Means for bonding being attached to, or being formed on, the surface to be connected

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Monolithic surface mount passive component
- Patent number 12,142,402
- Issue date Nov 12, 2024
- SanDisk Technologies, Inc.
- Ai-Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with bump
- Patent number 12,119,320
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 11,842,972
- Issue date Dec 12, 2023
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated decoupling capacitors
- Patent number 11,810,877
- Issue date Nov 7, 2023
- Cisco Technology, Inc.
- Vipulkumar K. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-containing aluminum nitride particles, method for producing...
- Patent number 11,807,528
- Issue date Nov 7, 2023
- Nichia Corporation
- Shimpei Kinoshita
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Sensor integrated circuit (IC) with opposite facing ambient light s...
- Patent number 11,790,816
- Issue date Oct 17, 2023
- QUALCOMM Incorporated
- Venkatesh Sadineni
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Eutectic bonding with AlGe
- Patent number 11,724,933
- Issue date Aug 15, 2023
- Rohm Co., Ltd.
- Martin Heller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Technique for handling diced wafers of integrated circuits
- Patent number 11,658,056
- Issue date May 23, 2023
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Connection terminal pattern and layout for three-level buck regulator
- Patent number 11,601,051
- Issue date Mar 7, 2023
- QUALCOMM Incorporated
- Chengyue Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaging mechanisms for dies with different sizes of connectors
- Patent number 11,488,878
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-optical device and electronic apparatus
- Patent number 11,448,925
- Issue date Sep 20, 2022
- Seiko Epson Corporation
- Shinsuke Fujikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an electrical connection between semico...
- Patent number 11,417,625
- Issue date Aug 16, 2022
- Murata Manufacturing Co., Ltd.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with bump
- Patent number 11,410,956
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 11,355,462
- Issue date Jun 7, 2022
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach methods and semiconductor devices manufactured based on...
- Patent number 11,296,015
- Issue date Apr 5, 2022
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Responding to a failure of a main die of a switch data-plane device
- Patent number 11,251,245
- Issue date Feb 15, 2022
- XSIGHT LABS LTD.
- Carmi Arad
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor packages including die over-shift indicating patterns
- Patent number 11,239,177
- Issue date Feb 1, 2022
- SK hynix Inc.
- Sukwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated decoupling capacitors
- Patent number 11,227,847
- Issue date Jan 18, 2022
- Cisco Technology, Inc.
- Vipulkumar K. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for transmitting power to a remote PoE subsystem by forwardi...
- Patent number 11,188,133
- Issue date Nov 30, 2021
- ClearOne, Inc.
- Ed Thurmond
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System for transmitting power to a remote PoE subsystem by forwardi...
- Patent number 11,181,959
- Issue date Nov 23, 2021
- ClearOne, Inc.
- Ed Thurmond
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Detection of a suspect counterfeit part by chromatography
- Patent number 11,125,731
- Issue date Sep 21, 2021
- IEC Electronics Corp.
- Mark Northrup
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preventing contamination of LED die
- Patent number 11,127,876
- Issue date Sep 21, 2021
- Lumileds LLC
- Yue Chau Kwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor package
- Patent number 10,971,429
- Issue date Apr 6, 2021
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, a tangent probe card and a probe head assembly for testing...
- Patent number 10,962,570
- Issue date Mar 30, 2021
- Wing Cheuk Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging mechanisms for dies with different sizes of connectors
- Patent number 10,964,610
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die crack detection
- Patent number 10,908,210
- Issue date Feb 2, 2021
- SanDisk Technologies LLC
- Kirubakaran Periyannan
- G11 - INFORMATION STORAGE
Information Patent Grant
Chip package structure with bump
- Patent number 10,854,565
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach methods and semiconductor devices manufactured based on...
- Patent number 10,832,992
- Issue date Nov 10, 2020
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 10,818,628
- Issue date Oct 27, 2020
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an electrical connection between semico...
- Patent number 10,804,238
- Issue date Oct 13, 2020
- Murata Manufacturing Co., Ltd.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Chip Package Structure with Bump
- Publication number 20240387431
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20240055384
- Publication date Feb 15, 2024
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-CONTAINING ALUMINUM NITRIDE PARTICLES, METHOD FOR PRODUCING...
- Publication number 20230416090
- Publication date Dec 28, 2023
- Nichia Corporation.
- Shimpei KINOSHITA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
MONOLITHIC SURFACE MOUNT PASSIVE COMPONENT
- Publication number 20220399306
- Publication date Dec 15, 2022
- Western Digital Technologies, Inc.
- Ai-Wen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Structure with Bump
- Publication number 20220359447
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DECOUPLING CAPACITORS
- Publication number 20220077084
- Publication date Mar 10, 2022
- Cisco Technology, Inc.
- Vipulkumar K. PATEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Mechanisms for Dies with Different Sizes of Connectors
- Publication number 20210217672
- Publication date Jul 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System for Transmitting Power to a Remote PoE Subsystem by forwardi...
- Publication number 20210141432
- Publication date May 13, 2021
- CLEARONE, INC.
- Ed Thurmond
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Chip Package Structure with Bump
- Publication number 20210082855
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20210013132
- Publication date Jan 14, 2021
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AN ELECTRICAL CONNECTION BETWEEN SEMICO...
- Publication number 20200411465
- Publication date Dec 31, 2020
- MURATA MANUFACTURING CO., LTD.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION TERMINAL PATTERN AND LAYOUT FOR THREE-LEVEL BUCK REGULATOR
- Publication number 20200403514
- Publication date Dec 24, 2020
- QUALCOMM Incorporated
- Chengyue YU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM, A TANGENT PROBE CARD AND A PROBE HEAD ASSEMBLY FOR TESTING...
- Publication number 20200363453
- Publication date Nov 19, 2020
- Wing Cheuk LEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System for Transmitting Power to a Remote PoE Subsystem by forwardi...
- Publication number 20200233473
- Publication date Jul 23, 2020
- CLEARONE, INC.
- Ed Thurmond
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SILICON-CONTAINING ALUMINUM NITRIDE PARTICLES, METHOD FOR PRODUCING...
- Publication number 20200198968
- Publication date Jun 25, 2020
- Nichia Corporation.
- Shimpei KINOSHITA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS
- Publication number 20200203281
- Publication date Jun 25, 2020
- SEIKO EPSON CORPORATION
- Shinsuke FUJIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR PACKAGE
- Publication number 20200194340
- Publication date Jun 18, 2020
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PREVENTING CONTAMINATION OF LED DIE
- Publication number 20200135963
- Publication date Apr 30, 2020
- Lumileds LLC
- Yue Chau KWAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CRACK DETECTION
- Publication number 20200103462
- Publication date Apr 2, 2020
- SanDisk Technologies LLC
- Kirubakaran PERIYANNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGING STRUCTURE FOR AN IMAGE SENSOR
- Publication number 20200058618
- Publication date Feb 20, 2020
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM CHUCK FOR BONDING SUBSTRATES, APPARATUS FOR BONDING SUBSTRAT...
- Publication number 20200020562
- Publication date Jan 16, 2020
- Samsung Electronics Co., Ltd.
- Ki-Ju SOHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20190348347
- Publication date Nov 14, 2019
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190295970
- Publication date Sep 26, 2019
- Kabushiki Kaisha Toshiba
- Hiroshi Matsuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System for Transmitting Power to a Remote PoE Subsystem by forwardi...
- Publication number 20190278348
- Publication date Sep 12, 2019
- CLEARONE, INC.
- Edgar Thurmond
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190227115
- Publication date Jul 25, 2019
- Fuji Electric Co., Ltd.
- Yuji TAKEMATSU
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF PREVENTING CONTAMINATION OF LED DIE
- Publication number 20190189833
- Publication date Jun 20, 2019
- Lumileds LLC
- Yue Chau KWAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190103338
- Publication date Apr 4, 2019
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190103337
- Publication date Apr 4, 2019
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor Modules Having Support Structures
- Publication number 20190082084
- Publication date Mar 14, 2019
- Samsung Electronics Co., Ltd.
- Shle Ge Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190067036
- Publication date Feb 28, 2019
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS

Means for bonding being attached to, or being formed on, the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Monolithic surface mount passive component

Chip package structure with bump

Semiconductor device with a semiconductor chip connected in a flip...

Integrated decoupling capacitors

Silicon-containing aluminum nitride particles, method for producing...

Sensor integrated circuit (IC) with opposite facing ambient light s...

Eutectic bonding with AlGe

Technique for handling diced wafers of integrated circuits

Connection terminal pattern and layout for three-level buck regulator

Packaging mechanisms for dies with different sizes of connectors

Electro-optical device and electronic apparatus

Semiconductor device having an electrical connection between semico...

Chip package structure with bump

Semiconductor device with a semiconductor chip connected in a flip...

Die attach methods and semiconductor devices manufactured based on...

Responding to a failure of a main die of a switch data-plane device

Semiconductor packages including die over-shift indicating patterns

Integrated decoupling capacitors

System for transmitting power to a remote PoE subsystem by forwardi...

System for transmitting power to a remote PoE subsystem by forwardi...

Detection of a suspect counterfeit part by chromatography

Method of preventing contamination of LED die

Method for forming a semiconductor package

System, a tangent probe card and a probe head assembly for testing...

Packaging mechanisms for dies with different sizes of connectors

Die crack detection

Chip package structure with bump

Die attach methods and semiconductor devices manufactured based on...

Semiconductor device with a semiconductor chip connected in a flip...

Semiconductor device having an electrical connection between semico...

Patents Applicationslast 30 patents

Chip Package Structure with Bump

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

SILICON-CONTAINING ALUMINUM NITRIDE PARTICLES, METHOD FOR PRODUCING...

MONOLITHIC SURFACE MOUNT PASSIVE COMPONENT

Chip Package Structure with Bump

INTEGRATED DECOUPLING CAPACITORS

Packaging Mechanisms for Dies with Different Sizes of Connectors

System for Transmitting Power to a Remote PoE Subsystem by forwardi...

Chip Package Structure with Bump

Die Attach Methods and Semiconductor Devices Manufactured based on...

SEMICONDUCTOR DEVICE HAVING AN ELECTRICAL CONNECTION BETWEEN SEMICO...

CONNECTION TERMINAL PATTERN AND LAYOUT FOR THREE-LEVEL BUCK REGULATOR

SYSTEM, A TANGENT PROBE CARD AND A PROBE HEAD ASSEMBLY FOR TESTING...

System for Transmitting Power to a Remote PoE Subsystem by forwardi...

SILICON-CONTAINING ALUMINUM NITRIDE PARTICLES, METHOD FOR PRODUCING...

ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS

METHOD FOR FORMING A SEMICONDUCTOR PACKAGE

METHOD OF PREVENTING CONTAMINATION OF LED DIE

DIE CRACK DETECTION

STACK PACKAGING STRUCTURE FOR AN IMAGE SENSOR

VACUUM CHUCK FOR BONDING SUBSTRATES, APPARATUS FOR BONDING SUBSTRAT...

Die Attach Methods and Semiconductor Devices Manufactured based on...

SEMICONDUCTOR DEVICE

System for Transmitting Power to a Remote PoE Subsystem by forwardi...

SEMICONDUCTOR DEVICE

METHOD OF PREVENTING CONTAMINATION OF LED DIE

FLEXIBLE SEMICONDUCTOR PACKAGE AND RELATED METHODS

FLEXIBLE SEMICONDUCTOR PACKAGE AND RELATED METHODS

Image Sensor Modules Having Support Structures

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME