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H01L2224/85399

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85399Material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 12,119,338
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
- Patent number 11,855,065
- Issue date Dec 26, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with die support members and a...
- Patent number 11,824,044
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 11,817,445
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 11,605,609
- Issue date Mar 14, 2023
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 11,270,989
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,189,595
- Issue date Nov 30, 2021
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 11,164,857
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with die support members and a...
- Patent number 11,101,244
- Issue date Aug 24, 2021
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
- Patent number 11,101,262
- Issue date Aug 24, 2021
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 10,896,892
- Issue date Jan 19, 2021
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with lead terminals having portions thereof ex...
- Patent number 10,886,204
- Issue date Jan 5, 2021
- Rohm Co., Ltd.
- Kazutaka Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a wire support leadframe for a semiconductor device
- Patent number 10,811,343
- Issue date Oct 20, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,770,380
- Issue date Sep 8, 2020
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 10,756,049
- Issue date Aug 25, 2020
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic system with wire bonds
- Patent number 10,685,949
- Issue date Jun 16, 2020
- Intel Corporation
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor die assemblies with die support members and a...
- Patent number 10,658,336
- Issue date May 19, 2020
- Micron Technology Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package including miniature antenna
- Patent number 10,644,405
- Issue date May 5, 2020
- Fractus, S.A.
- Jordi Soler Castany
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 10,607,957
- Issue date Mar 31, 2020
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,573,584
- Issue date Feb 25, 2020
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire support for a leadframe
- Patent number 10,529,654
- Issue date Jan 7, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
- Patent number 10,504,881
- Issue date Dec 10, 2019
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip modules and methods of fabrication
- Patent number 10,490,520
- Issue date Nov 26, 2019
- Invensas Corporation
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor devices and methods of making semiconductor devices
- Patent number 10,418,330
- Issue date Sep 17, 2019
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lead terminals having portions thereof ex...
- Patent number 10,388,595
- Issue date Aug 20, 2019
- Rohm Co., Ltd.
- Kazutaka Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package including miniature antenna
- Patent number 10,320,079
- Issue date Jun 11, 2019
- Fractus, S.A.
- Jordi Soler Castany
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable losses on bond wire arrangement
- Patent number 10,312,905
- Issue date Jun 4, 2019
- NXP USA, INC.
- Youri Volokhine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,290,565
- Issue date May 14, 2019
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave integrated circuit with ball grid array package inc...
- Patent number 10,262,957
- Issue date Apr 16, 2019
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...
- Publication number 20240395792
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...
- Publication number 20240274583
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
- Publication number 20240128254
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON WHICH BONDING WIRE IS D...
- Publication number 20240014165
- Publication date Jan 11, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID EMBEDDED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230052065
- Publication date Feb 16, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
- Publication number 20210384185
- Publication date Dec 9, 2021
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...
- Publication number 20210384167
- Publication date Dec 9, 2021
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...
- Publication number 20200279832
- Publication date Sep 3, 2020
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
- Publication number 20200185349
- Publication date Jun 11, 2020
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200161228
- Publication date May 21, 2020
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
- Publication number 20200105737
- Publication date Apr 2, 2020
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LEAD TERMINALS HAVING PORTIONS THEREOF EX...
- Publication number 20190348348
- Publication date Nov 14, 2019
- Rohm Co., Ltd.
- Kazutaka Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190229042
- Publication date Jul 25, 2019
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Making A Wire Support Leadframe For A Semiconductor Device
- Publication number 20190172776
- Publication date Jun 6, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190157193
- Publication date May 23, 2019
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGES, STACKED MICROELECTRONIC DEVICE PAC...
- Publication number 20190096857
- Publication date Mar 28, 2019
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP MODULES AND METHODS OF FABRICATION
- Publication number 20190088607
- Publication date Mar 21, 2019
- Invensas Corporation
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ON-BONDER AUTOMATIC OVERHANG DIE OPTIMIZATION TOOL FOR WIRE BONDING...
- Publication number 20190027463
- Publication date Jan 24, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Aashish Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORTICAL INTERFACE FOR MOTOR SIGNAL RECORDING AND SENSORY SIGNAL ST...
- Publication number 20180345019
- Publication date Dec 6, 2018
- Second Sight Medical Products, Inc.
- Robert J. Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Integrated Circuit Package Including Miniature Antenna
- Publication number 20180331427
- Publication date Nov 15, 2018
- FRACTUS, S.A.
- JORDI Soler Castany
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...
- Publication number 20180301428
- Publication date Oct 18, 2018
- Rajen Manicon Murugan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADJUSTABLE LOSSES OF BOND WIRE ARRANGEMENT
- Publication number 20180269873
- Publication date Sep 20, 2018
- NXP USA, Inc.
- Youri VOLOKHINE
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...
- Publication number 20180240785
- Publication date Aug 23, 2018
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING ELEMENT
- Publication number 20180166608
- Publication date Jun 14, 2018
- Seoul Viosys Co., Ltd.
- Duk Il Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LEAD TERMINALS HAVING PORTIONS THEREOF EX...
- Publication number 20180047658
- Publication date Feb 15, 2018
- Rohm Co., Ltd.
- Kazutaka Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180040521
- Publication date Feb 8, 2018
- RENESAS ELECTRONICS CORPORATION
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
- Publication number 20180033762
- Publication date Feb 1, 2018
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20180026007
- Publication date Jan 25, 2018
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
- Publication number 20140346683
- Publication date Nov 27, 2014
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND MICROELECTRONIC SUPPORT DEVICES, AND AS...
- Publication number 20140326488
- Publication date Nov 6, 2014
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device packages, packaging methods, and packaged semi...

Stacked semiconductor die assemblies with support members and assoc...

Stacked semiconductor die assemblies with die support members and a...

Semiconductor device packages, packaging methods, and packaged semi...

Package-on-package assembly with wire bond vias

Ultra-thin embedded semiconductor device package and method of manu...

Semiconductor device packages, packaging methods, and packaged semi...

Package-on-package assembly with wire bond vias

Semiconductor device packages, packaging methods, and packaged semi...

Stacked semiconductor die assemblies with die support members and a...

Stacked semiconductor die assemblies with support members and assoc...

Wire bonding apparatus

Semiconductor device with lead terminals having portions thereof ex...

Method of making a wire support leadframe for a semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Package-on-package assembly with wire bond vias

Flexible electronic system with wire bonds

Stacked semiconductor die assemblies with die support members and a...

Integrated circuit package including miniature antenna

Ultra-thin embedded semiconductor device package and method of manu...

Semiconductor device and method for manufacturing semiconductor device

Wire support for a leadframe

Stacked semiconductor die assemblies with support members and assoc...

Multichip modules and methods of fabrication

Semiconductor devices and methods of making semiconductor devices

Semiconductor device with lead terminals having portions thereof ex...

Integrated circuit package including miniature antenna

Adjustable losses on bond wire arrangement

Semiconductor device and method for manufacturing semiconductor device

Millimeter wave integrated circuit with ball grid array package inc...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...

SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON WHICH BONDING WIRE IS D...

HYBRID EMBEDDED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...

SEMICONDUCTOR DEVICE WITH LEAD TERMINALS HAVING PORTIONS THEREOF EX...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Method Of Making A Wire Support Leadframe For A Semiconductor Device

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

MICROELECTRONIC DEVICE PACKAGES, STACKED MICROELECTRONIC DEVICE PAC...

MULTICHIP MODULES AND METHODS OF FABRICATION

ON-BONDER AUTOMATIC OVERHANG DIE OPTIMIZATION TOOL FOR WIRE BONDING...

CORTICAL INTERFACE FOR MOTOR SIGNAL RECORDING AND SENSORY SIGNAL ST...

Integrated Circuit Package Including Miniature Antenna

MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...

ADJUSTABLE LOSSES OF BOND WIRE ARRANGEMENT

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...

LIGHT EMITTING ELEMENT

SEMICONDUCTOR DEVICE WITH LEAD TERMINALS HAVING PORTIONS THEREOF EX...

SEMICONDUCTOR DEVICE

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...

MICROELECTRONIC DEVICES AND MICROELECTRONIC SUPPORT DEVICES, AND AS...