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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05098Material of the additional element

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Patents Grantslast 30 patents

Information Patent Grant
Efficient redistribution layer topology
- Patent number 12,142,586
- Issue date Nov 12, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with slanted conductive...
- Patent number 11,935,850
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structure
- Patent number 11,837,564
- Issue date Dec 5, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to stack structures including passivati...
- Patent number 11,804,460
- Issue date Oct 31, 2023
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with slanted conductive layers and method for...
- Patent number 11,398,441
- Issue date Jul 26, 2022
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient redistribution layer topology
- Patent number 11,380,637
- Issue date Jul 5, 2022
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure for memory device and method of manufacturing...
- Patent number 11,342,292
- Issue date May 24, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack structures in electronic devices including passivation layers...
- Patent number 11,257,774
- Issue date Feb 22, 2022
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving wire bonding strength of an image sensor
- Patent number 11,133,275
- Issue date Sep 28, 2021
- Semiconductor Manufacturing International (Beijing) Corporation
- Yunlong Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of packaging structure
- Patent number 10,950,525
- Issue date Mar 16, 2021
- Semiconductor Manufacturing International (Shanghai) Corporation
- Li Zhong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and fabrication method thereof
- Patent number 10,446,474
- Issue date Oct 15, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Li Zhong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer metal pads
- Patent number 9,887,170
- Issue date Feb 6, 2018
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure with dense via array
- Patent number 9,711,468
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via network structures and method therefor
- Patent number 9,269,617
- Issue date Feb 23, 2016
- NXP B.V.
- Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure with dense via array
- Patent number 9,041,204
- Issue date May 26, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via network structures and method therefor
- Patent number 8,896,124
- Issue date Nov 25, 2014
- NXP B.V.
- Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,736,051
- Issue date May 27, 2014
- Renesas Electronics Corporation
- Tatsuya Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal wiring structures for uniform current density in C4 balls
- Patent number 8,264,078
- Issue date Sep 11, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal wiring structures for uniform current density in C4 balls
- Patent number 8,084,858
- Issue date Dec 27, 2011
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for improving solder bump connections in sem...
- Patent number 7,985,671
- Issue date Jul 26, 2011
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor bonding structure
- Publication number 20230018214
- Publication date Jan 19, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230015243
- Publication date Jan 19, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220375887
- Publication date Nov 24, 2022
- KIOXIA Corporation
- Shinya WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...
- Publication number 20220336396
- Publication date Oct 20, 2022
- Skyworks Solutions, Inc.
- Jiro YOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT REDISTRIBUTION LAYER TOPOLOGY
- Publication number 20220328438
- Publication date Oct 13, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE...
- Publication number 20220093545
- Publication date Mar 24, 2022
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE LAYERS AND METHOD FOR...
- Publication number 20220084967
- Publication date Mar 17, 2022
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT REDISTRIBUTION LAYER TOPOLOGY
- Publication number 20210384150
- Publication date Dec 9, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE FOR MEMORY DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20200411457
- Publication date Dec 31, 2020
- Changxin Memory Technologies, Inc.
- Chih Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Metal Pads
- Publication number 20170317042
- Publication date Nov 2, 2017
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE WITH DENSE VIA ARRAY
- Publication number 20130256893
- Publication date Oct 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130249084
- Publication date Sep 26, 2013
- RENESAS ELECTRONICS CORPORATION
- Tatsuya Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA NETWORK STRUCTURES AND METHOD THEREFOR
- Publication number 20120248623
- Publication date Oct 4, 2012
- Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL WIRING STRUCTURES FOR UNIFORM CURRENT DENSITY IN C4 BALLS
- Publication number 20120080797
- Publication date Apr 5, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA AND FABRICATION METHOD THEREOF
- Publication number 20110260297
- Publication date Oct 27, 2011
- Shian-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL WIRING STRUCTURES FOR UNIFORM CURRENT DENSITY IN C4 BALLS
- Publication number 20100263913
- Publication date Oct 21, 2010
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures and Methods for Improving Solder Bump Connections in Sem...
- Publication number 20100164104
- Publication date Jul 1, 2010
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS

Material of the additional element

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Efficient redistribution layer topology

Method for fabricating semiconductor device with slanted conductive...

Semiconductor bonding structure

Devices and methods related to stack structures including passivati...

Semiconductor device with slanted conductive layers and method for...

Efficient redistribution layer topology

Bonding pad structure for memory device and method of manufacturing...

Stack structures in electronic devices including passivation layers...

Method for improving wire bonding strength of an image sensor

Fabrication method of packaging structure

Packaging structure and fabrication method thereof

Multi-layer metal pads

Bonding pad structure with dense via array

Via network structures and method therefor

Bonding pad structure with dense via array

Via network structures and method therefor

Semiconductor device and manufacturing method thereof

Metal wiring structures for uniform current density in C4 balls

Metal wiring structures for uniform current density in C4 balls

Structures and methods for improving solder bump connections in sem...

Patents Applicationslast 30 patents

Semiconductor bonding structure

DISPLAY DEVICE

SEMICONDUCTOR DEVICE

DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...

EFFICIENT REDISTRIBUTION LAYER TOPOLOGY

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE...

SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE LAYERS AND METHOD FOR...

EFFICIENT REDISTRIBUTION LAYER TOPOLOGY

BONDING PAD STRUCTURE FOR MEMORY DEVICE AND METHOD OF MANUFACTURING...

Multi-Layer Metal Pads

BONDING PAD STRUCTURE WITH DENSE VIA ARRAY

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

VIA NETWORK STRUCTURES AND METHOD THEREFOR

METAL WIRING STRUCTURES FOR UNIFORM CURRENT DENSITY IN C4 BALLS

THROUGH-SUBSTRATE VIA AND FABRICATION METHOD THEREOF

METAL WIRING STRUCTURES FOR UNIFORM CURRENT DENSITY IN C4 BALLS

Structures and Methods for Improving Solder Bump Connections in Sem...