Means for cleaning

Industry

CPC
H01L2224/7801

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/7801Means for cleaning

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of vertically vibrating a bonding arm
- Patent number 11,302,667
- Issue date Apr 12, 2022
- Kaijo Corporation
- Riki Jindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die attachment apparatus and method utilizing activated forming gas
- Patent number 10,399,170
- Issue date Sep 3, 2019
- ASM Technology Singapore Pte. Ltd.
- Kui Kam Lam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wire bonding machine cleaning device and method
- Patent number 10,361,169
- Issue date Jul 23, 2019
- International Test Solutions, Inc.
- Alan E. Humphrey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wire bonding machine cleaning device and method
- Patent number 9,825,000
- Issue date Nov 21, 2017
- International Test Solutions, Inc.
- Alan E. Humphrey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wedge bonder and a method of cleaning a wedge bonder
- Patent number 8,657,181
- Issue date Feb 25, 2014
- ASM Technology Singapore Pte. Ltd.
- Chi Wah Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELF-CLEANING WIRE BONDING MACHINE
- Publication number 20210162470
- Publication date Jun 3, 2021
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- YAN-XIN FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR WIRE PREPARATION
- Publication number 20190372294
- Publication date Dec 5, 2019
- The Charles Stark Draper Laboratory, Inc.
- Mitchell W. Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING SYSTEMS FOR WIRE BONDING TOOLS, WIRE BONDING MACHINES INCL...
- Publication number 20190237427
- Publication date Aug 1, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Peter Klaerner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR WIRE BONDING MACHINE CLEANING DEVICE AND METHOD
- Publication number 20180308821
- Publication date Oct 25, 2018
- International Test Solutions, Inc.
- Alan E. Humphrey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20180151532
- Publication date May 31, 2018
- KAIJO CORPORATION
- Riki JINDO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS AND BONDING TOOL CLEANING METHOD
- Publication number 20160351536
- Publication date Dec 1, 2016
- SHINKAWA LTD.
- Toru Maeda
- B08 - CLEANING
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20140332583
- Publication date Nov 13, 2014
- SHINKAWA LTD.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR CLEANING BOND WIRE
- Publication number 20140110461
- Publication date Apr 24, 2014
- Mohd Rusli Ibrahim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS AND BONDING TOOL CLEANING METHOD
- Publication number 20140034712
- Publication date Feb 6, 2014
- SHINKAWA LTD.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEDGE BONDER AND A METHOD OF CLEANING A WEDGE BONDER
- Publication number 20130341377
- Publication date Dec 26, 2013
- Chi Wah CHENG
- H01 - BASIC ELECTRIC ELEMENTS

Means for cleaning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of vertically vibrating a bonding arm

Die attachment apparatus and method utilizing activated forming gas

Semiconductor wire bonding machine cleaning device and method

Semiconductor wire bonding machine cleaning device and method

Wedge bonder and a method of cleaning a wedge bonder

Patents Applicationslast 30 patents

SELF-CLEANING WIRE BONDING MACHINE

APPARATUS AND METHOD FOR WIRE PREPARATION

CLEANING SYSTEMS FOR WIRE BONDING TOOLS, WIRE BONDING MACHINES INCL...

SEMICONDUCTOR WIRE BONDING MACHINE CLEANING DEVICE AND METHOD

WIRE BONDING APPARATUS

BONDING APPARATUS AND BONDING TOOL CLEANING METHOD

WIRE BONDING APPARATUS

SYSTEM AND METHOD FOR CLEANING BOND WIRE

BONDING APPARATUS AND BONDING TOOL CLEANING METHOD

WEDGE BONDER AND A METHOD OF CLEANING A WEDGE BONDER