TREA

Means for aligning

Follow

Industry

  • CPC
  • H01L2224/777
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/777Means for aligning
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PACKAGE DEVICE PREVENTING SOLDER OVERFLOW
    • Publication number 20230395553
    • Publication date Dec 7, 2023
    • PANJIT INTERNATIONAL INC.
    • CHUNG-HSIUNG HO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE
    • Publication number 20230395555
    • Publication date Dec 7, 2023
    • HYUNDAI MOBIS CO., LTD.
    • Se Min PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND JIG SET
    • Publication number 20230154889
    • Publication date May 18, 2023
    • Fuji Electric Co., Ltd.
    • Manabu ISHIKAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CLIP BOND SEMICONDUCTOR PACKAGES AND ASSEMBLY TOOLS
    • Publication number 20210118840
    • Publication date Apr 22, 2021
    • UTAC Headquarters Pte. Ltd.
    • Albert Louis Bove
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Window Clamp
    • Publication number 20180261568
    • Publication date Sep 13, 2018
    • TEXAS INSTRUMENTS INCORPORATED
    • Ruby Ann Maya Merto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Window Clamp
    • Publication number 20180261567
    • Publication date Sep 13, 2018
    • TEXAS INSTRUMENTS INCORPORATED
    • Ruby Ann Maya Merto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    • Publication number 20180254267
    • Publication date Sep 6, 2018
    • Fuji Electric Co., Ltd.
    • Kenichiro SATO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME
    • Publication number 20140048584
    • Publication date Feb 20, 2014
    • Orthodyne Electronics Corporation
    • Christoph B. Luechinger
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    STACKED LEADFRAME IMPLEMENTATION FOR DC/DC CONVERTOR POWER MODULE I...
    • Publication number 20120119343
    • Publication date May 17, 2012
    • TEXAS INSTRUMENTS INCORPORATED
    • Jaime A. Bayan
    • H01 - BASIC ELECTRIC ELEMENTS