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H01L2224/13099

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13099Material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer and a bump
- Patent number 12,080,663
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 12,074,127
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 12,051,616
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having electrode pads arranged between groups...
- Patent number 11,901,251
- Issue date Feb 13, 2024
- Rohm Co., Ltd.
- Kunihiro Komiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,887,957
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,876,053
- Issue date Jan 16, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with hollow interconnectors
- Patent number 11,876,074
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit test structure and method of using
- Patent number 11,828,790
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,824,008
- Issue date Nov 21, 2023
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer and a bump
- Patent number 11,817,408
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded packaging concepts for integration of ASICs and optical co...
- Patent number 11,651,976
- Issue date May 16, 2023
- Apple Inc.
- Kishore N. Renjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 11,631,611
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 11,600,522
- Issue date Mar 7, 2023
- Renesas Electronics Corporation
- Katsuhiko Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer and a bump
- Patent number 11,557,556
- Issue date Jan 17, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,538,782
- Issue date Dec 27, 2022
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 11,515,272
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making flip chip
- Patent number RE49286
- Issue date Nov 8, 2022
- Research & Business Foundation SUNGKYUNKWAN UNIV
- Seung Boo Jung
Information Patent Grant
Semiconductor device having electrode pads arranged between groups...
- Patent number 11,410,900
- Issue date Aug 9, 2022
- Rohm Co., Ltd.
- Kunihiro Komiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an inductor
- Patent number 11,393,782
- Issue date Jul 19, 2022
- Renesas Electronics Corporation
- Yasutaka Nakashiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die features for self-alignment during die bonding
- Patent number 11,302,653
- Issue date Apr 12, 2022
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices having stacked interconnect elemen...
- Patent number 11,217,556
- Issue date Jan 4, 2022
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 11,201,129
- Issue date Dec 14, 2021
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and process for implementing accelerated test conditions for...
- Patent number 11,175,333
- Issue date Nov 16, 2021
- Cree, Inc.
- Daniel Jenner Lichtenwalner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D packaging with low-force thermocompression bonding of oxidizable...
- Patent number 11,134,598
- Issue date Sep 28, 2021
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,069,591
- Issue date Jul 20, 2021
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 11,062,938
- Issue date Jul 13, 2021
- Renesas Electronics Corporation
- Katsuhiko Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution metal and under bump metal interconnect structures a...
- Patent number 11,049,829
- Issue date Jun 29, 2021
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20240234228
- Publication date Jul 11, 2024
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20240136241
- Publication date Apr 25, 2024
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT TEST STRUCTURE AND METHOD OF USING
- Publication number 20240094282
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HOLLOW INTERCONNECTORS
- Publication number 20240063176
- Publication date Feb 22, 2024
- NANYA TECHNOLOGY CORPORATION
- YI-HSIEN CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
- Publication number 20240047390
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Packaging Concepts for Integration of ASICs and Optical Co...
- Publication number 20230386865
- Publication date Nov 30, 2023
- Apple Inc.
- Kishore N. Renjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURES FOR LOW TEMPERATURE CHIP BONDING
- Publication number 20230369270
- Publication date Nov 16, 2023
- Northrop Grumman Systems Corporation
- JUSTIN C. HACKLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20230187275
- Publication date Jun 15, 2023
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
- Publication number 20230154876
- Publication date May 18, 2023
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230146085
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230108516
- Publication date Apr 6, 2023
- Samsung Electronics Co., Ltd.
- JUBIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Contact Structure and Method
- Publication number 20230085696
- Publication date Mar 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20220336305
- Publication date Oct 20, 2022
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...
- Publication number 20220122938
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20220059484
- Publication date Feb 24, 2022
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210320077
- Publication date Oct 14, 2021
- Samsung Electronics Co., Ltd.
- JUBIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210313245
- Publication date Oct 7, 2021
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20210296165
- Publication date Sep 23, 2021
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
- Publication number 20210280541
- Publication date Sep 9, 2021
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT TEST STRUCTURE AND METHOD OF USING
- Publication number 20210231730
- Publication date Jul 29, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fang CHEN
- G01 - MEASURING TESTING
Information Patent Application
Embedded Packaging Concepts for Integration of ASICs and Optical Co...
- Publication number 20210090908
- Publication date Mar 25, 2021
- Apple Inc.
- Kishore N. Renjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Contact Structure and Method
- Publication number 20210074627
- Publication date Mar 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
- Publication number 20210043591
- Publication date Feb 11, 2021
- Samsung Electronics Co., Ltd.
- Minjung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20200411370
- Publication date Dec 31, 2020
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Features for Self-Alignment During Die Bonding
- Publication number 20200373252
- Publication date Nov 26, 2020
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20200251394
- Publication date Aug 6, 2020
- ROHM CO., LTD.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20200235131
- Publication date Jul 23, 2020
- Renesas Electronics Corporation
- Akihiko YOSHIOKA
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20200211897
- Publication date Jul 2, 2020
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...
- Publication number 20200211931
- Publication date Jul 2, 2020
- RENESAS ELECTRONICS CORPORATION
- Masahiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION METAL AND UNDER BUMP METAL INTERCONNECT STRUCTURES A...
- Publication number 20200105698
- Publication date Apr 2, 2020
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-chip package and method of providing die-to-die interconnects...

Semiconductor devices including a thick metal layer and a bump

Semiconductor die contact structure and method

Semiconductor device and method for manufacturing semiconductor device

Wafer level chip scale packaging intermediate structure apparatus a...

Semiconductor device having electrode pads arranged between groups...

Semiconductor device

Multi-chip package and method of providing die-to-die interconnects...

Semiconductor device with hollow interconnectors

Circuit test structure and method of using

Multi-chip package and method of providing die-to-die interconnects...

Semiconductor devices including a thick metal layer and a bump

Embedded packaging concepts for integration of ASICs and optical co...

Wafer level chip scale packaging intermediate structure apparatus a...

Semiconductor device and a method of manufacturing the same

Semiconductor devices including a thick metal layer and a bump

Semiconductor device

Semiconductor die contact structure and method

Method of making flip chip

Semiconductor device having electrode pads arranged between groups...

Semiconductor device having an inductor

Die features for self-alignment during die bonding

Method of making a pillar structure having a non-metal sidewall pro...

Packaged microelectronic devices having stacked interconnect elemen...

Designs and methods for conductive bumps

System and process for implementing accelerated test conditions for...

3D packaging with low-force thermocompression bonding of oxidizable...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and a method of manufacturing the same

Redistribution metal and under bump metal interconnect structures a...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

CIRCUIT TEST STRUCTURE AND METHOD OF USING

SEMICONDUCTOR DEVICE WITH HOLLOW INTERCONNECTORS

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP

Embedded Packaging Concepts for Integration of ASICs and Optical Co...

BUMP STRUCTURES FOR LOW TEMPERATURE CHIP BONDING

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

Semiconductor Die Contact Structure and Method

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP

CIRCUIT TEST STRUCTURE AND METHOD OF USING

Embedded Packaging Concepts for Integration of ASICs and Optical Co...

Semiconductor Die Contact Structure and Method

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Die Features for Self-Alignment During Die Bonding

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...

REDISTRIBUTION METAL AND UNDER BUMP METAL INTERCONNECT STRUCTURES A...