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H01L2924/166

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/166Material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Non-embedded silicon bridge chip for multi-chip module
- Patent number 10,832,942
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Effendi Leobandung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die with integrated microphone device using through-silicon vias (T...
- Patent number 10,455,308
- Issue date Oct 22, 2019
- Intel Corporation
- Kevin J. Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor packages that include a heat pipe for exhausting heat...
- Patent number 10,446,471
- Issue date Oct 15, 2019
- Samsung Electronics Co., Ltd.
- JaeHong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structure
- Patent number 10,356,946
- Issue date Jul 16, 2019
- Kaneka Corporation
- Keisuke Oguma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip device with polymeric filler trench
- Patent number 8,866,276
- Issue date Oct 21, 2014
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip electronic packages and methods of manufacture
- Patent number 8,860,206
- Issue date Oct 14, 2014
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device and method for producing the same
- Patent number 8,794,498
- Issue date Aug 5, 2014
- Murata Manufacturing Co., Ltd.
- Yuji Kimura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
QFN/SON compatible package with SMT land pads
- Patent number 8,786,165
- Issue date Jul 22, 2014
- TSMC Solid State Lighting Ltd.
- Andreas Alfred Hase
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microwave circuit package
- Patent number 8,647,927
- Issue date Feb 11, 2014
- Thales Holdings UK PLC
- Emmanuel Loiselet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip device with polymeric filler trench
- Patent number 8,617,926
- Issue date Dec 31, 2013
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip electronic packages and methods of manufacture
- Patent number 8,592,970
- Issue date Nov 26, 2013
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency circuit package and high-frequency circuit device
- Patent number 8,552,304
- Issue date Oct 8, 2013
- Fujitsu Limited
- Satoshi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale package
- Patent number 8,466,546
- Issue date Jun 18, 2013
- International Rectifier Corporation
- Andy Farlow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nano-structured gasket for cold weld hermetic MEMS package and meth...
- Patent number 8,394,679
- Issue date Mar 12, 2013
- Stellarray, Inc.
- Mark F Eaton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Gold-tin-indium solder for processing compatibility with lead-free...
- Patent number 8,294,271
- Issue date Oct 23, 2012
- Materion Advanced Materials Technologies and Services Inc.
- Heiner Lichtenberger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component
- Patent number 8,274,797
- Issue date Sep 25, 2012
- Omron Corporation
- Kazuyuki Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of semiconductor device protection
- Patent number 8,268,670
- Issue date Sep 18, 2012
- Fujitsu Semiconductor Limited
- Kazuhiro Tashiro
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for producing a hermetically sealed, electrical feedthrough...
- Patent number 8,227,297
- Issue date Jul 24, 2012
- Siemens Aktiengesellschaft
- Jörg Naundorf
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
No-lead IC packages having integrated heat spreader for electromagn...
- Patent number 8,183,680
- Issue date May 22, 2012
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system for shielding electromagnetic int...
- Patent number 8,178,956
- Issue date May 15, 2012
- Stats Chippac Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging structure
- Patent number 8,164,181
- Issue date Apr 24, 2012
- Fujitsu Semiconductor Limited
- Kazuhiro Tashiro
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
MEMS device package with vacuum cavity by two-step solder reflow me...
- Patent number 8,058,106
- Issue date Nov 15, 2011
- MagIC Technologies, Inc.
- Mei-Ling Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Solder composition for electronic devices
- Patent number 8,022,551
- Issue date Sep 20, 2011
- Renesas Electronics Corporation
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor device packages with electromagnetic interference shi...
- Patent number 8,022,511
- Issue date Sep 20, 2011
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and method for its production
- Patent number 7,965,516
- Issue date Jun 21, 2011
- Semikron Elektronik GmbH & Co. KG
- Jürgen Steger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of semiconductor device protection, package of semiconductor...
- Patent number 7,807,481
- Issue date Oct 5, 2010
- Fujitsu Semiconductor Limited
- Kazuhiro Tashiro
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Crystal oscillator emulator
- Patent number 7,786,817
- Issue date Aug 31, 2010
- Marvell World Trade Ltd.
- Sehat Sutardja
- G11 - INFORMATION STORAGE
Information Patent Grant
Crystal oscillator emulator
- Patent number 7,768,361
- Issue date Aug 3, 2010
- Marvell World Trade Ltd.
- Sehat Sutardja
- G11 - INFORMATION STORAGE
Information Patent Grant
Crystal oscillator emulator
- Patent number 7,768,360
- Issue date Aug 3, 2010
- Marvell World Trade Ltd.
- Sehat Sutardja
- G11 - INFORMATION STORAGE
Information Patent Grant
Electromagnetic interference shield for semiconductors using a cont...
- Patent number 7,759,168
- Issue date Jul 20, 2010
- International Business Machines Corporation
- J. Richard Behun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES THAT INCLUDE A HEAT PIPE FOR EXHAUSTING HEAT...
- Publication number 20190096786
- Publication date Mar 28, 2019
- Samsung Electronics Co., Ltd.
- JaeHong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING ELECTROMAGNETIC INTERFERENCE SHIELD
- Publication number 20150037937
- Publication date Feb 5, 2015
- Samsung Electronics Co., Ltd.
- Su-Min PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN/SON-Compatible Package
- Publication number 20140329362
- Publication date Nov 6, 2014
- Andreas Alfred Hase
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH POLYMERIC FILLER TRENCH
- Publication number 20140103506
- Publication date Apr 17, 2014
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE
- Publication number 20140027898
- Publication date Jan 30, 2014
- International Business Machines Corporation
- Kamal K. SIKKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING ELECTROMAGNETIC INTERFERENCE SHIELD
- Publication number 20130256847
- Publication date Oct 3, 2013
- Samsung Electronics Co., Ltd.
- Su-Min PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE
- Publication number 20120326294
- Publication date Dec 27, 2012
- International Business Machines Corporation
- KAMAL K. SIKKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH POLYMERIC FILLER TRENCH
- Publication number 20120061852
- Publication date Mar 15, 2012
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY CIRCUIT PACKAGE AND HIGH-FREQUENCY CIRCUIT DEVICE
- Publication number 20120061133
- Publication date Mar 15, 2012
- FUJITSU LIMITED
- Satoshi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEMICONDUCTOR DEVICE PROTECTION
- Publication number 20120005875
- Publication date Jan 12, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Kazuhiro Tashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nano-structured Gasket for Cold Weld Hermetic MEMS Package and Met...
- Publication number 20110272796
- Publication date Nov 10, 2011
- Mark F. Eaton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC COMPONENT DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20110268977
- Publication date Nov 3, 2011
- Murata Manufacturing Co., Ltd.
- Yuji KIMURA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROWAVE CIRCUIT PACKAGE
- Publication number 20110210431
- Publication date Sep 1, 2011
- Thales Holdings UK PLC
- Emmanuel LOISELET
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GOLD-TIN-INDIUM SOLDER FOR PROCESSING COMPATIBILITY WITH LEAD-FREE...
- Publication number 20110180929
- Publication date Jul 28, 2011
- Heiner Lichtenberger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMS device package with vacuum cavity by two-step solder reflow me...
- Publication number 20110059567
- Publication date Mar 10, 2011
- MagIC Technologies, Inc.
- Mei-Ling Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF SEMICONDUCTOR DEVICE PROTECTION, PACKAGE OF SEMICONDUCTOR...
- Publication number 20110049699
- Publication date Mar 3, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Kazuhiro Tashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A HERMETICALLY SEALED, ELECTRICAL FEEDTHROUGH...
- Publication number 20110049729
- Publication date Mar 3, 2011
- Siemens Aktiengesellschaft
- Jörg Naundorf
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20110044017
- Publication date Feb 24, 2011
- Omron Corporation
- Kazuyuki Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LID FOR A FUNCTIONAL PART AND A PROCESS FOR ITS MANUFACTURE
- Publication number 20100291399
- Publication date Nov 18, 2010
- Rikiya Kato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20100089629
- Publication date Apr 15, 2010
- Murata Manufacturing Co., Ltd.
- Yuji KIMURA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Power Semiconductor Module And Method For Its Production
- Publication number 20100039774
- Publication date Feb 18, 2010
- SEMIKRON Elektronik GmbH & Co. KG
- Jürgen STEGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID OR CASE FOR SEALED PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100006336
- Publication date Jan 14, 2010
- Tomohiro Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device and method of manufacturing the same
- Publication number 20090288852
- Publication date Nov 26, 2009
- NEC Electronics Corporation
- Tomoaki Hirokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELD FOR SEMICONDUCTORS USING A CONT...
- Publication number 20090283876
- Publication date Nov 19, 2009
- International Business Machines Corporation
- J. Richard Behun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHI...
- Publication number 20090194852
- Publication date Aug 6, 2009
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD WELD HERMETIC MEMS PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20090151972
- Publication date Jun 18, 2009
- Stellar MicroDevices, Inc.
- Curtis Nathan Potter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM FOR SHIELDING ELECTROMAGNETIC INT...
- Publication number 20090152688
- Publication date Jun 18, 2009
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
- Publication number 20090152695
- Publication date Jun 18, 2009
- HVVI SEMICONDUCTORS, INC.
- Jeanne S. Pavio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip assembly
- Publication number 20080296709
- Publication date Dec 4, 2008
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of semiconductor device protection, package of semiconductor...
- Publication number 20080203558
- Publication date Aug 28, 2008
- FUJITSU LIMITED
- Kazuhiro Tashiro
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Non-embedded silicon bridge chip for multi-chip module

Die with integrated microphone device using through-silicon vias (T...

Semiconductor packages that include a heat pipe for exhausting heat...

Heat dissipation structure

Semiconductor chip device with polymeric filler trench

Multichip electronic packages and methods of manufacture

Electronic component device and method for producing the same

QFN/SON compatible package with SMT land pads

Microwave circuit package

Semiconductor chip device with polymeric filler trench

Multichip electronic packages and methods of manufacture

High-frequency circuit package and high-frequency circuit device

Chip-scale package

Nano-structured gasket for cold weld hermetic MEMS package and meth...

Gold-tin-indium solder for processing compatibility with lead-free...

Electronic component

Method of semiconductor device protection

Method for producing a hermetically sealed, electrical feedthrough...

No-lead IC packages having integrated heat spreader for electromagn...

Integrated circuit package system for shielding electromagnetic int...

Semiconductor device packaging structure

MEMS device package with vacuum cavity by two-step solder reflow me...

Solder composition for electronic devices

Semiconductor device packages with electromagnetic interference shi...

Power semiconductor module and method for its production

Method of semiconductor device protection, package of semiconductor...

Crystal oscillator emulator

Crystal oscillator emulator

Crystal oscillator emulator

Electromagnetic interference shield for semiconductors using a cont...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES THAT INCLUDE A HEAT PIPE FOR EXHAUSTING HEAT...

SEMICONDUCTOR DEVICES INCLUDING ELECTROMAGNETIC INTERFERENCE SHIELD

QFN/SON-Compatible Package

SEMICONDUCTOR CHIP DEVICE WITH POLYMERIC FILLER TRENCH

MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICES INCLUDING ELECTROMAGNETIC INTERFERENCE SHIELD

MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE

SEMICONDUCTOR CHIP DEVICE WITH POLYMERIC FILLER TRENCH

HIGH-FREQUENCY CIRCUIT PACKAGE AND HIGH-FREQUENCY CIRCUIT DEVICE

METHOD OF SEMICONDUCTOR DEVICE PROTECTION

Nano-structured Gasket for Cold Weld Hermetic MEMS Package and Met...

ELECTRONIC COMPONENT DEVICE AND METHOD FOR PRODUCING THE SAME

MICROWAVE CIRCUIT PACKAGE

GOLD-TIN-INDIUM SOLDER FOR PROCESSING COMPATIBILITY WITH LEAD-FREE...

MEMS device package with vacuum cavity by two-step solder reflow me...

METHOD OF SEMICONDUCTOR DEVICE PROTECTION, PACKAGE OF SEMICONDUCTOR...

METHOD FOR PRODUCING A HERMETICALLY SEALED, ELECTRICAL FEEDTHROUGH...

ELECTRONIC COMPONENT

LID FOR A FUNCTIONAL PART AND A PROCESS FOR ITS MANUFACTURE

ELECTRONIC COMPONENT DEVICE AND METHOD FOR PRODUCING THE SAME

Power Semiconductor Module And Method For Its Production

LID OR CASE FOR SEALED PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Electronic device and method of manufacturing the same

ELECTROMAGNETIC INTERFERENCE SHIELD FOR SEMICONDUCTORS USING A CONT...

SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHI...

COLD WELD HERMETIC MEMS PACKAGE AND METHOD OF MANUFACTURE

INTEGRATED CIRCUIT PACKAGE SYSTEM FOR SHIELDING ELECTROMAGNETIC INT...

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Chip assembly

Method of semiconductor device protection, package of semiconductor...