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H01L2224/78321

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Wedge bonding component
- Patent number 10,147,701
- Issue date Dec 4, 2018
- KYOCERA Corporation
- Hidekazu Shigeyoshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding systems and methods of using the same
- Patent number 8,746,537
- Issue date Jun 10, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WEDGE BONDING COMPONENT
- Publication number 20180019224
- Publication date Jan 18, 2018
- Kyocera Corporation
- Hidekazu Shigeyoshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME
- Publication number 20140048584
- Publication date Feb 20, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR