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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/325Material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 12,087,723
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal joint, metal joint production method, semiconductor device, a...
- Patent number 12,076,967
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Takashi Ijima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming semiconductor packages
- Patent number 12,014,979
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface structures for integrated circuit packages
- Patent number 11,869,824
- Issue date Jan 9, 2024
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including bonding la...
- Patent number 11,824,035
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid manufacturing for integrated circuit devices and assemblies
- Patent number 11,817,442
- Issue date Nov 14, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating a semiconductor device
- Patent number 11,817,417
- Issue date Nov 14, 2023
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a can housing a semiconductor die w...
- Patent number 11,817,418
- Issue date Nov 14, 2023
- Infineon Technologies AG
- Wei Lee Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,810,886
- Issue date Nov 7, 2023
- Japan Display Inc.
- Masanobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch soldering of different elements in power module
- Patent number 11,798,924
- Issue date Oct 24, 2023
- Infineon Technologies AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,769,747
- Issue date Sep 26, 2023
- Kioxia Corporation
- Genki Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid manufacturing of microeletronic assemblies with first and se...
- Patent number 11,756,886
- Issue date Sep 12, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and method of manufacturing the same
- Patent number 11,715,729
- Issue date Aug 1, 2023
- Samsung Electronics Co., Ltd.
- Yoonsuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photocoupler
- Patent number 11,688,823
- Issue date Jun 27, 2023
- Kabushiki Kaisha Toshiba
- Mami Fujihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 11,688,670
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
- Patent number 11,626,343
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 11,610,861
- Issue date Mar 21, 2023
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 11,605,609
- Issue date Mar 14, 2023
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,508,656
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device incorporating self-assembled monolayer and method of...
- Patent number 11,430,759
- Issue date Aug 30, 2022
- Samsung Display Co., Ltd.
- Dae Ho Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit substrate
- Patent number 11,430,727
- Issue date Aug 30, 2022
- DENKA COMPANY LIMITED
- Ryota Aono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Soldering a conductor to an aluminum layer
- Patent number 11,424,217
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced solder alloys for electronic interconnects
- Patent number 11,411,150
- Issue date Aug 9, 2022
- Alpha Assembly Solutions Inc.
- Morgana de Avila Ribas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anodic bonding of a substrate of glass having contact vias to a sub...
- Patent number 11,398,452
- Issue date Jul 26, 2022
- X-FAB SEMICONDUCTOR FOUNDRIES GMBH
- Stefan Weinberger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP-CHIP MOUNTING STRUCTURE AND FLIP-CHIP MOUNTING METHOD
- Publication number 20240387444
- Publication date Nov 21, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- TAKAHIRO KUMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES
- Publication number 20240297114
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INT...
- Publication number 20240266320
- Publication date Aug 8, 2024
- Yibu Semiconductor Co., Ltd.
- Yifan Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU
- Publication number 20240243091
- Publication date Jul 18, 2024
- The Indium Corporation of America
- Richard McDonough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Core-Shell Particle Die-Attach Material
- Publication number 20240182757
- Publication date Jun 6, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEATSINK FOR RING TYPE INTEGRATED CIRCUITS
- Publication number 20240105549
- Publication date Mar 28, 2024
- Cisco Technology, Inc.
- Yongguo CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding
- Publication number 20240105545
- Publication date Mar 28, 2024
- Apple Inc.
- Jiongxin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Power Semiconductor Device
- Publication number 20240096842
- Publication date Mar 21, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240071875
- Publication date Feb 29, 2024
- Rohm Co., Ltd.
- Hiroyuki TAJIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20240055391
- Publication date Feb 15, 2024
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Batch Soldering of Different Elements in Power Module
- Publication number 20240047439
- Publication date Feb 8, 2024
- INFINEON TECHNOLOGIES AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Fabricating a Semiconductor Device
- Publication number 20240038714
- Publication date Feb 1, 2024
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES
- Publication number 20240030213
- Publication date Jan 25, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Dielectric Blocking Layer and Method Forming the Same
- Publication number 20230411329
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POP STRUCTURE OF THREE-DIMENSIONAL FAN-OUT MEMORY AND PACKAGING MET...
- Publication number 20230352450
- Publication date Nov 2, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAMINATION/CRACKING IMPROVEMENT AT SOLDER JOINTS IN MICROELECTRON...
- Publication number 20230326899
- Publication date Oct 12, 2023
- Qorvo US, Inc.
- Yinbao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module and Manufacturing Method
- Publication number 20230317684
- Publication date Oct 5, 2023
- Hitachi Energy Switzerland AG
- Harald Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME
- Publication number 20230290751
- Publication date Sep 14, 2023
- SAMSUNG DISPLAY CO., LTD.
- Joo Nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Fabricating a Semiconductor Pa...
- Publication number 20230290709
- Publication date Sep 14, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...
- Publication number 20230230950
- Publication date Jul 20, 2023
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Yuechen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURE METHOD...
- Publication number 20230163043
- Publication date May 25, 2023
- Huawei Technologies Co., Ltd
- Ran HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL, LAYER STRUCTURE, CHIP PACKAGE, METHOD OF FORMING A...
- Publication number 20230095749
- Publication date Mar 30, 2023
- Alexander Heinrich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of Forming Semiconductor Packages
- Publication number 20230090895
- Publication date Mar 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20230078615
- Publication date Mar 16, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Yasuaki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230060577
- Publication date Mar 2, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...
- Publication number 20230066395
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Bang-Ning Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL JOINTED BODY, SEMICONDUCTOR DEVICE, WAVE GUIDE TUBE, AND METH...
- Publication number 20230054798
- Publication date Feb 23, 2023
- Mitsubishi Electric Corporation
- Takashi IJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SYSTEM HAVING INTERMETALLIC CONNECTION STRUCTURE WITH CE...
- Publication number 20230027669
- Publication date Jan 26, 2023
- INFINEON TECHNOLOGIES AG
- Chee Yang NG
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connection structure and manufacturing method therefor

Diffusion soldering with contaminant protection

Metal joint, metal joint production method, semiconductor device, a...

Methods of forming semiconductor packages

Advanced device assembly structures and methods

Thermal interface structures for integrated circuit packages

Electronic device with multi-layer contact and system

Method of manufacturing a semiconductor device including bonding la...

Hybrid manufacturing for integrated circuit devices and assemblies

Semiconductor device and method for fabricating a semiconductor device

Semiconductor device comprising a can housing a semiconductor die w...

Display device

Batch soldering of different elements in power module

Light emitting diode display with redundancy scheme

Semiconductor device and method of manufacturing the same

Hybrid manufacturing of microeletronic assemblies with first and se...

Display module and method of manufacturing the same

Photocoupler

Semiconductor package and method for fabricating a semiconductor pa...

Semiconductor device with enhanced thermal dissipation and method f...

Diffusion soldering with contaminant protection

Ultra-thin embedded semiconductor device package and method of manu...

Chip assembly

Semiconductor package and method

Alternative compositions for high temperature soldering applications

Display device incorporating self-assembled monolayer and method of...

Ceramic circuit substrate

Soldering a conductor to an aluminum layer

Advanced solder alloys for electronic interconnects

Anodic bonding of a substrate of glass having contact vias to a sub...

Patents Applicationslast 30 patents

FLIP-CHIP MOUNTING STRUCTURE AND FLIP-CHIP MOUNTING METHOD

METHODS OF FORMING SEMICONDUCTOR PACKAGES

METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INT...

PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU

Core-Shell Particle Die-Attach Material

HEATSINK FOR RING TYPE INTEGRATED CIRCUITS

Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding

Method for Fabricating a Power Semiconductor Device

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

Batch Soldering of Different Elements in Power Module

Semiconductor Device and Method for Fabricating a Semiconductor Device

HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

Dielectric Blocking Layer and Method Forming the Same

POP STRUCTURE OF THREE-DIMENSIONAL FAN-OUT MEMORY AND PACKAGING MET...

DELAMINATION/CRACKING IMPROVEMENT AT SOLDER JOINTS IN MICROELECTRON...

Power Semiconductor Module and Manufacturing Method

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME

Semiconductor Package and Method for Fabricating a Semiconductor Pa...

SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...

SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURE METHOD...

SOLDER MATERIAL, LAYER STRUCTURE, CHIP PACKAGE, METHOD OF FORMING A...

Methods of Forming Semiconductor Packages

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...

METAL JOINTED BODY, SEMICONDUCTOR DEVICE, WAVE GUIDE TUBE, AND METH...

ELECTRONIC SYSTEM HAVING INTERMETALLIC CONNECTION STRUCTURE WITH CE...