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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/0226Material of the auxiliary member

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die contact structure and method
- Patent number 12,074,127
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly including an airgap containing bonding-level dielec...
- Patent number 11,948,902
- Issue date Apr 2, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method of manufacturing bump structure
- Patent number 11,923,326
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,862,586
- Issue date Jan 2, 2024
- Kioxia Corporation
- Mizuki Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,830,832
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 11,515,272
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 11,488,882
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method of manufacturing bump structure
- Patent number 11,456,266
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,069,591
- Issue date Jul 20, 2021
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,957,664
- Issue date Mar 23, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 10,847,459
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 10,741,467
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a composite barrier layer
- Patent number 10,665,556
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 10,629,554
- Issue date Apr 21, 2020
- Powertech Technology Inc.
- Nan-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device containing and method of providing carbon covered copper layer
- Patent number 10,546,826
- Issue date Jan 28, 2020
- Intel IP Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 10,490,474
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,431,516
- Issue date Oct 1, 2019
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,388,618
- Issue date Aug 20, 2019
- ABLIC INC.
- Takeshi Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,297,562
- Issue date May 21, 2019
- ABLIC INC.
- Kaku Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,249,584
- Issue date Apr 2, 2019
- ABLIC INC.
- Takeshi Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 10,163,785
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,115,689
- Issue date Oct 30, 2018
- TOSHIBA MEMORY CORPORATION
- Taku Kamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite bond structure in stacked semiconductor structure
- Patent number 10,062,656
- Issue date Aug 28, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chao-Ching Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip and integrated circuit wafer with guard ring
- Patent number 10,026,699
- Issue date Jul 17, 2018
- Synaptics Japan GK
- Atsushi Obuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture thereof
- Patent number 9,941,140
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with composite barrier layer under redistri...
- Patent number 9,824,987
- Issue date Nov 21, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging device having plural microstructures disposed proximate t...
- Patent number 9,607,959
- Issue date Mar 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly having a heat spreader for a plurality of die
- Patent number 9,431,380
- Issue date Aug 30, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Tab A. Stephens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 9,093,393
- Issue date Jul 28, 2015
- J-Devices Corporation
- Toru Suda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION
- Publication number 20240339422
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Wei YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
- Publication number 20240258252
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDE AND CARBON LAYERS AT A SURFACE OF A SUBSTRATE FOR HYBRID BONDING
- Publication number 20230187395
- Publication date Jun 15, 2023
- Intel Corporation
- Nafees A. KABIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH SOLDER RESTRAINING WALL
- Publication number 20230106976
- Publication date Apr 6, 2023
- Texas Instruments Incorporated
- John Carlo Cruz Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Contact Structure and Method
- Publication number 20230085696
- Publication date Mar 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230010383
- Publication date Jan 12, 2023
- RENESAS ELECTRONICS CORPORATION
- Takayuki IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY INCLUDING AN AIRGAP CONTAINING BONDING-LEVEL DIELEC...
- Publication number 20230008286
- Publication date Jan 12, 2023
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
- Publication number 20220406741
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220406739
- Publication date Dec 22, 2022
- KIOXIA Corporation
- Mizuki TAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210313245
- Publication date Oct 7, 2021
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210210447
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-JIUN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
- Publication number 20210134746
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Contact Structure and Method
- Publication number 20210074627
- Publication date Mar 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200381378
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-JIUN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE CONTAINING AND METHOD OF PROVIDING CARBON COVERED COPPER LAYER
- Publication number 20200006263
- Publication date Jan 2, 2020
- Intel IP Corporation
- Georg Seidemann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190393116
- Publication date Dec 26, 2019
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190319000
- Publication date Oct 17, 2019
- Powertech Technology Inc.
- Nan-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20190189575
- Publication date Jun 20, 2019
- ABLIC INC.
- Takeshi MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Contact Structure and Method
- Publication number 20190122979
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-on-Interposer Assembly with Dam Structure and Method of Manufac...
- Publication number 20190067148
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20190027453
- Publication date Jan 24, 2019
- Samsung Electronics Co., Ltd.
- YONG HO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20180269170
- Publication date Sep 20, 2018
- ABLIC Inc.
- Kaku IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20180269169
- Publication date Sep 20, 2018
- ABLIC Inc.
- Takeshi MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180233468
- Publication date Aug 16, 2018
- Toshiba Memory Corporation
- Taku KAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180068963
- Publication date Mar 8, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE BOND STRUCTURE IN STACKED SEMICONDUCTOR STRUCTURE
- Publication number 20180047682
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Ching Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE SCALE INTEGRATED CIRCUIT CHIP AND LARGE SCALE INTEGRATED CIRC...
- Publication number 20170278805
- Publication date Sep 28, 2017
- Synaptics Japan GK
- Atsushi OBUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170162463
- Publication date Jun 8, 2017
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20170162541
- Publication date Jun 8, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Contact Structure and Method
- Publication number 20170110424
- Publication date Apr 20, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS

Material of the auxiliary member

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor die contact structure and method

Semiconductor device and method for manufacturing semiconductor device

Bonded assembly including an airgap containing bonding-level dielec...

Bump structure and method of manufacturing bump structure

Semiconductor device and method of manufacturing the same

Semiconductor structure and manufacturing method thereof

Semiconductor die contact structure and method

Die-on-interposer assembly with dam structure and method of manufac...

Bump structure and method of manufacturing bump structure

Semiconductor device and method for manufacturing semiconductor device

Semiconductor structure and manufacturing method thereof

Semiconductor die contact structure and method

Die-on-interposer assembly with dam structure and method of manufac...

Semiconductor structure having a composite barrier layer

Package structure and manufacturing method thereof

Device containing and method of providing carbon covered copper layer

Die-on-interposer assembly with dam structure and method of manufac...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor die contact structure and method

Semiconductor device and method for manufacturing the same

Composite bond structure in stacked semiconductor structure

Integrated circuit chip and integrated circuit wafer with guard ring

Semiconductor devices and methods of manufacture thereof

Semiconductor structure with composite barrier layer under redistri...

Packaging device having plural microstructures disposed proximate t...

Microelectronic assembly having a heat spreader for a plurality of die

Semiconductor device and method for producing the same

Patents Applicationslast 30 patents

SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION

BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE

OXIDE AND CARBON LAYERS AT A SURFACE OF A SUBSTRATE FOR HYBRID BONDING

SEMICONDUCTOR DIE WITH SOLDER RESTRAINING WALL

Semiconductor Die Contact Structure and Method

SEMICONDUCTOR DEVICE

BONDED ASSEMBLY INCLUDING AN AIRGAP CONTAINING BONDING-LEVEL DIELEC...

BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE

Semiconductor Die Contact Structure and Method

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

DEVICE CONTAINING AND METHOD OF PROVIDING CARBON COVERED COPPER LAYER

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

Semiconductor Die Contact Structure and Method

Die-on-Interposer Assembly with Dam Structure and Method of Manufac...

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

COMPOSITE BOND STRUCTURE IN STACKED SEMICONDUCTOR STRUCTURE

LARGE SCALE INTEGRATED CIRCUIT CHIP AND LARGE SCALE INTEGRATED CIRC...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Devices and Methods of Manufacture Thereof

Semiconductor Die Contact Structure and Method