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H01L2224/29099

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29099Material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,136,652
- Issue date Nov 5, 2024
- Sumitomo Electric Industries, Ltd.
- Taku Horii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 11,517,982
- Issue date Dec 6, 2022
- Denso Corporation
- Wataru Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making flexible semiconductor device with graphene tape
- Patent number 11,456,188
- Issue date Sep 27, 2022
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 11,362,014
- Issue date Jun 14, 2022
- Industrial Technology Research Institute
- Chun-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and associated method for manufacturing the...
- Patent number 11,264,304
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,790,208
- Issue date Sep 29, 2020
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connectivity of die to a host substrate
- Patent number 10,707,160
- Issue date Jul 7, 2020
- Infineon Technologies Americas Corp.
- Robert T. Carroll
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Flexible semiconductor device with graphene tape
- Patent number 10,692,802
- Issue date Jun 23, 2020
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and associated method for manufacturing the...
- Patent number 10,622,278
- Issue date Apr 14, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive particle and preparation method thereof, conductive adhe...
- Patent number 10,479,914
- Issue date Nov 19, 2019
- BOE Technology Group Co., Ltd.
- Dezhi Xu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Methods and apparatus for self-alignment of integrated circuit dies
- Patent number 10,431,515
- Issue date Oct 1, 2019
- Marvell World Trade Ltd.
- Long-Ching Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device
- Patent number 10,361,224
- Issue date Jul 23, 2019
- Panasonic Liquid Crystal Display Co., Ltd.
- Yuuichi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,290,556
- Issue date May 14, 2019
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and associated method for manufacturing the...
- Patent number 10,269,679
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 10,115,696
- Issue date Oct 30, 2018
- Innolux Corporation
- Yan-Syun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device comprising a connecting component and method for producing a...
- Patent number 10,046,408
- Issue date Aug 14, 2018
- Osram Opto Semiconductors GmbH
- Barbara Behr
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Graphene based filler material of superior thermal conductivity for...
- Patent number 9,892,994
- Issue date Feb 13, 2018
- STMicroelectronics S.r.l.
- Mario Giovanni Scurati
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Ring structure for chip packaging
- Patent number 9,887,144
- Issue date Feb 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for removing chip
- Patent number 9,881,893
- Issue date Jan 30, 2018
- BOE Technology Group Co., Ltd.
- Guangyuan Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 9,859,180
- Issue date Jan 2, 2018
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming openings in thermally-co...
- Patent number 9,508,626
- Issue date Nov 29, 2016
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a resin-encapsulated semiconductor device
- Patent number 9,431,273
- Issue date Aug 30, 2016
- SII Semiconductor Corporation
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 9,331,055
- Issue date May 3, 2016
- SK Hynix Inc.
- Tae Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor stack packages
- Patent number 9,299,689
- Issue date Mar 29, 2016
- SK Hynix Inc.
- Tac Keun Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device and method of manufacturing...
- Patent number 9,275,972
- Issue date Mar 1, 2016
- Seiko Instruments Inc.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switch mode power converters using magnetically coupled galvanicall...
- Patent number 9,275,946
- Issue date Mar 1, 2016
- Power Integrations, Inc.
- Balu Balakrishnan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
System and method to process horizontally aligned graphite nanofibe...
- Patent number 9,257,359
- Issue date Feb 9, 2016
- International Business Machines Corporation
- Joseph Kuczynski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spot plated leadframe and IC bond pad via array design for copper wire
- Patent number 9,230,928
- Issue date Jan 5, 2016
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for contacting a chip
- Patent number 9,224,086
- Issue date Dec 29, 2015
- Smartrac IP B.V.
- Manfred Rietzler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 9,214,452
- Issue date Dec 15, 2015
- SK Hynix Inc.
- Tae Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240063066
- Publication date Feb 22, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING
- Publication number 20230420438
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tien-Chung YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SEMICONDUCT...
- Publication number 20230122804
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Hyunsu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID EMBEDDED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230052065
- Publication date Feb 16, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED HALF-BRIDGE CIRCUIT
- Publication number 20220293525
- Publication date Sep 15, 2022
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220199778
- Publication date Jun 23, 2022
- Sumitomo Electric Industries, Ltd.
- Taku HORII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20210210407
- Publication date Jul 8, 2021
- Industrial Technology Research Institute
- Chun-Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND ASSOCIATED METHOD FOR MANUFACTURING THE...
- Publication number 20200219788
- Publication date Jul 9, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIN-LIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND ASSOCIATED METHOD FOR MANUFACTURING THE...
- Publication number 20190237385
- Publication date Aug 1, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIN-LIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20190229025
- Publication date Jul 25, 2019
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing electronic device
- Publication number 20190027458
- Publication date Jan 24, 2019
- InnoLux Corporation
- Yan-Syun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20180138144
- Publication date May 17, 2018
- Semiconductor Components Industries, LLC
- Phillip CELAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20180082913
- Publication date Mar 22, 2018
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTIVITY OF DIE TO A HOST SUBSTRATE
- Publication number 20180076124
- Publication date Mar 15, 2018
- Infineon Technologies Americas Corp.
- Robert T. Carroll
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE
- Publication number 20170358525
- Publication date Dec 14, 2017
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20170236761
- Publication date Aug 17, 2017
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR REMOVING CHIP
- Publication number 20170110433
- Publication date Apr 20, 2017
- BOE TECHNOLOGY GROUP CO., LTD.
- Guangyuan Cai
- B32 - LAYERED PRODUCTS
Information Patent Application
CONDUCTIVE PARTICLE AND PREPARATION METHOD THEREOF, CONDUCTIVE ADHE...
- Publication number 20170088752
- Publication date Mar 30, 2017
- BOE TECHNOLOGY GROUP CO., LTD.
- Dezhi XU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20160064360
- Publication date Mar 3, 2016
- SK HYNIX INC.
- Tae Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20150303175
- Publication date Oct 22, 2015
- SK HYNIX INC.
- Tae Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STACK PACKAGES AND METHODS OF FABRICATING THE SAME
- Publication number 20140335656
- Publication date Nov 13, 2014
- Tac Keun OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING GROUNDING MEMBER AND METHOD OF MANUFAC...
- Publication number 20140291821
- Publication date Oct 2, 2014
- Samsung Electronics Co., Ltd.
- In-sang Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE BASED FILLER MATERIAL OF SUPERIOR THERMAL CONDUCTIVITY FOR...
- Publication number 20140287239
- Publication date Sep 25, 2014
- STMicroelectronics S.r.l.
- Mario Giovanni Scurati
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF MAKING PACKAGE WITH INTERPOSER FRAME
- Publication number 20140273355
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALANT LAMINATED COMPOSITE, SEALED SEMICONDUCTOR DEVICES MOUNTING...
- Publication number 20140264956
- Publication date Sep 18, 2014
- Shin-Etsu Chemical Co., Ltd.
- Toshio SHIOBARA
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140252613
- Publication date Sep 11, 2014
- Yoshinori IWAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR ASSEMBLING PHOTOELECTRIC ELEMENT ON SUBSTRATE
- Publication number 20140252072
- Publication date Sep 11, 2014
- CHIH-CHEN LAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20140225239
- Publication date Aug 14, 2014
- Seiko Instruments Inc.
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCH MODE POWER CONVERTERS USING MAGNETICALLY COUPLED GALVANICALL...
- Publication number 20140133186
- Publication date May 15, 2014
- Power Integrations, Inc.
- Balu Balakrishnan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHODS, DEVICES, AND MATERIALS FOR METALLIZATION
- Publication number 20140054776
- Publication date Feb 27, 2014
- LAM RESEARCH CORPORATION
- Artur KOLICS
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Electronic device and method for manufacturing the same

Method of making flexible semiconductor device with graphene tape

Power module

Semiconductor structure and associated method for manufacturing the...

High reliability wafer level semiconductor packaging

Electrical connectivity of die to a host substrate

Flexible semiconductor device with graphene tape

Semiconductor structure and associated method for manufacturing the...

Conductive particle and preparation method thereof, conductive adhe...

Methods and apparatus for self-alignment of integrated circuit dies

Display device

High reliability wafer level semiconductor packaging

Semiconductor structure and associated method for manufacturing the...

Electronic device and method for manufacturing the same

Device comprising a connecting component and method for producing a...

Graphene based filler material of superior thermal conductivity for...

Ring structure for chip packaging

Apparatus for removing chip

High reliability wafer level semiconductor packaging

Semiconductor device and method of forming openings in thermally-co...

Method for manufacturing a resin-encapsulated semiconductor device

Semiconductor package and method for fabricating the same

Methods of fabricating semiconductor stack packages

Resin-encapsulated semiconductor device and method of manufacturing...

Switch mode power converters using magnetically coupled galvanicall...

System and method to process horizontally aligned graphite nanofibe...

Spot plated leadframe and IC bond pad via array design for copper wire

Method for contacting a chip

Semiconductor package and method for fabricating the same

Patents Applicationslast 30 patents

TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES

SEMICONDUCTOR PACKAGING

SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SEMICONDUCT...

HYBRID EMBEDDED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGED HALF-BRIDGE CIRCUIT

SEMICONDUCTOR DEVICE

POWER MODULE

SEMICONDUCTOR STRUCTURE AND ASSOCIATED METHOD FOR MANUFACTURING THE...

SEMICONDUCTOR STRUCTURE AND ASSOCIATED METHOD FOR MANUFACTURING THE...

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

Method for manufacturing electronic device

SEMICONDUCTOR PACKAGES AND RELATED METHODS

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

ELECTRICAL CONNECTIVITY OF DIE TO A HOST SUBSTRATE

FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

APPARATUS FOR REMOVING CHIP

CONDUCTIVE PARTICLE AND PREPARATION METHOD THEREOF, CONDUCTIVE ADHE...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR STACK PACKAGES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE HAVING GROUNDING MEMBER AND METHOD OF MANUFAC...

GRAPHENE BASED FILLER MATERIAL OF SUPERIOR THERMAL CONDUCTIVITY FOR...

METHOD OF MAKING PACKAGE WITH INTERPOSER FRAME

SEALANT LAMINATED COMPOSITE, SEALED SEMICONDUCTOR DEVICES MOUNTING...

SEMICONDUCTOR DEVICE

DEVICE FOR ASSEMBLING PHOTOELECTRIC ELEMENT ON SUBSTRATE

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

SWITCH MODE POWER CONVERTERS USING MAGNETICALLY COUPLED GALVANICALL...

METHODS, DEVICES, AND MATERIALS FOR METALLIZATION