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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/145Material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and preparation methods thereof
- Patent number 12,132,022
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test bumps
- Patent number 12,125,753
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Taehyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 12,119,238
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,119,329
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Eunkyul Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,113,044
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 12,094,831
- Issue date Sep 17, 2024
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,051,639
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for clock signal transmission in integrated circuits and...
- Patent number 12,026,008
- Issue date Jul 2, 2024
- Altera Corporation
- Jeffrey Chromczak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package
- Patent number 11,996,387
- Issue date May 28, 2024
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact routing package for high frequency isolation
- Patent number 11,955,418
- Issue date Apr 9, 2024
- Cypress Semiconductor Corporation
- Chenxi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 11,923,328
- Issue date Mar 5, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsin He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,908,819
- Issue date Feb 20, 2024
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-on-wafer structure and fabrication method
- Patent number 11,876,071
- Issue date Jan 16, 2024
- ZHEJIANG LAB
- Weihao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip and semiconductor package including the same
- Patent number 11,830,840
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Young Jun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct bonding semiconductor components
- Patent number 11,810,892
- Issue date Nov 7, 2023
- Imec VZW
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,769,755
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Eunkyul Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,769,746
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Ae-nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 11,749,535
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing pillar structures on semicond...
- Patent number 11,735,549
- Issue date Aug 22, 2023
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligned core balls for interconnect joint stability
- Patent number 11,735,551
- Issue date Aug 22, 2023
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with angled pillars for decreasing st...
- Patent number 11,721,658
- Issue date Aug 8, 2023
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,705,379
- Issue date Jul 18, 2023
- Samsung Electronics Co., Ltd.
- Chanho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat dissipation layer
- Patent number 11,699,684
- Issue date Jul 11, 2023
- SK hynix Inc.
- Joo Wan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC chip package with dummy solder structure under corner, and relat...
- Patent number 11,682,646
- Issue date Jun 20, 2023
- MARVELL ASIA PTE. LTD.
- Manish Nayini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip
- Patent number 11,676,825
- Issue date Jun 13, 2023
- Murata Manufacturing Co., Ltd.
- Kenichi Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 11,664,320
- Issue date May 30, 2023
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,658,160
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Hyeonjun Song
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20240421098
- Publication date Dec 19, 2024
- Tahoe Research, Ltd.
- Mihir K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
- Publication number 20240395746
- Publication date Nov 28, 2024
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT DEVICE, AND METHOD
- Publication number 20240332236
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shenggao LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH DIRECT BONDING USING NANOTWINNED CO...
- Publication number 20240332237
- Publication date Oct 3, 2024
- Intel Corporation
- Vivek Chidambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240290751
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT ROUTING PACKAGE FOR HIGH FREQUENCY ISOLATION
- Publication number 20240290709
- Publication date Aug 29, 2024
- CYPRESS SEMICONDUCTOR CORPORATION
- Chenxi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...
- Publication number 20240258258
- Publication date Aug 1, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20240250053
- Publication date Jul 25, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsin He HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD...
- Publication number 20240234358
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- JUNHO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234342
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CH...
- Publication number 20240194643
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Youngdeuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Bump Configurations in Circuitry and Methods of Manufacture...
- Publication number 20240178174
- Publication date May 30, 2024
- Anwar Hashmi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20240170380
- Publication date May 23, 2024
- SEIKO EPSON CORPORATION
- Michiyoshi TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136307
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY PACKAGE AND A MEMORY MODULE INCLUDING THE MEMORY PACKAGE
- Publication number 20240119996
- Publication date Apr 11, 2024
- SK HYNIX INC.
- Won Ha CHOI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240047446
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND DRIVE APPARATUS
- Publication number 20240008371
- Publication date Jan 4, 2024
- ASAHI KASEI MICRODEVICES CORPORATION
- Keita OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-ON-WAFER STRUCTURE AND FABRICATION METHOD
- Publication number 20240006372
- Publication date Jan 4, 2024
- ZHEJIANG LAB
- Weihao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240006362
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING
- Publication number 20230402417
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230387083
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- EUNKYUL OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE
- Publication number 20230384367
- Publication date Nov 30, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20230361170
- Publication date Nov 9, 2023
- MURATA MANUFACTURING CO., LTD.
- Fuminori MORISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYER
- Publication number 20230317683
- Publication date Oct 5, 2023
- SK HYNIX INC.
- Joo Wan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...
- Publication number 20230282607
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Ting Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268314
- Publication date Aug 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20230253337
- Publication date Aug 10, 2023
- Tahoe Research, Ltd.
- Mihir K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-YIELDING AND ULTRAFINE PITCH PACKAGES FOR LARGE-SCALE IC OR AD...
- Publication number 20230238345
- Publication date Jul 27, 2023
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230223368
- Publication date Jul 13, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230207532
- Publication date Jun 29, 2023
- Samsung Electronics Co., Ltd.
- Joonho JUN
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device assembly with die support structures

Semiconductor devices and preparation methods thereof

Semiconductor package including test bumps

Semiconductor bonding structures and methods

Semiconductor package and method of fabricating the same

Semiconductor package and manufacturing method thereof

High density interconnect device and method

Semiconductor device assembly with surface-mount die support struct...

Package structure and manufacturing method thereof

Chip package structure

Techniques for clock signal transmission in integrated circuits and...

Semiconductor package

Compact routing package for high frequency isolation

Semiconductor device and semiconductor package

Semiconductor packaging substrate fine pitch metal bump and reinfor...

System-on-wafer structure and fabrication method

Integrated chip and semiconductor package including the same

Method of direct bonding semiconductor components

Semiconductor package and method of fabricating the same

Semiconductor package

Semiconductor bonding structures and methods

Methods and systems for manufacturing pillar structures on semicond...

Aligned core balls for interconnect joint stability

Semiconductor device packages with angled pillars for decreasing st...

Semiconductor packages

Semiconductor package including heat dissipation layer

IC chip package with dummy solder structure under corner, and relat...

Semiconductor chip

High density interconnect device and method

Semiconductor package and method of manufacturing the same

Patents Applicationslast 30 patents

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER

SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT DEVICE, AND METHOD

MICROELECTRONIC ASSEMBLIES WITH DIRECT BONDING USING NANOTWINNED CO...

SEMICONDUCTOR PACKAGE

COMPACT ROUTING PACKAGE FOR HIGH FREQUENCY ISOLATION

SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CH...

Solder Bump Configurations in Circuitry and Methods of Manufacture...

Semiconductor Package

SEMICONDUCTOR PACKAGE

MEMORY PACKAGE AND A MEMORY MODULE INCLUDING THE MEMORY PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE AND DRIVE APPARATUS

SYSTEM-ON-WAFER STRUCTURE AND FABRICATION METHOD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYER

METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS R...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

HIGH-YIELDING AND ULTRAFINE PITCH PACKAGES FOR LARGE-SCALE IC OR AD...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES