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H01L2224/83359

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83359Material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a semiconductor device including bonding la...
- Patent number 11,824,035
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connecting structure having nano-twins copper
- Patent number 11,715,721
- Issue date Aug 1, 2023
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible three-dimensional electronic device
- Patent number 11,545,436
- Issue date Jan 3, 2023
- King Abdullah University of Science and Technology
- Muhammad Mustafa Hussain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including bonding layer and adsorption layer
- Patent number 11,348,892
- Issue date May 31, 2022
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection of copper surfaces using copper sintering material
- Patent number 11,329,023
- Issue date May 10, 2022
- Schlumberger Technology Corporation
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connecting structure having nano-twins copper and method...
- Patent number 11,145,619
- Issue date Oct 12, 2021
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 11,031,254
- Issue date Jun 8, 2021
- Renesas Electronics Corporation
- Yasuhiko Akaike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of liquid assisted bonding
- Patent number 10,971,472
- Issue date Apr 6, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,961,411
- Issue date Mar 30, 2021
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Silver sintering preparation and the use thereof for the connecting...
- Patent number 10,910,340
- Issue date Feb 2, 2021
- Heraeus Deutschland GmbH & Co. KG
- Ly May Chew
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Pad structure exposed in an opening through multiple dielectric lay...
- Patent number 10,535,696
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-bonding structure and method of forming the same
- Patent number 10,388,627
- Issue date Aug 20, 2019
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 10,366,962
- Issue date Jul 30, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Placement method for circuit carrier and circuit carrier
- Patent number 10,217,675
- Issue date Feb 26, 2019
- A.B. MIKROELEKTRONIK GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG
- Andreas Karch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,202,519
- Issue date Feb 12, 2019
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for producing an electronic device
- Patent number 10,147,696
- Issue date Dec 4, 2018
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 10,141,284
- Issue date Nov 27, 2018
- Imec VZW
- Soon-Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,066,118
- Issue date Sep 4, 2018
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,032,758
- Issue date Jul 24, 2018
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of providing a flexible semiconductor device and flexible se...
- Patent number 9,953,951
- Issue date Apr 24, 2018
- Arizona Board of Regents on behalf of Arizona State University
- Emmett Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module bonding wire connection method
- Patent number 9,925,588
- Issue date Mar 27, 2018
- Infineon Technologies AG
- Daniel Bolowski
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low stress bonding of silicon or germanium parts
- Patent number 9,892,920
- Issue date Feb 13, 2018
- Lam Research Corporation
- Jihong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making electronic device with cover layer with openings...
- Patent number 9,681,543
- Issue date Jun 13, 2017
- Harris Corporation
- Louis Joseph Rendek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure exposed in an opening through multiple dielectric lay...
- Patent number 9,653,508
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a circuit carrier arrangement having a carrier...
- Patent number 9,640,511
- Issue date May 2, 2017
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 9,564,414
- Issue date Feb 7, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package assembly and manufacturing method thereof
- Patent number 9,508,677
- Issue date Nov 29, 2016
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for connecting joining parts
- Patent number 9,502,376
- Issue date Nov 22, 2016
- Osram Opto Semiconductors GmbH
- Andreas Plöβl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 9,431,368
- Issue date Aug 30, 2016
- Ziptronix, Inc.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Pad structure exposed in an opening through multiple dielectric lay...
- Patent number 9,362,329
- Issue date Jun 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Package with Heat Dissipation Structure and Method for Forming the...
- Publication number 20240145342
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME
- Publication number 20240030180
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20230245969
- Publication date Aug 3, 2023
- Mitsubishi Electric Corporation
- Masaya IMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL, LAYER STRUCTURE, CHIP PACKAGE, METHOD OF FORMING A...
- Publication number 20230095749
- Publication date Mar 30, 2023
- Alexander Heinrich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING BONDING LAYER AND ADSORPTION LAYER
- Publication number 20220293549
- Publication date Sep 15, 2022
- SAMSUNG ELECATRONICS CO., LTD.
- Jaehyung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER
- Publication number 20210407960
- Publication date Dec 30, 2021
- National Yang Ming Chiao Tung University
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION OF COPPER SURFACES USING COPPER SINTERING MATERIAL
- Publication number 20210320082
- Publication date Oct 14, 2021
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER AND METHOD...
- Publication number 20210020599
- Publication date Jan 21, 2021
- NATIONAL CHIAO-TUNG UNIVERSITY
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF LIQUID ASSISTED BONDING
- Publication number 20210013174
- Publication date Jan 14, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE THREE-DIMENSIONAL ELECTRONIC DEVICE
- Publication number 20200357745
- Publication date Nov 12, 2020
- King Abdullah University of Science and Technology
- Muhammad Mustafa HUSSAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20200144075
- Publication date May 7, 2020
- RENESAS ELECTRONICS CORPORATION
- Yasuhiko AKAIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...
- Publication number 20190092963
- Publication date Mar 28, 2019
- Sekisui Chemical Co., Ltd
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180308831
- Publication date Oct 25, 2018
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Immersion Bonding
- Publication number 20170330855
- Publication date Nov 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATES
- Publication number 20170301646
- Publication date Oct 19, 2017
- IMEC vzw
- Soon-Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Method for Producing an Electronic Device
- Publication number 20170271295
- Publication date Sep 21, 2017
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170263595
- Publication date Sep 14, 2017
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...
- Publication number 20170233615
- Publication date Aug 17, 2017
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF PROVIDING A FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE SE...
- Publication number 20170062380
- Publication date Mar 2, 2017
- Arizona Board of Regents, a body Corporate of the State of Arizona, Acting fo...
- Emmett Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20160284663
- Publication date Sep 29, 2016
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Circuit Carrier Arrangement Having a Carrier...
- Publication number 20160284664
- Publication date Sep 29, 2016
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE
- Publication number 20160190093
- Publication date Jun 30, 2016
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Connecting Joining Parts
- Publication number 20160027759
- Publication date Jan 28, 2016
- Osram Opto Semiconductors GmbH
- Andreas Plößl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLACEMENT METHOD FOR CIRCUIT CARRIER AND CIRCUIT CARRIER
- Publication number 20150364384
- Publication date Dec 17, 2015
- A.B. Mikroelektronik Gesellschaft mit beschraenkter Haftung
- Andreas KARCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE BONDING WIRE CONNECTION METHOD
- Publication number 20150333034
- Publication date Nov 19, 2015
- INFINEON TECHNOLOGIES AG
- Daniel Bolowski
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pad Structure Including Glue Layer and Non-Low-K Dielectric Layer i...
- Publication number 20150228690
- Publication date Aug 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150069597
- Publication date Mar 12, 2015
- KABUSHIKI KAISHA TOSHIBA
- Keiichi MATSUSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING ELECTRONIC DEVICE WITH COVER LAYER WITH OPENINGS...
- Publication number 20150009644
- Publication date Jan 8, 2015
- Harris Corporation
- Louis Joseph RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Structures in BSI Image Sensor Chips
- Publication number 20130032916
- Publication date Feb 7, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional device integration method and integrated device
- Publication number 20080093747
- Publication date Apr 24, 2008
- Ziptronix
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing a semiconductor device including bonding la...

Electrical connecting structure having nano-twins copper

Flexible three-dimensional electronic device

Semiconductor devices including bonding layer and adsorption layer

Interconnection of copper surfaces using copper sintering material

Electrical connecting structure having nano-twins copper and method...

Method for manufacturing a semiconductor device

Method of liquid assisted bonding

Inkjet adhesive, manufacturing method for semiconductor device, and...

Silver sintering preparation and the use thereof for the connecting...

Pad structure exposed in an opening through multiple dielectric lay...

Micro-bonding structure and method of forming the same

Three dimensional device integration method and integrated device

Placement method for circuit carrier and circuit carrier

Inkjet adhesive, manufacturing method for semiconductor device, and...

Electronic device and method for producing an electronic device

Method of bonding semiconductor substrates

Inkjet adhesive, manufacturing method for semiconductor device, and...

Method of manufacturing semiconductor device

Method of providing a flexible semiconductor device and flexible se...

Semiconductor module bonding wire connection method

Low stress bonding of silicon or germanium parts

Method for making electronic device with cover layer with openings...

Pad structure exposed in an opening through multiple dielectric lay...

Method for producing a circuit carrier arrangement having a carrier...

Three dimensional device integration method and integrated device

Chip package assembly and manufacturing method thereof

Process for connecting joining parts

Three dimensional device integration method and integrated device

Pad structure exposed in an opening through multiple dielectric lay...

Patents Applicationslast 30 patents

Package with Heat Dissipation Structure and Method for Forming the...

WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME

SEMICONDUCTOR APPARATUS

SOLDER MATERIAL, LAYER STRUCTURE, CHIP PACKAGE, METHOD OF FORMING A...

SEMICONDUCTOR DEVICES INCLUDING BONDING LAYER AND ADSORPTION LAYER

ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER

INTERCONNECTION OF COPPER SURFACES USING COPPER SINTERING MATERIAL

ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER AND METHOD...

METHOD OF LIQUID ASSISTED BONDING

FLEXIBLE THREE-DIMENSIONAL ELECTRONIC DEVICE

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

System and Method for Immersion Bonding

METHOD OF BONDING SEMICONDUCTOR SUBSTRATES

Electronic Device and Method for Producing an Electronic Device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...

METHOD OF PROVIDING A FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE SE...

CHIP PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF

Method for Producing a Circuit Carrier Arrangement Having a Carrier...

THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE

Process for Connecting Joining Parts

PLACEMENT METHOD FOR CIRCUIT CARRIER AND CIRCUIT CARRIER

SEMICONDUCTOR MODULE BONDING WIRE CONNECTION METHOD

Pad Structure Including Glue Layer and Non-Low-K Dielectric Layer i...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MAKING ELECTRONIC DEVICE WITH COVER LAYER WITH OPENINGS...

Pad Structures in BSI Image Sensor Chips

Three dimensional device integration method and integrated device