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  • H01L2224/78321
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78321Material
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wedge bonding component
    • Patent number 10,147,701
    • Issue date Dec 4, 2018
    • KYOCERA Corporation
    • Hidekazu Shigeyoshi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Ultrasonic bonding systems and methods of using the same
    • Patent number 8,746,537
    • Issue date Jun 10, 2014
    • Orthodyne Electronics Corporation
    • Christoph B. Luechinger
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    WEDGE BONDING COMPONENT
    • Publication number 20180019224
    • Publication date Jan 18, 2018
    • Kyocera Corporation
    • Hidekazu Shigeyoshi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME
    • Publication number 20140048584
    • Publication date Feb 20, 2014
    • Orthodyne Electronics Corporation
    • Christoph B. Luechinger
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR