Materials

Industry

CPC
H05K2201/0137

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0137Materials

Industries

Patents Grantslast 30 patents

Information Patent Grant
Nanocomposite material for ultraviolet curable direct write semicon...
- Patent number 12,096,561
- Issue date Sep 17, 2024
- Raytheon Company
- Craig A. Armiento
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Interconnect structure surface modifications by passivating agents
- Patent number 12,036,578
- Issue date Jul 16, 2024
- Intel Corporation
- Florian Gstrein
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Magnetic material filled printed circuit boards and printed circuit...
- Patent number 11,751,330
- Issue date Sep 5, 2023
- E-Circuit Motors, Inc.
- George Harder Milheim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising ceramic layer and ceramic housing
- Patent number 11,497,121
- Issue date Nov 8, 2022
- Samsung Electronics Co., Ltd.
- Hoyoung Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Metal base circuit board and method of manufacturing the metal base...
- Patent number 11,490,513
- Issue date Nov 1, 2022
- NHK Spring Co., Ltd.
- Katsumi Mizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, metal foil provided with resin layer, metal clad...
- Patent number 11,419,210
- Issue date Aug 16, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Toshifumi Matsushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer laminate and method for producing multilayer printed wir...
- Patent number 11,285,700
- Issue date Mar 29, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with high-capacity copper circuit
- Patent number 11,160,166
- Issue date Oct 26, 2021
- Avary Holding (Shenzhen) Co., Limited.
- Fang-Bo Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit assembly
- Patent number 11,122,689
- Issue date Sep 14, 2021
- MBDA UK Limited
- Adam Armitage
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with dielectric surface switch and embedded metamater...
- Patent number 11,056,089
- Issue date Jul 6, 2021
- Sparton DeLeon Springs, LLC
- Lendon L. Bendix
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-dielectric resin composition
- Patent number 10,982,093
- Issue date Apr 20, 2021
- Arisawa Mfg. Co., Ltd.
- Kazuo Yoshikawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Pluggable printed circuit board and optical module having a gap bet...
- Patent number 10,912,200
- Issue date Feb 2, 2021
- Hisense Broadband Multimedia Technologies Co., Ltd.
- Wei Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a composite conductive film
- Patent number 10,782,804
- Issue date Sep 22, 2020
- Sinovia Technologies
- Whitney Gaynor
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of forming a composite conductive film
- Patent number 10,234,969
- Issue date Mar 19, 2019
- Sinovia Technologies
- Whitney Gaynor
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing conductive layer and wiring board
- Patent number 10,015,890
- Issue date Jul 3, 2018
- Fujikura Ltd.
- Masahiro Kaizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and optical module comprising solder resist h...
- Patent number 9,999,130
- Issue date Jun 12, 2018
- Hisense Broadband Multimedia Technologies Co., Ltd
- Wei Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulation film and method for making insulation film
- Patent number 9,942,989
- Issue date Apr 10, 2018
- Illinois Tool Works Inc.
- Hongchuan Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a printed circuit board with high-capacity...
- Patent number 9,907,167
- Issue date Feb 27, 2018
- Avary Holding (Shenzhen) Co., Limited.
- Fang-Bo Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connection of electrical wires to flexible conductive el...
- Patent number 9,860,982
- Issue date Jan 2, 2018
- XSENSOR Technology Corporation
- Ian Main
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible electronic assembly method
- Patent number 9,820,384
- Issue date Nov 14, 2017
- Intel Corporation
- Sasha Oster
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Laminate substrates having radial cut metallic planes
- Patent number 9,818,682
- Issue date Nov 14, 2017
- International Business Machines Corporation
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active chip package substrate and method for preparing the same
- Patent number 9,730,329
- Issue date Aug 8, 2017
- Institute of Microelectronics, Chinese Academy of Sciences
- Zhongyao Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making stretchable interconnect using magnet wires
- Patent number 9,674,949
- Issue date Jun 6, 2017
- Flextronics AP, LLC
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layer stack for a touch panel and method for forming a layer stack
- Patent number 9,652,055
- Issue date May 16, 2017
- Applied Materials, Inc.
- Neil Morrison
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Polyhexahydrotriazine dielectrics
- Patent number 9,650,471
- Issue date May 16, 2017
- International Business Machines Corporation
- Dylan J. Boday
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyhexahydrotriazine dielectrics
- Patent number 9,617,385
- Issue date Apr 11, 2017
- International Business Machines Corporation
- Dylan J. Boday
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded electronic devices to round wire
- Patent number 9,595,501
- Issue date Mar 14, 2017
- Automated Assembly Corporation
- Robert Neuman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical measures to limit stress and strain in deformable electr...
- Patent number 9,521,748
- Issue date Dec 13, 2016
- Multek Technologies, Ltd.
- Mark Bergman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite conductive films with enhanced surface hardness
- Patent number 9,491,853
- Issue date Nov 8, 2016
- Sinovia Technologies
- Whitney Gaynor
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Prepreg comprising polyphenylene ether particles
- Patent number 9,485,861
- Issue date Nov 1, 2016
- Asahi Kasei E-Materials Corporation
- Masaaki Endo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY S...
- Publication number 20240268037
- Publication date Aug 8, 2024
- Takaroa Corporation, Inc.
- Ethan M. Devine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUCTION COOKING HOB HAVING TWO BOARD ELEMENTS ELECTRICALLY AND ME...
- Publication number 20240260190
- Publication date Aug 1, 2024
- Electrolux Appliances Aktiebolag
- Alex VIROLI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE COMPRISING SEALING MEMBER
- Publication number 20230413427
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Seongki JEONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING BOARD
- Publication number 20230240009
- Publication date Jul 27, 2023
- TOPPAN INC.
- Takeshi TAKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NANOCOMPOSITE MATERIAL FOR ULTRAVIOLET CURABLE DIRECT WRITE SEMICON...
- Publication number 20230139276
- Publication date May 4, 2023
- Raytheon Company
- Craig A. Armiento
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC MATERIAL FILLED PRINTED CIRCUIT BOARDS AND PRINTED CIRCUIT...
- Publication number 20230036536
- Publication date Feb 2, 2023
- E-Circuit Motors, Inc.
- George Harder Milheim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20220287174
- Publication date Sep 8, 2022
- LG Innotek Co., Ltd.
- Yong Suk KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hydrophobic Low-Dielectric-Constant Film and Preparation Method The...
- Publication number 20220145460
- Publication date May 12, 2022
- JIANGSU FAVORED NANOTECHNOLOGY CO., LTD.
- Jian Zong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRONIC DEVICE COMPRISING CERAMIC LAYER AND CERAMIC HOUSING
- Publication number 20210298174
- Publication date Sep 23, 2021
- Samsung Electronics Co., LTD
- Hoyoung LEE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CIRCUIT ASSEMBLY
- Publication number 20200315020
- Publication date Oct 1, 2020
- MBDA UK LIMITED
- Adam ARMITAGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR MANUFACTURING A FUNCTIONAL FLEXIBLE CELLULOSIC SUBSTRAT...
- Publication number 20200305278
- Publication date Sep 24, 2020
- INSTITUT POLYTECHNIQUE DE GRENOBLE
- Denis CURTIL
- D21 - PAPER-MAKING PRODUCTION OF CELLULOSE
Information Patent Application
CIRCUIT BOARD WITH DIELECTRIC SURFACE SWITCH AND EMBEDDED METAMATER...
- Publication number 20200098344
- Publication date Mar 26, 2020
- Sparton Corporation
- Lendon L. Bendix
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING PACKAGE SUBSTRATE CONTAINING NON-HOMOG...
- Publication number 20190279935
- Publication date Sep 12, 2019
- Intel Corporation
- David Allen UNRUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board And Optical Module
- Publication number 20180270954
- Publication date Sep 20, 2018
- HISENSE BROADBAND MULIMEDIA TECHNOLOGIES CO. LTD.
- Wei ZHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE ELECTRONIC ASSEMBLY METHOD
- Publication number 20180263117
- Publication date Sep 13, 2018
- Intel Corporation
- Sasha N. Oster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD WITH HIGH-CAPACITY COPPER CIRCUIT
- Publication number 20180139842
- Publication date May 17, 2018
- Avary Holding (Shenzhen) Co., Limited.
- FANG-BO XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CONDUCTIVE LAYER AND WIRING BOARD
- Publication number 20180027668
- Publication date Jan 25, 2018
- FUJIKURA LTD.
- Masahiro Kaizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL BASE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE METAL BASE...
- Publication number 20170332488
- Publication date Nov 16, 2017
- NHK Spring Co., Ltd.
- Katsumi MIZUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OVERMOLDED PLASTIC COMPONENTS FORMED ON METALLIC PLATES
- Publication number 20170273180
- Publication date Sep 21, 2017
- Apple Inc.
- David J. Drennan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CURABLE COMPOSITION, PREPREG, METAL FOIL WITH RESIN, METAL-CLAD LAM...
- Publication number 20170226302
- Publication date Aug 10, 2017
- HIROSUKE SAITO
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED CIRCUIT BOARD AND OPTICAL MODULE
- Publication number 20170181283
- Publication date Jun 22, 2017
- HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD
- Wei ZHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA LOW LOSS DIELECTRIC THERMOSETTING RESIN COMPOSITIONS AND HIGH...
- Publication number 20160249451
- Publication date Aug 25, 2016
- NOVOSET, LLC
- Sajal Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FINE LINE 3D NON-PLANAR CONFORMING CIRCUIT
- Publication number 20160105970
- Publication date Apr 14, 2016
- Lockheed Martin Corporation
- Stephen Gonya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board And Method For Fabricating The Same, And Appa...
- Publication number 20150382459
- Publication date Dec 31, 2015
- Shih-Chuan Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATION FILM AND METHOD FOR MAKING INSULATION FILM
- Publication number 20150373853
- Publication date Dec 24, 2015
- Illinois Tool Works, Inc.
- Hongchuan LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICALLY SPACED ELECTRODE STRUCTURE
- Publication number 20150257260
- Publication date Sep 10, 2015
- Carolyn Rae Ellinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150250050
- Publication date Sep 3, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Chang Bo LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR LIGHT-EMITTING DIODE
- Publication number 20150237710
- Publication date Aug 20, 2015
- NGK Insulators, Ltd.
- Shinsuke YANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20150237741
- Publication date Aug 20, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Yong Jin PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND USE THEREOF
- Publication number 20150189747
- Publication date Jul 2, 2015
- Shengyi Technology Co., Ltd.
- Xianping ZENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Nanocomposite material for ultraviolet curable direct write semicon...

Interconnect structure surface modifications by passivating agents

Magnetic material filled printed circuit boards and printed circuit...

Electronic device comprising ceramic layer and ceramic housing

Metal base circuit board and method of manufacturing the metal base...

Resin composition, metal foil provided with resin layer, metal clad...

Multilayer laminate and method for producing multilayer printed wir...

Printed circuit board with high-capacity copper circuit

Circuit assembly

Circuit board with dielectric surface switch and embedded metamater...

Low-dielectric resin composition

Pluggable printed circuit board and optical module having a gap bet...

Method of forming a composite conductive film

Method of forming a composite conductive film

Method of manufacturing conductive layer and wiring board

Printed circuit board and optical module comprising solder resist h...

Insulation film and method for making insulation film

Method for manufacturing a printed circuit board with high-capacity...

Electrical connection of electrical wires to flexible conductive el...

Flexible electronic assembly method

Laminate substrates having radial cut metallic planes

Active chip package substrate and method for preparing the same

Method of making stretchable interconnect using magnet wires

Layer stack for a touch panel and method for forming a layer stack

Polyhexahydrotriazine dielectrics

Polyhexahydrotriazine dielectrics

Wire bonded electronic devices to round wire

Mechanical measures to limit stress and strain in deformable electr...

Composite conductive films with enhanced surface hardness

Prepreg comprising polyphenylene ether particles

Patents Applicationslast 30 patents

ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY S...

INDUCTION COOKING HOB HAVING TWO BOARD ELEMENTS ELECTRICALLY AND ME...

ELECTRONIC DEVICE COMPRISING SEALING MEMBER

WIRING BOARD

NANOCOMPOSITE MATERIAL FOR ULTRAVIOLET CURABLE DIRECT WRITE SEMICON...

MAGNETIC MATERIAL FILLED PRINTED CIRCUIT BOARDS AND PRINTED CIRCUIT...

CIRCUIT BOARD

Hydrophobic Low-Dielectric-Constant Film and Preparation Method The...

ELECTRONIC DEVICE COMPRISING CERAMIC LAYER AND CERAMIC HOUSING

CIRCUIT ASSEMBLY

PROCESS FOR MANUFACTURING A FUNCTIONAL FLEXIBLE CELLULOSIC SUBSTRAT...

CIRCUIT BOARD WITH DIELECTRIC SURFACE SWITCH AND EMBEDDED METAMATER...

SEMICONDUCTOR PACKAGE HAVING PACKAGE SUBSTRATE CONTAINING NON-HOMOG...

Printed Circuit Board And Optical Module

FLEXIBLE ELECTRONIC ASSEMBLY METHOD

PRINTED CIRCUIT BOARD WITH HIGH-CAPACITY COPPER CIRCUIT

METHOD OF MANUFACTURING CONDUCTIVE LAYER AND WIRING BOARD

METAL BASE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE METAL BASE...

OVERMOLDED PLASTIC COMPONENTS FORMED ON METALLIC PLATES

CURABLE COMPOSITION, PREPREG, METAL FOIL WITH RESIN, METAL-CLAD LAM...

PRINTED CIRCUIT BOARD AND OPTICAL MODULE

ULTRA LOW LOSS DIELECTRIC THERMOSETTING RESIN COMPOSITIONS AND HIGH...

FINE LINE 3D NON-PLANAR CONFORMING CIRCUIT

Printed Circuit Board And Method For Fabricating The Same, And Appa...

INSULATION FILM AND METHOD FOR MAKING INSULATION FILM

VERTICALLY SPACED ELECTRODE STRUCTURE

EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE FOR LIGHT-EMITTING DIODE

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

THERMOSETTING RESIN COMPOSITION AND USE THEREOF