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CPC
H01L2224/75988

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75988Material of the auxiliary member

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,159,856
- Issue date Dec 3, 2024
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering tool for the lower die of a sintering device
- Patent number 10,818,633
- Issue date Oct 27, 2020
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding stage and bonding apparatus comprising the same
- Patent number 10,058,952
- Issue date Aug 28, 2018
- Samsung Electronics Co., Ltd.
- Seung-Dae Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-step direct bonding processes and tools for performing the same
- Patent number 9,521,795
- Issue date Dec 13, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked wafer manufacturing method
- Patent number 8,389,386
- Issue date Mar 5, 2013
- Disco Corporation
- Akihito Kawai
- B24 - GRINDING POLISHING
Information Patent Grant
Mounting method
- Patent number 8,048,254
- Issue date Nov 1, 2011
- Sony Chemical & Information Device Corporation
- Takashi Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for solder-bonding contact pad arrays
- Patent number 5,667,132
- Issue date Sep 16, 1997
- Lucent Technologies Inc.
- Leo Maria Freishyn Chirovsky
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230076668
- Publication date Mar 9, 2023
- KIOXIA Corporation
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Two-Step Direct Bonding Processes and Tools for Performing the Same
- Publication number 20140263583
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED WAFER MANUFACTURING METHOD
- Publication number 20110256667
- Publication date Oct 20, 2011
- Disco Corporation
- Akihito Kawai
- B24 - GRINDING POLISHING
Information Patent Application
Electronic assembly with detachable components
- Publication number 20110228506
- Publication date Sep 22, 2011
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with detachable components
- Publication number 20110222253
- Publication date Sep 15, 2011
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with detachable components
- Publication number 20110223695
- Publication date Sep 15, 2011
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with detachable components
- Publication number 20110222252
- Publication date Sep 15, 2011
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING METHOD
- Publication number 20090038753
- Publication date Feb 12, 2009
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Takashi Matsumura
- B30 - PRESSES

Material of the auxiliary member

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing semiconductor device

Sintering tool for the lower die of a sintering device

Bonding stage and bonding apparatus comprising the same

Two-step direct bonding processes and tools for performing the same

Stacked wafer manufacturing method

Mounting method

Method for solder-bonding contact pad arrays

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Two-Step Direct Bonding Processes and Tools for Performing the Same

STACKED WAFER MANUFACTURING METHOD

Electronic assembly with detachable components

Electronic assembly with detachable components

Electronic assembly with detachable components

Electronic assembly with detachable components

MOUNTING METHOD