Means for controlling the bonding environment

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H01L2224/751

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/751Means for controlling the bonding environment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 12,142,603
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,136,604
- Issue date Nov 5, 2024
- Shinkawa Ltd.
- Hideharu Nihei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for exhaust gas purification device
- Patent number 12,121,858
- Issue date Oct 22, 2024
- Cataler Corporation
- Yuki Kido
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
- Patent number 12,096,554
- Issue date Sep 17, 2024
- Xerox Corporation
- Naveen Chopra
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bonding systems, and methods of providing a reducing gas on a bondi...
- Patent number 12,062,636
- Issue date Aug 13, 2024
- Kulicke and Soffa Industries, Inc.
- Adeel Ahmad Bajwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Emissive element harvest
- Patent number 11,929,356
- Issue date Mar 12, 2024
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding cavity structure and bonding method
- Patent number 11,916,040
- Issue date Feb 27, 2024
- Shanghai IC R&D Center Co., Ltd.
- Xinyu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extending life cycles of vacuum pumps used in manufacturing processes
- Patent number 11,905,955
- Issue date Feb 20, 2024
- Kashiyama Industries, Ltd.
- Yoshinori Christopher Dokko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for the characterization of emissive elements
- Patent number 11,855,051
- Issue date Dec 26, 2023
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,837,574
- Issue date Dec 5, 2023
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,776,932
- Issue date Oct 3, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 11,735,575
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 11,651,983
- Issue date May 16, 2023
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,626,383
- Issue date Apr 11, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Methods of bonding of semiconductor elements to substrates, and rel...
- Patent number 11,616,042
- Issue date Mar 28, 2023
- Kulicke and Soffa Industries, Inc.
- Adeel Ahmad Bajwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting system
- Patent number 11,587,804
- Issue date Feb 21, 2023
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 11,521,950
- Issue date Dec 6, 2022
- Kioxia Corporation
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of bonding of semiconductor elements to substrates, and rel...
- Patent number 11,515,286
- Issue date Nov 29, 2022
- Kulicke and Soffa Industries, Inc.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
- Patent number 11,510,314
- Issue date Nov 22, 2022
- Xerox Corporation
- Naveen Chopra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch processing oven and method
- Patent number 11,444,053
- Issue date Sep 13, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonder
- Patent number 11,367,702
- Issue date Jun 21, 2022
- Tazmo Co., Ltd.
- Masaaki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for processing semiconductor devices
- Patent number 11,355,471
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow oven for batch processing
- Patent number 11,335,662
- Issue date May 17, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for the characterization and dispersal of emissiv...
- Patent number 11,315,910
- Issue date Apr 26, 2022
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting head
- Patent number 11,302,666
- Issue date Apr 12, 2022
- Shinkawa Ltd.
- Manato Nishide
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for the selective harvest of emissive elements
- Patent number 11,296,059
- Issue date Apr 5, 2022
- eLux Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing a semiconductor device
- Patent number 11,227,779
- Issue date Jan 18, 2022
- ASM Technology Singapore Pte. Ltd.
- Jiapei Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of bonding of semiconductor elements to substrates, and rel...
- Patent number 11,205,633
- Issue date Dec 21, 2021
- Kulicke and Soffa Industries, Inc.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP BONDING DEVICE
- Publication number 20240404985
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- BONGKEN YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEMS, AND METHODS OF PROVIDING A REDUCING GAS ON A BONDI...
- Publication number 20240363580
- Publication date Oct 31, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR FLUXLESS THERMOCOMPRESSION BONDING
- Publication number 20240339430
- Publication date Oct 10, 2024
- ASMPT SINGAPORE PTE. LTD
- Zetao MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SEMICONDUCTOR CHIP
- Publication number 20240332245
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Dae Seo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEMS FOR BONDING A SEMICONDUCTOR ELEMENT TO A SUBSTRATE,...
- Publication number 20240266318
- Publication date Aug 8, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME
- Publication number 20240120310
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B08 - CLEANING
Information Patent Application
BONDING SYSTEMS FOR BONDING A SEMICONDUCTOR ELEMENT TO A SUBSTRATE,...
- Publication number 20240063169
- Publication date Feb 22, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INERT GAS CHAMBER
- Publication number 20240047412
- Publication date Feb 8, 2024
- MRSI Systems LLC
- Dennis Carew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSION TYPE LASER REFLOW APPARATUS WITH VACUUM CHAMBER
- Publication number 20230387069
- Publication date Nov 30, 2023
- LASERSSEL CO., LTD.
- Jae Joon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEMS, AND METHODS OF PROVIDING A REDUCING GAS ON A BONDI...
- Publication number 20230326903
- Publication date Oct 12, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20230299067
- Publication date Sep 21, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MONITORING GAS BYPRODUCTS OF A BONDING SYSTEM, AND RELAT...
- Publication number 20230260953
- Publication date Aug 17, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Matthew B. Wasserman
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...
- Publication number 20230090693
- Publication date Mar 23, 2023
- Fasford Technology Co., Ltd.
- Geonju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20230054378
- Publication date Feb 23, 2023
- KIOXIA Corporation
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD USING THE SAME
- Publication number 20230057934
- Publication date Feb 23, 2023
- SAMSUNG DISPLAY CO., LTD.
- SANGDUK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE DIPPING STRUCTURE
- Publication number 20230023353
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Chun Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID NANOSILVER/LIQUID METAL INK COMPOSITION AND USES THEREOF
- Publication number 20220418104
- Publication date Dec 29, 2022
- Xerox Corporation
- Naveen CHOPRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20220406747
- Publication date Dec 22, 2022
- SHINKAWA LTD.
- Hideharu NIHEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20220384412
- Publication date Dec 1, 2022
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20220375799
- Publication date Nov 24, 2022
- TOKYO ELECTRON LIMITED
- Tetsuya Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20220302079
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING CAVITY STRUCTURE AND BONDING METHOD
- Publication number 20220068875
- Publication date Mar 3, 2022
- Shanghai IC R&D Center Co., Ltd.
- Xinyu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND REL...
- Publication number 20210391297
- Publication date Dec 16, 2021
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20210358879
- Publication date Nov 18, 2021
- TOKYO ELECTRON LIMITED
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH PROCESSING OVEN AND METHOD
- Publication number 20210265301
- Publication date Aug 26, 2021
- Yield Engineering Systems, Inc.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND REL...
- Publication number 20210265303
- Publication date Aug 26, 2021
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVALENTLY BONDED SEMICONDUCTOR INTERFACES
- Publication number 20210225803
- Publication date Jul 22, 2021
- G-ray Industries SA
- Hans VON KÄNEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING
- Publication number 20210104488
- Publication date Apr 8, 2021
- DANFOSS SILICON POWER GMBH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY

Means for controlling the bonding environment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding of bridge to multiple semiconductor chips

Tools and systems for processing semiconductor devices, and methods...

Bonding apparatus and bonding method

Manufacturing method for exhaust gas purification device

Hybrid nanosilver/liquid metal ink composition and uses thereof

Bonding systems, and methods of providing a reducing gas on a bondi...

Emissive element harvest

Bonding cavity structure and bonding method

Extending life cycles of vacuum pumps used in manufacturing processes

System for the characterization of emissive elements

Bonding apparatus and bonding method

Process and device for low-temperature pressure sintering

Bonding of bridge to multiple semiconductor chips

Apparatus, system, and method for handling aligned wafer pairs

Process and device for low-temperature pressure sintering

Methods of bonding of semiconductor elements to substrates, and rel...

Component mounting system

Semiconductor manufacturing apparatus and method of manufacturing s...

Methods of bonding of semiconductor elements to substrates, and rel...

Chip assembly

Hybrid nanosilver/liquid metal ink composition and uses thereof

Batch processing oven and method

Bonder

System for processing semiconductor devices

Solder reflow oven for batch processing

System and method for the characterization and dispersal of emissiv...

Mounting head

System and method for the selective harvest of emissive elements

Apparatus and method for processing a semiconductor device

Methods of bonding of semiconductor elements to substrates, and rel...

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP BONDING DEVICE

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

BONDING SYSTEMS, AND METHODS OF PROVIDING A REDUCING GAS ON A BONDI...

SYSTEM AND METHOD FOR FLUXLESS THERMOCOMPRESSION BONDING

DEVICE AND METHOD FOR BONDING SEMICONDUCTOR CHIP

BONDING SYSTEMS FOR BONDING A SEMICONDUCTOR ELEMENT TO A SUBSTRATE,...

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME

BONDING SYSTEMS FOR BONDING A SEMICONDUCTOR ELEMENT TO A SUBSTRATE,...

INERT GAS CHAMBER

COMPRESSION TYPE LASER REFLOW APPARATUS WITH VACUUM CHAMBER

BONDING SYSTEMS, AND METHODS OF PROVIDING A REDUCING GAS ON A BONDI...

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

METHODS OF MONITORING GAS BYPRODUCTS OF A BONDING SYSTEM, AND RELAT...

DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

BONDING APPARATUS AND BONDING METHOD USING THE SAME

SEMICONDUCTOR DIE DIPPING STRUCTURE

HYBRID NANOSILVER/LIQUID METAL INK COMPOSITION AND USES THEREOF

BONDING APPARATUS AND BONDING METHOD

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

BONDING APPARATUS AND BONDING METHOD

Tools and Systems for Processing Semiconductor Devices, and Methods...

BONDING CAVITY STRUCTURE AND BONDING METHOD

METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND REL...

BONDING APPARATUS AND BONDING METHOD

BATCH PROCESSING OVEN AND METHOD

METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND REL...

COVALENTLY BONDED SEMICONDUCTOR INTERFACES

PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING