Placement method for circuit carrier and circuit carrier

Abstract
The invention concerns a process for the production of a circuit carrier (1) equipped with at least one surface-mount LED (SMD-LED), wherein the at least one SMD-LED (2) is positioned in oriented relationship to one or more reference points (3) of the circuit carrier (1) on the circuit carrier (1), wherein the position of a light-emitting region (4) of the at least one SMD-LED (2) is optically detected in the SMD-LED (2) and the at least one SMD-LED (2) is mounted to the circuit carrier (1) in dependence on the detected position of the light-emitting region (4) of the at least one SMD-LED (2), and such a circuit carrier (1).
Description
BACKGROUND

The present invention concerns a process for the production of a circuit carrier fitted with at least one surface-mount LED (SMD-LED), having the features described below, and a circuit carrier having the features described below.


To implement light-optical applications based on surface-mount LED components (SMD-LED), highly precise mounting of the SMD-LED components on a circuit carrier is required. Examples are front headlights, daytime running lights, flashing indicators, active bending lights on motor vehicles, the light sources of which are LEDs.


In that respect the SMD-LEDs are to be mounted in position in relation to one or more defined reference points on the circuit carrier, then an optical system (for example attachment lenses) can be oriented in relation to those reference points.


Hitherto SMD-LED components have been placed on the circuit carriers using the so-called “Pick & Place” process and then soldered in the “Reflow” process. In that case the final position of the light-emitting region of the LED is determined by the following factors:

    • the tolerances in the LED component (for example the position of the light-emitting region relative to the outside contour of the LED or relative to the position of the LED terminal pad),
    • the tolerances in the circuit carrier which determine the position of the soldering pad (for example position of the conductor track relative to the contour of the circuit carrier and/or a through hole, position of the solder mask relative to a conductor track position), and
    • the movement of the SMD-LED in the Reflow soldering process, caused by “slumping” of the solder paste in the pre-heating zone and the wetting forces of the solder upon melting in the peak zone (floating lift).


The final levels of positioning accuracy which can be achieved with that process in respect of the light-emitting region of SMD-LED components are already more than +/−110 μm solely when considering the tolerances of the SMD-LED and the circuit carrier (still without taking account of the action of the Reflow soldering process).


The effects of the Reflow soldering process produce additional positioning inaccuracies, in particular in the area of angular and tilting positional truth in respect of the SMD-LED components.


Mounting of the SMD-LED by means of current silver sintering processes is out of the question as those processes are linked to unacceptably long processing times of more than 10 seconds.


SUMMARY

The object of the invention is to provide a process of the general kind set forth, in which the inevitably present tolerances in the SMD-LEDs and the circuit carriers can be compensated, in particular a higher degree of accuracy in positioning and mounting of SMD-LEDs on circuit carriers can be achieved and the provision of a correspondingly equipped circuit carrier.


That object is attained by a process having the features described below and a circuit carrier having the features described below.


By mounting the at least one SMD-LED to the circuit carrier in dependence on the position of the light-emitting region in the SMD-LED it is possible to eliminate those accuracies which are due to tolerances in the LED component and in the circuit carrier. In that way it is possible to achieve tolerances of below +/−100 μm in positioning of the SMD-LED on the circuit carrier. The applicant's tests have shown that it is even possible to achieve tolerances of less than or equal to +/−50 μm.


In other words it is possible with the process according to the invention to substantially or even completely eliminate the component-inherent tolerances of the SMD-LED and the circuit carrier. In other words the tolerances which can be achieved with the process according to the invention are substantially now only limited by the precision of the detection process used for the light-emitting region of the SMD-LED. Depending on the project demands it is accordingly possible to select a sufficiently precise detection process, independently of the structure of the SMD-LED and the circuit carrier, and thereby achieve implementation of the tolerances prescribed in the project. In other words the greater tolerances of cheaper or simpler components can be compensated by the use of a more precise detection process. A more precise detection process can be achieved by using a more accurate optical camera and/or using a more accurate “Pick & Place” apparatus.


Detection of the light-emitting region of the at least one SMD-LED can be effected for example by the use of an optical camera which detects the characteristic contour of the light-emitting region.


Advantageous embodiments of the invention are described below.


The invention can be used for example in relation to circuit carriers which are employed for front headlights, daytime running lights, flashing indicators, adaptive bending lights on motor vehicles, the light sources of which are LEDs.


The reference point or points can be for example in the form of holes (round holes or elongate holes). Additionally or alternatively it is possible to use etched or printed structures.


For example it can be provided that mounting of the SMD-LED to the circuit carrier is effected in dependence on the position of the centre point of the light-emitting region of the SMD-LED. That is particularly advantageous for the reason that the orientation of an optical system which is usually arranged in the beam path of the SMD-LED is effected in relation to the centre point of the light-emitting region of the SMD-LED.


It is particularly preferably provided that at least one of the reference points is used for positioning and—preferably for fixing—an optical system for the at least one SMD-LED. In the state of the art the circuit carrier equipped with the SMD-LEDs must be oriented relative to the optical system in a dedicated process step in the mounting procedure. That can be dispensed with in the preferred embodiment described, as the use of at least one of the reference points for positioning of the optical system means that the system is already correctly oriented. If the at least one reference point is used not only for positioning the optical system but also for fixing the optical system to the circuit carrier (in this case the at least one reference point is for example in the form of a mounting hole for the optical system), that affords the highest level of accuracy. In many applications it may be acceptable to provide separate fixing locations for the optical system, which are oriented in relation to the at least one reference point.


To be able to orient the at least one SMD-LED in relation to the reference point or points of the circuit carrier at a later time, it is necessary to detect the position of the reference points of the circuit carrier. That can be effected for example in such a way that an optical camera passes over existing reference points and ascertains the respective deviation relative to the target position which arises out of the tolerance inherent in the component. Preferably the position of those reference points which are also later used for position an optical system for the SMD-LED is used.


Usually SMD-LEDs are provided in a feed belt from which they are removed from pockets arranged in the feed belt by means of a “Pick & Place” system corresponding to the state of the art, for example by means of a sucker (vacuum pipette). In the state of the art the contours of the SMD-LED or the position of the terminal pads is detected from the underside after removal from the feed belt. That is not possible in the case of the invention as here the position of the light-emitting region which is at the top side of the SMD-LED is crucial. When using a vacuum pipette system therefore detection of the light-emitting region must be effected prior to contacting by the sucker. In the case of SMD-LEDs which are provided in another fashion that requirement does not necessarily have to arise.


When using a vacuum pipette system the invention can be carried out as follows:


The position of the light-emitting region of the SMD-LED to be taken from the belt is detected by means of a camera which is so positioned or which is moveable into such a position that it can look into the individual pockets of the feed belt. Preferably the detected position is compared to a target position of the SMD-LED in the pocket, in which the SMD-LED would be arranged centrally in the pocket in oriented relationship with the direction of movement of the feed belt (Y-direction, X-direction=direction at a right angle to the Y-direction in the plane of the feed belt). Deviations in respect of the detected position of the light-emitting region relative to the target position in relation to the X- and Y-direction of the centre point of the light-emitting region and the angular position of the light-emitting region are calculated. In other words the random position of the SMD-LED in the pocket of the feed belt is ascertained and compared to the target position.


Detection of the position of the light-emitting region can become more robust by the SMD-LED being illuminated with a light source having a wavelength adapted to the LED spectrum. It is possible in that way to increase the contrast between the light-emitting region and the remaining region of the SMD-LED. The adapted wavelength can be for example in a range of 400 to 500 nm, preferably in a range of 420 to 490 nm.


That random position is no longer to be altered upon removal from the pocket by the vacuum pipette. To ensure that it may be advantageous to also ascertain the Z-position (Z-direction=at a right angle to the X- and Y-direction) of the light-emitting region or the SMD-LED as then contacting by the vacuum pipette can be effected gently in such a way that no change in position of the SMD-LED in the pocket occurs upon contacting.


As the position of the circuit carrier is known by ascertaining the position of the reference points it is possible, by means of the ascertained deviation of the light-emitting region of the SMD-LED, for the vacuum pipette to be actuated in such a way that it corrects the existing deviation in the X- and Y-direction and also by a rotation about an axis at a right angle to the SMD-LED and thus orients the SMD-LED in relation to the light-emitting region in the correct position. Tilting of the SMD-LED does not have to be taken in consideration as fixing to the vacuum pipette means that it cannot involve any angle relative to the axis of the vacuum pipette.


Described hereinafter are two alternative processes with which SMD-LEDs oriented in the correct position can be mounted to the circuit carrier in the correct position.


In the first process for mounting the at least one SMD-LED to the circuit carrier, silver sintering material is arranged at the at least one SMD-LED after orientation thereof has been effected and at least one SMD-LED is silver-sintered.


Preferably the circuit carrier to be equipped and/or the SMD-LED is raised to a temperature at which, upon and by pressing of the SMD-LED which is provided with sintering material, the sintering material is sintered.


To permit a sufficiently short process time the particle size of the silver sintering material should be less than about 100 nm, preferably less than about 60 nm. In that way, sintering is achieved within a contact time of less than 1 to 5 seconds after beginning the pressing procedure. For example a sintering material of a particle size in a range of about 20 nm to about 40 nm can be used. Silver sintering material of the desired particle size can be acquired from various suppliers.


Arranging the silver sintering material on the SMD-LED can be effected for example by applying a paste of silver sintering material and a suitable organic separating agent to the SMD-LED.


The paste can be applied for example without changing the position of the SMD-LED relative to the vacuum pipette by immersing the terminal pad in a prepared supplied deposit of paste.


Alternatively the silver sintering material can be applied to the SMD-LED by a “Die Transfer Film” (DTF) process. In that case the silver sintering material is in film form. Films of that kind can be commercially acquired.


No subsequent change in the correctly positioned orientation of the SMD-LED can occur due to the sintering operation as the SMD-LED can be held fast by the vacuum pipette until the sintering operation is concluded. Tilting of the SMD-LED cannot occur as it is pressed against the surface of the circuit carrier by the vacuum pipette.


The second process for mounting the at least one SMD-LED to the circuit carrier is based on a Reflow soldering process.


In that case the solder paste is applied to the circuit carrier—preferably by being printed thereon. Then an adhesive is applied to the circuit carrier—preferably in dependence on the detected position of the light-emitting region of the at least one SMD-LED. The SMD-LED is placed on the circuit carrier. The adhesive is then at least partially hardened. Reflow soldering of the solder paste can then be effected.


The use of the adhesive makes it possible to avoid the SMD-LED floating in the Reflow soldering operation.


Particularly preferably the adhesive used is a UV-hardenable adhesive. In that case at least partial hardening of the adhesive can be effected by exposure to UV light. Quite particularly preferably a hybrid adhesive is used, which is UV- and temperature-hardenable. That can subsequently harden in the soldering operation in the furnace.


Either individual illumination of each individual SMD-LED can be effected, but preferably simultaneous illumination of all SMD-LEDs is effected to reduce the cycle time.


Further advantages and details of the invention will be apparent from the Figures and the related specific description. The same references are used for identical components in all Figures.





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 shows a test layout which serves to check the positional accuracy of each individual SMD-LED.



FIG. 2 shows a test layout which serves to check the positional accuracy of each individual SMD-LED.



FIG. 3 shows a test layout which serves to check the positional accuracy of each individual SMD-LED.



FIG. 4a shows a process according to the invention.



FIG. 4b shows a process according to the invention.



FIG. 4c shows a process according to the invention.





DETAILED DESCRIPTION


FIGS. 1 to 3 show test layouts which serve to check the positional accuracy of each individual SMD-LED 2. The circuit carrier 1 has electrically conductive surfaces 5 which are insulated from each other by insulating regions 6. The conductive surfaces 5 can be supplied with electric power by way of terminals 7.



FIG. 1 shows a circuit carrier 1 equipped with six SMD-LEDs 2. It is possible to see two reference points 3 which on the one hand serve to ascertain the deviation of the target positions for the SMD-LEDs 2 on the circuit carrier 1 and which on the other hand can also be used for fixing an optical system (not shown) for the SMD-LEDs 2. The optical system is oriented by way of separate reference points which are not shown in this Figure.


In FIG. 1 the mounting operation was effected with a “Pick & Place” and Reflow soldering process in accordance with the state of the art. In themselves the SMD-LEDs 2 are oriented by means of their outside contours relative to the reference points 3. The Reflow soldering process involves blurring of the position of the SMD-LEDs 2 so that the situation no longer involves an ordered orientation of the outside contours of the SMD-LEDs 2. Orientation in relation to the light-emitting regions 4 of the SMD-LEDs 2 has not occurred at all.



FIG. 2 shows a circuit carrier 1 equipped with six SMD-LEDs 2, the difference in relation to FIG. 1 being that the SMD-LEDs 2 are mounted on the circuit carrier 1 in the correct position in relation to the outside contour, but no mounting is effected in dependence on the light-emitting regions 4 of the SMD-LEDs 2. This circuit carrier 1 also does not meet the requirements in regard to positioning accuracy of the light-emitting regions 4.



FIG. 3 in contrast shows an embodiment by way of example of the invention in which the SMD-LEDs 2 are mounted in the correct position relative to the reference points 3 of the circuit carrier 1, on the circuit carrier 1, in regard to their light-emitting regions 4. This circuit carrier 1 meets the requirements in regard to positioning accuracy of the light-emitting regions 4.



FIGS. 4a, 4b and 4c show a process according to the invention including the steps:

    • ascertaining the deviation in relation to the target position in the X-direction and the Y-direction of the reference point 3i for all reference points 3i (FIG. 4a),
    • ascertaining the deviation in relation to the target position in the X,Y-direction and an angular position of the light-emitting region 4 of the SMD-LED 2 to be removed and in the Z-direction of the SMD-LED 2 to be removed (FIG. 4b), and
    • mounting of the SMD-LED 2 to the circuit carrier 1 in the correct position relative to the reference points 3i of the circuit carrier 1 (FIG. 4c).

Claims
  • 1. A process for the production of a circuit carrier equipped with at least one surface-mount LED (SMD-LED) for a motor vehicle, wherein the at least one SMD-LED is positioned in oriented relationship to one or more reference points of the circuit carrier on the circuit carrier, wherein a position of a light-emitting region of the at least one SMD-LED is optically detected in the SMD-LED by illuminating the SMD-LED with a light source that is separate from the SMD-LED, and wherein the at least one SMD-LED is mounted to the circuit carrier in dependence on the detected position of the light-emitting region of the at least one SMD-LED.
  • 2. A process according to claim 1, wherein the position of the light-emitting region is determined in all three dimensions (X, Y, Z) and an angular position is determined relative to an axis of rotation at a right angle to a plane of the SMD-LED.
  • 3. A process according to claim 1, wherein mounting of the at least one SMD-LED to the circuit carrier is affected in dependence on the position of a centre point of the light-emitting region of the at least one SMD-LED.
  • 4. A process according to claim 1, wherein at least one of the one or more reference points is used for positioning an optical system for the at least one SMD-LED.
  • 5. A process according to claim 1, wherein a wavelength of the light source ranges from 400 nm to 500 nm.
  • 6. A process according to claim 1, wherein for mounting the at least one SMD-LED to the circuit carrier, silver sintering material is arranged at the at least one SMD-LED after orientation has been affected, and the at least one SMD-LED is sintered on to the circuit earner.
  • 7. A process according to claim 6, wherein the silver sintering material has a particle size of less than about 100 nm.
  • 8. A process according to claim 7, wherein the silver sintering material is selected with a particle size in a range of about 20 nm to about 40 nm.
  • 9. A process according to claim 1, wherein mounting the at least one SMD-LED to the circuit carrier comprises: applying solder paste to the circuit carrier:applying an adhesive to the circuit carrier;partially hardening the adhesive after positioning the at least one SMD-LED on the circuit carrier; andreflow soldering the solder paste.
  • 10. A process according to claim 4, wherein the at least one of the one or more reference points is used for fixing the optical system for the at least one SMD-LED.
  • 11. A process according to claim 6, wherein for the mounting the at least one SMD-LED to the circuit carrier, the silver sintering material is arranged at the at least one SMD-LED after the orientation has been affected, and the at least one SMD-LED is sintered upon and/or by pressing the at least one SMD-LED on to the circuit carrier.
  • 12. A process according to claim 7, wherein the particle size of the silver sintering material is less than about 60 nm.
  • 13. A process according to claim 9, wherein the solder paste is applied to the circuit carrier by printing thereon, and the adhesive is applied to the circuit carrier in dependence on the detected position of the light-emitting region of the at least one SMD-LED.
  • 14. A process according to claim 1, wherein a wavelength of the light source ranges from 420 nm to 490 nm.
Priority Claims (1)
Number Date Country Kind
A 155/2013 Feb 2013 AT national
US Referenced Citations (91)
Number Name Date Kind
4208005 Nate Jun 1980 A
4615093 Tews et al. Oct 1986 A
4916805 Ellrich Apr 1990 A
4980971 Bartschat et al. Jan 1991 A
5173759 Murano Dec 1992 A
5290986 Colon Mar 1994 A
5559727 Deley et al. Sep 1996 A
5758942 Fogal et al. Jun 1998 A
5854087 Kurata Dec 1998 A
5857767 Hochstein Jan 1999 A
5893511 Schwarzbauer Apr 1999 A
5917200 Kurata Jun 1999 A
5943586 Koizuma et al. Aug 1999 A
6023104 Koizuma et al. Feb 2000 A
6040895 Haas Mar 2000 A
6208419 Yamamoto Mar 2001 B1
6266891 Yamamoto Jul 2001 B1
6285782 Inoue et al. Sep 2001 B1
6312624 Kropp Nov 2001 B1
6359694 Stredele et al. Mar 2002 B1
6369884 Yamamoto Apr 2002 B1
6480223 Grasmueller Nov 2002 B1
6542238 Tsuboi et al. Apr 2003 B1
6693293 Oomori et al. Feb 2004 B2
6956879 Tatsuta Oct 2005 B2
7084353 Downes Aug 2006 B1
7638814 Wall, Jr. et al. Dec 2009 B2
7660336 Knotz Feb 2010 B2
8015696 Fukunaga Sep 2011 B2
8860045 Lin Oct 2014 B2
20020187571 Collins, III Dec 2002 A1
20020196639 Weidel Dec 2002 A1
20030159279 Bachthaler et al. Aug 2003 A1
20030206650 Gladnick Nov 2003 A1
20040033679 Jacobson Feb 2004 A1
20040076739 Yokono et al. Apr 2004 A1
20040179209 Besch Sep 2004 A1
20040239952 Mueller Dec 2004 A1
20050014311 Hayasaka Jan 2005 A1
20050093146 Sakano May 2005 A1
20050105301 Takeda et al. May 2005 A1
20060187982 Knotz Aug 2006 A1
20060209910 Fukunaga Sep 2006 A1
20060211240 Chi Sep 2006 A1
20060231952 Kim Oct 2006 A1
20060244117 Karnezos Nov 2006 A1
20070187818 Lyne Aug 2007 A1
20080023711 Tarsa Jan 2008 A1
20080137106 Ono Jun 2008 A1
20080156398 Yasuda et al. Jul 2008 A1
20080160183 Ide et al. Jul 2008 A1
20080186725 Schlager et al. Aug 2008 A1
20080284311 Schug Nov 2008 A1
20080315214 Wall, Jr. et al. Dec 2008 A1
20090021141 Emoto Jan 2009 A1
20090056111 Muren Mar 2009 A1
20090090002 Motomuro Apr 2009 A1
20090189949 Wu Jul 2009 A1
20090251918 Engl et al. Oct 2009 A1
20090269704 Hodono Oct 2009 A1
20090272971 Lee Nov 2009 A1
20090291296 McConnelee Nov 2009 A1
20090321750 Namioka Dec 2009 A1
20100023929 Jones et al. Jan 2010 A1
20100053929 Bisberg Mar 2010 A1
20100132187 Nishino et al. Jun 2010 A1
20100164367 Shioi Jul 2010 A1
20100237767 Emoto Sep 2010 A1
20100246936 Ji et al. Sep 2010 A1
20100284198 Willwohl et al. Nov 2010 A1
20110032722 Ishida et al. Feb 2011 A1
20110049541 Katsuno Mar 2011 A1
20110309384 Ito et al. Dec 2011 A1
20120063157 Nakazato et al. Mar 2012 A1
20120081618 Matsui Apr 2012 A1
20120217531 Katsuno Aug 2012 A1
20120230011 Harada Sep 2012 A1
20120249779 Ji et al. Oct 2012 A1
20120262567 Tsuboi et al. Oct 2012 A1
20120313207 Oganesian Dec 2012 A1
20120317802 Yamamoto et al. Dec 2012 A1
20130063918 Haba Mar 2013 A1
20130245988 Lai Sep 2013 A1
20140169014 Jungwirth et al. Jun 2014 A1
20150041974 Kobayashi Feb 2015 A1
20150069435 Chen Mar 2015 A1
20150255419 Nishimoto Sep 2015 A1
20160040857 Inoue Feb 2016 A1
20160155693 Smith Jun 2016 A1
20160291233 Trutna Oct 2016 A1
20170051884 Raring Feb 2017 A1
Foreign Referenced Citations (72)
Number Date Country
1275307 Nov 2000 CN
1819761 Aug 2006 CN
1853320 Oct 2006 CN
201629347 Nov 2010 CN
103079392 May 2013 CN
34 45 625 Jun 1986 DE
38 27 151 Jul 1989 DE
197 11 138 Sep 1998 DE
101 28 476 Jan 2003 DE
101 62 270 Jul 2003 DE
10 2005 005 896 Jan 2011 DE
10 2009 028 499 Feb 2011 DE
10 2010 031 939 Jan 2012 DE
10 2011 109 226 Feb 2013 DE
0269337 Jun 1988 EP
0 622 837 Nov 1994 EP
0 781 660 Jul 1997 EP
0 829 192 Mar 1998 EP
1 003 212 May 2000 EP
1 003 212 May 2000 EP
1 020 106 Jul 2000 EP
1 057 389 Dec 2000 EP
1 675 453 Jun 2006 EP
1 693 935 Aug 2006 EP
1 925 876 May 2008 EP
2 112 534 Oct 2009 EP
55-100514 Jul 1980 JP
60-12786 Jan 1985 JP
H01209578 Aug 1989 JP
H05259627 Oct 1993 JP
6-24040 Feb 1994 JP
A-6-24040 Feb 1994 JP
6-349892 Dec 1994 JP
7-94786 Apr 1995 JP
2000022396 Jan 2000 JP
2000-150970 May 2000 JP
2000-164626 Jun 2000 JP
2000-183404 Jun 2000 JP
2002-365019 Dec 2002 JP
2003-110245 Apr 2003 JP
2003298294 Oct 2003 JP
2004079750 Mar 2004 JP
2004-207655 Jul 2004 JP
2004-325146 Nov 2004 JP
2005-64303 Mar 2005 JP
2006-138679 Jun 2006 JP
2006-229224 Aug 2006 JP
3844009 Aug 2006 JP
2006-310653 Nov 2006 JP
2007-87608 Apr 2007 JP
2009083127 Apr 2009 JP
4357168 Aug 2009 JP
2012-238410 Dec 2012 JP
2012-238411 Dec 2012 JP
2012-248708 Dec 2012 JP
2012238410 Dec 2012 JP
10-2010-0108969 Oct 2010 KR
10-2011-0060868 Jun 2011 KR
10-2011-006197 Jan 2013 KR
10-2013-0006895 Jan 2013 KR
M324300 Dec 2007 TW
201222899 Jun 2012 TW
201230268 Jul 2012 TW
9920093 Apr 1999 WO
2008155700 Dec 2008 WO
2009031903 Mar 2009 WO
2009037634 Mar 2009 WO
2010146902 Dec 2010 WO
WO2011003948 Jan 2011 WO
2012057038 May 2012 WO
2012128094 Sep 2012 WO
2013020155 Feb 2013 WO
Non-Patent Literature Citations (17)
Entry
“Prozess und Systemlösungen für die SMT-Montage optischer Bauelemente auf Substrate mit integrierten Lichwellenleitern”, Daniel Craiovan, Dec. 2011, with English language abstract.
International Search Report (ISR) dated May 12, 2014 in International (PCT) Application No. PCT/AT2014/000027.
Austrian Patent Office Search Report (ASR) dated May 12, 2013 in Austrian Patent Application No. A 155/2013.
Siemens publication, “Retrofitting Instructions PCB Camera Multicolor”, HS-50/HSC-60, 2004 Edition.
Chinese Search Report dated Aug. 15, 2016 in corresponding Chinese Application No. 201480001918.6.
Kayaba, Masao, “Printed Board Lesson VI: Mounting Guide 2,” Japan Electronic Circuit Industry Association, Tokyo, May 31, 2006 (with English translation).
Chinese Search Report dated Dec. 30, 2015 in corresponding Chinese Application No. 201480001918.6.
SIPLACE SMT—Insights Vision Technology, ASM Assembly Systems, 2011.
Cyril Buttay et al., Die Attach of Power Devices Using Silver Sintering—Bonding Process Optimization and Characterization, IMAPS, High Temperature Electronics Network (HiTEN), Jul. 2011, pp. 1-7.
Extract from Wikipedia—Laser Diode.
A Practical Guide to Machine Vision Lighting, Midwest Sales and Support Manager Advanced Illumination, Feb. 2012.
Communication dated Aug. 17, 2017 in Taiwanese Application No. 103105400, with attached concise explanation of relevance.
Electronic Specifier, SIPLACE X-Series: Maximum efficiency in LED placement; Apr. 8, 2010, retrieved on Oct. 27, 2017: https://www.electronicspecifier.com/pending/siplace-x-series-maximum-efficiency-in-led-placement—1 page.
MIRTEC Press Release, Sep. 11, 2015, retrieved on Oct. 24, 2017, http://mirteceurope.com/press_release.php?id=74—3 pages.
MIRTEC PowerPoint Presentation: http://cherbsloeh.pl/gfx/docs/gitem_7819/prezentacja-mirtec.pdf—71 pages.
Kurdthongmee et al., “An Automatic System for Non-Uniform Brightness Compensation of LED Arrays: Image Processing Routines to Locate LED Centers,” Walailak J Sci & Tech 2008; 5(2), pp. 203-216.
Strauss, SMT Soldering Handbook, Butterworth-Heinemann, Oxford, Second edition 1998, [excerpt] Wavesoldering 4.8, pp. 141-143, 7 pages.
Related Publications (1)
Number Date Country
20150364384 A1 Dec 2015 US
Continuations (1)
Number Date Country
Parent PCT/AT2014/000027 Feb 2014 US
Child 14836049 US