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CPC
H01L2224/81379

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81379Material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Temporary bonding structures for die-to-die and wafer-to-wafer bonding
- Patent number 12,057,429
- Issue date Aug 6, 2024
- HRL Laboratories, LLC
- Aurelio Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-strike process for bonding packages and the packages thereof
- Patent number 10,068,868
- Issue date Sep 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-strike process for bonding
- Patent number 9,576,929
- Issue date Feb 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip packaging method and chip package using hydrophobic surface
- Patent number 9,570,415
- Issue date Feb 14, 2017
- KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Hyo Hoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element that includes multilayered bonding interface bet...
- Patent number 7,960,834
- Issue date Jun 14, 2011
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...
- Publication number 20240387432
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...
- Publication number 20240128230
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Sinyeop LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC STRUCTURE
- Publication number 20230260957
- Publication date Aug 17, 2023
- Advanced Semiconductor Engineering, Inc.
- Po-Jen CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...
- Publication number 20230057113
- Publication date Feb 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170323863
- Publication date Nov 9, 2017
- Amkor Technology, Inc.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE USING HYDROPHOBIC SURFACE
- Publication number 20150311177
- Publication date Oct 29, 2015
- Korea Advanced Institute of Science and Technology
- Hyo Hoon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SEMICONDUCTOR MO...
- Publication number 20130181344
- Publication date Jul 18, 2013
- Sanyo Electric Co., Ltd.
- Yasuyuki Yanase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Element, Electronic Element Device Using the Same, and M...
- Publication number 20090039507
- Publication date Feb 12, 2009
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Temporary bonding structures for die-to-die and wafer-to-wafer bonding

Multi-strike process for bonding packages and the packages thereof

Multi-strike process for bonding

Chip packaging method and chip package using hydrophobic surface

Electronic element that includes multilayered bonding interface bet...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...

SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...

ELECTRONIC STRUCTURE

SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGING METHOD AND CHIP PACKAGE USING HYDROPHOBIC SURFACE

SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SEMICONDUCTOR MO...

Electronic Element, Electronic Element Device Using the Same, and M...