplin...

Integrated chip and manufacturing method therefor, and full-color i...

Integrated aligned stealth laser for wafer edge trimming process

Semiconductor package and electronic device including the same

Metal-free frame design for silicon bridges for semiconductor packages

Voltage contrast metrology mark

Photomask, display device, and manufacturing method thereof

Frame reveals with maskless lithography in the manufacture of integ...

Display device including alignment pattern

System and method for aligned stitching

Mounting device and mounting method

Semiconductor wafer and method of wafer thinning

Methods for producing a 3D semiconductor memory device and structure

Shift control method in manufacture of semiconductor device

Memory device and method of manufacturing the same

Method for manufacturing electronic device

Aligner apparatus

Staircase etch control in forming three-dimensional memory device

Semiconductor package structure and method for manufacturing the same

Semiconductor devices and methods of manufacture

Guard ring design enabling in-line testing of silicon bridges for s...

Wiring structure and method of manufacturing the same, semiconducto...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

LIGHT-EMITTING DIODE, LIGHT-EMITTING DIODE CHIPLET AND LIGHT-EMITTI...

WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTO...

Seal Ring Structure with Alignment Mark

GUARD RING DESIGN ENABLING IN-LINE TESTING OF SILICON BRIDGES FOR S...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

METHOD OF FORMING MARK ON SEMICONDUCTOR DEVICE

SEMICONDUCTOR INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE AND METHOD F...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND FABRICATING METHOD THEREOF

METHOD FOR MARKING SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING SEM...

DIE EMBEDDED PACKAGE AND METHOD OF FORMING A DIE EMBEDDED PACKAGE

SLIT FIDUCIALS FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT

PHOTOALIGNMENT OF SEMICONDUCTOR STRUCTURES USING AN OPAQUE HARDMASK

SEMICONDUCTOR DEVICE HAVING INTEGRAL ALIGNMENT MARKS WITH DECOUPLIN...

DUAL FUNCTIONING ALIGNMENT AND ETCH BIAS STRUCTURES

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

FIDUCIALS WITH UNDERLYING DUMMY METALLIZATION FOR INTEGRATED CIRCUI...

PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING

MACHINE-READABLE CODE IN INTEGRATED CIRCUIT

FIDUCIALS WITH ASSOCIATED LOW-DENSITY METAL ZONES

SEMICONDUCTOR DEVICE STRUCTURE INCLUDING OVERLAY MARK STRUCTURE

SEMICONDUCTOR DEVICE WITH DECOUPLING UNIT

SEMICONDUCTOR DEVICE HAVING TEST PATTERN

DISPLAY DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME