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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/164Material

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Patents Grantslast 30 patents

Information Patent Grant
Lid structure and semiconductor device package including the same
- Patent number 11,776,862
- Issue date Oct 3, 2023
- Advanced Semiconductor Engineering, Inc.
- Chun-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising semiconductor die and interposer an...
- Patent number 11,527,496
- Issue date Dec 13, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for bonding package lid
- Patent number 10,879,140
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package with improved thermal performance
- Patent number 10,840,165
- Issue date Nov 17, 2020
- Qorvo US, Inc.
- Jonathan J. Fain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lid structure and semiconductor device package including the same
- Patent number 10,804,173
- Issue date Oct 13, 2020
- Advanced Semiconductor Engineering, Inc.
- Chun-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computing devices with an adhered cover and methods of manufacturin...
- Patent number 10,698,443
- Issue date Jun 30, 2020
- Microsoft Technology Licensing, LLC
- Ryan Travis Evans
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having an encapsulated front side and interpos...
- Patent number 10,679,952
- Issue date Jun 9, 2020
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure having stacked carrier substrates and met...
- Patent number 10,515,887
- Issue date Dec 24, 2019
- Mediatek Inc.
- Shih-Yi Syu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed MEMS device and its fabrication
- Patent number 10,427,932
- Issue date Oct 1, 2019
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for bonding package lid
- Patent number 10,269,668
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package structure and electronic device
- Patent number 10,091,915
- Issue date Oct 2, 2018
- Huawei Technologies Co., Ltd.
- Xuequan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with reinforcement frames, and method...
- Patent number 9,887,166
- Issue date Feb 6, 2018
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package structure and electronic device
- Patent number 9,839,167
- Issue date Dec 5, 2017
- Huawei Technologies Co., Ltd.
- Xuequan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,728,514
- Issue date Aug 8, 2017
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for bonding package lid
- Patent number 9,673,119
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,391,029
- Issue date Jul 12, 2016
- Kabushiki Kaisha Toshiba
- Shinya Hayashiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,391,043
- Issue date Jul 12, 2016
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a base, a cavity, a diaphragm, and a su...
- Patent number 9,363,617
- Issue date Jun 7, 2016
- OMRON Corporation
- Kazuyuki Ono
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit assemblies with reinforcement frames, and method...
- Patent number 9,355,997
- Issue date May 31, 2016
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,048,125
- Issue date Jun 2, 2015
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for smoothing the voltage of the end face of a...
- Patent number 8,912,647
- Issue date Dec 16, 2014
- Kabushiki Kaisha Toshiba
- Kazutaka Takagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip electronic packages and methods of manufacture
- Patent number 8,860,206
- Issue date Oct 14, 2014
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding with metal germanium silicon material
- Patent number 8,592,926
- Issue date Nov 26, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multichip electronic packages and methods of manufacture
- Patent number 8,592,970
- Issue date Nov 26, 2013
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 8,552,544
- Issue date Oct 8, 2013
- Advanced Semiconductor Engineering, Inc.
- Ching-Hong Chuang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate bonding with metal germanium silicon material
- Patent number 8,058,143
- Issue date Nov 15, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230420318
- Publication date Dec 28, 2023
- Fuji Electric Co., Ltd.
- Akira MOROZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230223365
- Publication date Jul 13, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210020591
- Publication date Jan 21, 2021
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Package Structure and Electronic Device
- Publication number 20180049351
- Publication date Feb 15, 2018
- Huawei Technologies Co., Ltd
- Xuequan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140138817
- Publication date May 22, 2014
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE
- Publication number 20140027898
- Publication date Jan 30, 2014
- International Business Machines Corporation
- Kamal K. SIKKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE
- Publication number 20120326294
- Publication date Dec 27, 2012
- International Business Machines Corporation
- KAMAL K. SIKKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PROCESS FOR SENSITIVE MICRO- AND NANO-SYSTEMS
- Publication number 20120321907
- Publication date Dec 20, 2012
- SENSONOR TECHNOLOGIES AS
- Nils Hoivik
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120138954
- Publication date Jun 7, 2012
- Kabushiki Kaisha Toshiba
- Kazutaka TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20120068325
- Publication date Mar 22, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120025363
- Publication date Feb 2, 2012
- Advanced Semiconductor Engineering, Inc.
- Ching-Hong Chuang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110204457
- Publication date Aug 25, 2011
- Omron Corporation
- Kazuyuki Ono
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPOSITE OF AT LEAST TWO SEMICONDUCTOR SUBSTRATES AND A PRODUCTION...
- Publication number 20100308475
- Publication date Dec 9, 2010
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20100181676
- Publication date Jul 22, 2010
- RUBEN B. MONTEZ
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Lid structure and semiconductor device package including the same

Semiconductor device comprising semiconductor die and interposer an...

System and method for bonding package lid

Electronics package with improved thermal performance

Lid structure and semiconductor device package including the same

Computing devices with an adhered cover and methods of manufacturin...

Semiconductor device having an encapsulated front side and interpos...

Fan-out package structure having stacked carrier substrates and met...

Hermetically sealed MEMS device and its fabrication

System and method for bonding package lid

Electronic component package structure and electronic device

Integrated circuit assemblies with reinforcement frames, and method...

Electronic component package structure and electronic device

Semiconductor device and manufacturing method thereof

System and method for bonding package lid

Electronic device

Semiconductor device and manufacturing method thereof

Semiconductor device having a base, a cavity, a diaphragm, and a su...

Integrated circuit assemblies with reinforcement frames, and method...

Semiconductor device and manufacturing method thereof

Semiconductor device for smoothing the voltage of the end face of a...

Multichip electronic packages and methods of manufacture

Substrate bonding with metal germanium silicon material

Multichip electronic packages and methods of manufacture

Package structure

Substrate bonding with metal germanium silicon material

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Electronic Component Package Structure and Electronic Device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE

MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE

BONDING PROCESS FOR SENSITIVE MICRO- AND NANO-SYSTEMS

SEMICONDUCTOR DEVICE

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

COMPOSITE OF AT LEAST TWO SEMICONDUCTOR SUBSTRATES AND A PRODUCTION...

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL