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H01L23/4827

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/4827Materials

Industries

Patents Grantslast 30 patents

Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 12,112,999
- Issue date Oct 8, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 12,057,374
- Issue date Aug 6, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with separate communication and heat dissipation paths
- Patent number 12,040,249
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Sreenivasan Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an electrically insulating core with e...
- Patent number 12,014,964
- Issue date Jun 18, 2024
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,756,863
- Issue date Sep 12, 2023
- Kabushiki Kaisha Toshiba
- Hiroshi Kono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices, and related microelectr...
- Patent number 11,710,724
- Issue date Jul 25, 2023
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,710,680
- Issue date Jul 25, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with graphene conductive structure and method...
- Patent number 11,587,828
- Issue date Feb 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Ching-Cheng Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic switching device with a three-dimensionally prefor...
- Patent number 11,581,245
- Issue date Feb 14, 2023
- Semikron Elektronik GmbH & Co. KG
- Michael Schatz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,552,003
- Issue date Jan 10, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of manufacturing thereof
- Patent number 11,502,012
- Issue date Nov 15, 2022
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,495,520
- Issue date Nov 8, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,430,715
- Issue date Aug 30, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,387,170
- Issue date Jul 12, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,355,422
- Issue date Jun 7, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,328,983
- Issue date May 10, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,296,014
- Issue date Apr 5, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices, and related microelectr...
- Patent number 11,282,815
- Issue date Mar 22, 2022
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,264,308
- Issue date Mar 1, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with conductors embedded in a substrate
- Patent number 11,201,106
- Issue date Dec 14, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with interconnect structure and method for pre...
- Patent number 11,177,194
- Issue date Nov 16, 2021
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,062,994
- Issue date Jul 13, 2021
- ADVANCED SEMICONDUCOR ENGINEERING, INC.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit architecture
- Patent number 10,998,273
- Issue date May 4, 2021
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin semiconductor component fabrication using a dielectric s...
- Patent number 10,818,613
- Issue date Oct 27, 2020
- Infineon Technologies Americas Corp.
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with backside metalization and production metho...
- Patent number 10,796,918
- Issue date Oct 6, 2020
- STMicroelectronics S.r.l.
- Alessandra Alberti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to a final substrate
- Patent number 10,790,190
- Issue date Sep 29, 2020
- ELPIS TECHNOLOGIES INC.
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with improved reliability
- Patent number 10,707,858
- Issue date Jul 7, 2020
- Cree, Inc.
- Mrinal K. Das
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method for manufacturing a semiconductor component and a semiconduc...
- Patent number 10,658,187
- Issue date May 19, 2020
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ELECTRICALLY INSULATING CORE WITH E...
- Publication number 20240332099
- Publication date Oct 3, 2024
- INFINEON TECHNOLOGIES AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240213122
- Publication date Jun 27, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kenichi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D NAND MEMORY DEVICE DEVICES AND RELATED ELECTRONIC SYSTEMS
- Publication number 20230361083
- Publication date Nov 9, 2023
- Lodestar Licensing Group, LLC
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230335470
- Publication date Oct 19, 2023
- Kabushiki Kaisha Toshiba
- Hiroshi KONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AMPLIFYING DEVICE, AND METHOD OF MANUFACTURIN...
- Publication number 20230326832
- Publication date Oct 12, 2023
- Fujitsu Limited
- Tsuyoshi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE (CSP) SEMICONDUCTOR DEVICE HAVING THIN SUBSTRATE
- Publication number 20230307325
- Publication date Sep 28, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Lin Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20230120515
- Publication date Apr 20, 2023
- Shinko Electric Industries Co., Ltd.
- Hikaru TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND ELECTRONIC DEVICE THAT INCLUDES SEMICON...
- Publication number 20230104555
- Publication date Apr 6, 2023
- Huawei Technologies Co., Ltd
- Yan Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having an Electrically Insulating Core with E...
- Publication number 20230077139
- Publication date Mar 9, 2023
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE TAPE FOR SEMICONDUCTOR PACKAGE MANUFACTURING PROCESS, AND...
- Publication number 20220220345
- Publication date Jul 14, 2022
- MODU TECH CO., LTD.
- Byeong Yeon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20220149015
- Publication date May 12, 2022
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF DEVICES WITH ENHANCED PERFORMANCE AND METHODS OF FORMING THE SAME
- Publication number 20220108938
- Publication date Apr 7, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220093491
- Publication date Mar 24, 2022
- Kabushiki Kaisha Toshiba
- Hiroshi KONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC SWITCHING DEVICE WITH A THREE-DIMENSIONALLY PREFOR...
- Publication number 20220068768
- Publication date Mar 3, 2022
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- MICHAEL SCHATZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH GRAPHENE CONDUCTIVE STRUCTURE AND METHOD...
- Publication number 20220051936
- Publication date Feb 17, 2022
- NANYA TECHNOLOGY CORPORATION
- Ching-Cheng CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20210233823
- Publication date Jul 29, 2021
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Conductors Embedded in a Substrate
- Publication number 20210233834
- Publication date Jul 29, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20210217730
- Publication date Jul 15, 2021
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH SEPARATE COMMUNICATION AND HEAT DISSIPATION PATHS
- Publication number 20210202345
- Publication date Jul 1, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE AND METHOD FOR PRE...
- Publication number 20210193559
- Publication date Jun 24, 2021
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210020579
- Publication date Jan 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF DEVICES WITH ENHANCED PERFORMANCE AND METHODS OF FORMING THE SAME
- Publication number 20200235040
- Publication date Jul 23, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact and System
- Publication number 20200075530
- Publication date Mar 5, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING CROSS CONTAMINATION DURING MANUFACTURE OF COPPER...
- Publication number 20190333815
- Publication date Oct 31, 2019
- SKYWORKS SOLUTIONS, INC.
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING GAAS INTEGRATED CIRCUITS WITH ALTERNATIVE B...
- Publication number 20190333816
- Publication date Oct 31, 2019
- SKYWORKS SOLUTIONS, INC.
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO A FINAL SUBSTRATE
- Publication number 20190267285
- Publication date Aug 29, 2019
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-Thin Semiconductor Component Fabrication Using a Dielectric S...
- Publication number 20190229072
- Publication date Jul 25, 2019
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR PACKAGING CIRCUIT COMPONENT HAVING COPPER CIRCUITS WITH...
- Publication number 20190228985
- Publication date Jul 25, 2019
- Chih-liang Hu
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same

Packages with separate communication and heat dissipation paths

Semiconductor package having an electrically insulating core with e...

Electronic device with multi-layer contact and system

Semiconductor device

Methods of forming microelectronic devices, and related microelectr...

RF devices with enhanced performance and methods of forming the same

Semiconductor device with graphene conductive structure and method...

Power electronic switching device with a three-dimensionally prefor...

RF devices with enhanced performance and methods of forming the same

Chip assembly

Semiconductor packages and methods of manufacturing thereof

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same

Methods of forming microelectronic devices, and related microelectr...

RF devices with enhanced performance and methods of forming the same

Semiconductor device with conductors embedded in a substrate

Semiconductor device with interconnect structure and method for pre...

Semiconductor device package and method of manufacturing the same

Hybrid integrated circuit architecture

Ultra-thin semiconductor component fabrication using a dielectric s...

Integrated circuits with backside metalization and production metho...

Backside contact to a final substrate

Power module with improved reliability

Method for manufacturing a semiconductor component and a semiconduc...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING AN ELECTRICALLY INSULATING CORE WITH E...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

3D NAND MEMORY DEVICE DEVICES AND RELATED ELECTRONIC SYSTEMS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, AMPLIFYING DEVICE, AND METHOD OF MANUFACTURIN...

CHIP SCALE PACKAGE (CSP) SEMICONDUCTOR DEVICE HAVING THIN SUBSTRATE

INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR APPARATUS AND ELECTRONIC DEVICE THAT INCLUDES SEMICON...

Semiconductor Package Having an Electrically Insulating Core with E...

ADHESIVE TAPE FOR SEMICONDUCTOR PACKAGE MANUFACTURING PROCESS, AND...

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

RF DEVICES WITH ENHANCED PERFORMANCE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE

POWER ELECTRONIC SWITCHING DEVICE WITH A THREE-DIMENSIONALLY PREFOR...

SEMICONDUCTOR DEVICE WITH GRAPHENE CONDUCTIVE STRUCTURE AND METHOD...

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

Semiconductor Device with Conductors Embedded in a Substrate

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

PACKAGES WITH SEPARATE COMMUNICATION AND HEAT DISSIPATION PATHS

SEMICONDUCTOR DEVICE WITH INTERCONNECT STRUCTURE AND METHOD FOR PRE...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

RF DEVICES WITH ENHANCED PERFORMANCE AND METHODS OF FORMING THE SAME

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

Electronic Device with Multi-Layer Contact and System

METHOD OF REDUCING CROSS CONTAMINATION DURING MANUFACTURE OF COPPER...

METHOD OF MANUFACTURING GAAS INTEGRATED CIRCUITS WITH ALTERNATIVE B...

BACKSIDE CONTACT TO A FINAL SUBSTRATE

Ultra-Thin Semiconductor Component Fabrication Using a Dielectric S...

PROCESS FOR PACKAGING CIRCUIT COMPONENT HAVING COPPER CIRCUITS WITH...