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H01L2224/255

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/255Material

Industries

Patents Grantslast 30 patents

Information Patent Grant
High density substrate routing in package
- Patent number 12,051,667
- Issue date Jul 30, 2024
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure comprising thermally conductive layer around the...
- Patent number 12,033,963
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 11,810,884
- Issue date Nov 7, 2023
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 11,251,150
- Issue date Feb 15, 2022
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 10,861,815
- Issue date Dec 8, 2020
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 10,438,915
- Issue date Oct 8, 2019
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 10,199,346
- Issue date Feb 5, 2019
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in BBUL package
- Patent number 9,929,119
- Issue date Mar 27, 2018
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in BBUL package
- Patent number 9,437,569
- Issue date Sep 6, 2016
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in BBUL package
- Patent number 9,171,816
- Issue date Oct 27, 2015
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
- Publication number 20240339428
- Publication date Oct 10, 2024
- Intel Corporation
- Weng Hong TEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321786
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230061876
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
- Publication number 20190393180
- Publication date Dec 26, 2019
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
- Publication number 20190139926
- Publication date May 9, 2019
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
- Publication number 20180145047
- Publication date May 24, 2018
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN BBUL PACKAGE
- Publication number 20150194406
- Publication date Jul 9, 2015
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN BBUL PACKAGE
- Publication number 20140159228
- Publication date Jun 12, 2014
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High density substrate routing in package

Package structure comprising thermally conductive layer around the...

High density substrate routing in package

High density substrate routing in package

High density substrate routing in package

High density substrate routing in package

High density substrate routing in package

High density substrate routing in BBUL package

High density substrate routing in BBUL package

High density substrate routing in BBUL package

Patents Applicationslast 30 patents

HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE

HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE

HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE

HIGH DENSITY SUBSTRATE ROUTING IN BBUL PACKAGE

HIGH DENSITY SUBSTRATE ROUTING IN BBUL PACKAGE