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H01L2224/83379

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83379Material

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Patents Grantslast 30 patents

Information Patent Grant
Methods for bonding substrates
- Patent number 11,309,278
- Issue date Apr 19, 2022
- Applied Materials, Inc.
- Prayudi Lianto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,032,758
- Issue date Jul 24, 2018
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress bonding of silicon or germanium parts
- Patent number 9,892,920
- Issue date Feb 13, 2018
- Lam Research Corporation
- Jihong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of a stack of electronic devices
- Patent number 9,786,658
- Issue date Oct 10, 2017
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Benoit Mathieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,099,425
- Issue date Aug 4, 2015
- Kabushiki Kaisha Toshiba
- Keiichi Matsushita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to reduce cracking in flip chip underfill
- Patent number 7,919,356
- Issue date Apr 5, 2011
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming nano-coatings for improved adhesion between firs...
- Patent number 7,781,260
- Issue date Aug 24, 2010
- Intel Corporation
- Sandeep Sane
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL
- Publication number 20230378124
- Publication date Nov 23, 2023
- Intel Corporation
- Frederick Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Protective Layer
- Publication number 20230260949
- Publication date Aug 17, 2023
- Western Digital Technologies, Inc.
- Joyce Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL, LAYER STRUCTURE, CHIP PACKAGE, METHOD OF FORMING A...
- Publication number 20230095749
- Publication date Mar 30, 2023
- Alexander Heinrich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR BONDING SUBSTRATES
- Publication number 20200135690
- Publication date Apr 30, 2020
- Applied Materials, Inc.
- PRAYUDI LIANTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180308831
- Publication date Oct 25, 2018
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170263595
- Publication date Sep 14, 2017
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF A STACK OF ELECTRONIC DEVICES
- Publication number 20170179114
- Publication date Jun 22, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Benoit MATHIEU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150069597
- Publication date Mar 12, 2015
- KABUSHIKI KAISHA TOSHIBA
- Keiichi MATSUSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SEMICONDUCTOR MO...
- Publication number 20130181344
- Publication date Jul 18, 2013
- Sanyo Electric Co., Ltd.
- Yasuyuki Yanase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming nano-coatings for improved adhesion between firs...
- Publication number 20090065932
- Publication date Mar 12, 2009
- Sandeep Sane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE TO REDUCE CRACKING IN FLIP CHIP UNDERFILL
- Publication number 20090032974
- Publication date Feb 5, 2009
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for bonding substrates

Method of manufacturing semiconductor device

Low stress bonding of silicon or germanium parts

Fabrication method of a stack of electronic devices

Semiconductor device and method for manufacturing the same

Method and structure to reduce cracking in flip chip underfill

Methods of forming nano-coatings for improved adhesion between firs...

Patents Applicationslast 30 patents

MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL

Semiconductor Device with Protective Layer

SOLDER MATERIAL, LAYER STRUCTURE, CHIP PACKAGE, METHOD OF FORMING A...

METHODS FOR BONDING SUBSTRATES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

FABRICATION METHOD OF A STACK OF ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SEMICONDUCTOR MO...

Methods of forming nano-coatings for improved adhesion between firs...

METHOD AND STRUCTURE TO REDUCE CRACKING IN FLIP CHIP UNDERFILL