Means for drawing solder

Industry

CPC
H05K2203/046

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/046Means for drawing solder

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component mounting substrate and manufacturing method th...
- Patent number 11,516,923
- Issue date Nov 29, 2022
- Koito Manufacturing Co., Ltd.
- Shinya Kusazaki
- F21 - LIGHTING
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,304,307
- Issue date Apr 12, 2022
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Preparation of solder bump for compatibility with printed electroni...
- Patent number 11,122,692
- Issue date Sep 14, 2021
- Raytheon Company
- James E. Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an electric circuit comprising a circuit carri...
- Patent number 11,056,460
- Issue date Jul 6, 2021
- Siemens Aktiengesellschaft
- Stefan Pfefferlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead free solder columns and methods for making same
- Patent number 10,937,752
- Issue date Mar 2, 2021
- TOPLINE CORPORATION
- Martin B. Hart
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrates with ultra fine pitch flip chip bumps
- Patent number 10,779,417
- Issue date Sep 15, 2020
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic board and mounting sheet
- Patent number 10,660,216
- Issue date May 19, 2020
- Lenovo (Singapore) Pte. Ltd.
- Tadashi Kosuga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluid discharge device, fluid discharge method, and fluid applicati...
- Patent number 10,632,492
- Issue date Apr 28, 2020
- Senju Metal Industry Co., Ltd.
- Takashi Nauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting electronic part, circuit substrate, and image fo...
- Patent number 10,492,304
- Issue date Nov 26, 2019
- Canon Kabushiki Kaisha
- Masayuki Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder columns and methods for making same
- Patent number 10,477,698
- Issue date Nov 12, 2019
- TOPLINE CORPORATION
- Martin B. Hart
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure mounted with electronic component
- Patent number 10,342,130
- Issue date Jul 2, 2019
- Murata Manufacturing Co., Ltd.
- Kiyoyuki Nakagawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Printed circuit board and method for producing a printed circuit board
- Patent number 10,327,325
- Issue date Jun 18, 2019
- ZK W Group GmbH
- Erik Edlinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and image pickup apparatus
- Patent number 10,327,335
- Issue date Jun 18, 2019
- Olympus Corporation
- Takahiro Shimohata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Special electric component, printed circuit board assembly, and met...
- Patent number 10,264,679
- Issue date Apr 16, 2019
- The Procter & Gamble Company
- Christian Ellsaesser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Portable terminal and a component mounting method
- Patent number 10,257,332
- Issue date Apr 9, 2019
- Samsung Electronics Co., Ltd.
- Manho Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Composite electronic component and board having the same
- Patent number 10,229,790
- Issue date Mar 12, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Sang Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for solder flow control in three-dimensional mi...
- Patent number 10,076,042
- Issue date Sep 11, 2018
- NUVOTRONICS, INC.
- David W. Sherrer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Flexible printed circuit board, planar light source apparatus, disp...
- Patent number 9,970,597
- Issue date May 15, 2018
- Omron Corporation
- Kensuke Nambu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Hybrid low metal loading flux
- Patent number 9,950,393
- Issue date Apr 24, 2018
- Intel Corporation
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component, semiconductor-mounted product including th...
- Patent number 9,925,612
- Issue date Mar 27, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasuo Fukuhara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-embedded substrate
- Patent number 9,918,381
- Issue date Mar 13, 2018
- Murata Manufacturing Co., Ltd.
- Satoru Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buttoned soldering pad for use with fine-pitch hot bar soldering
- Patent number 9,900,982
- Issue date Feb 20, 2018
- Finisar Corporation
- Henry Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,837,369
- Issue date Dec 5, 2017
- RENESAS ELECTRONICS CORPORATION
- Yoshikazu Shimote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Suspension board with circuit and method of manufacturing the same
- Patent number 9,763,334
- Issue date Sep 12, 2017
- Nitto Denko Corporation
- Terukazu Ihara
- G11 - INFORMATION STORAGE
Information Patent Grant
Component-mounted structure
- Patent number 9,756,728
- Issue date Sep 5, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production method of component-embedded substrate, and component-em...
- Patent number 9,730,322
- Issue date Aug 8, 2017
- Murata Manufacturing Co., Ltd.
- Yuki Wakabayashi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Mounting member, electronic component, and method for manufacturing...
- Patent number 9,673,141
- Issue date Jun 6, 2017
- Canon Kabushiki Kaisha
- Ichiro Kataoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate
- Patent number 9,655,240
- Issue date May 16, 2017
- Kabushiki Kaisha Toyota Jidoshokki
- Kiminori Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for solder flow control in three-dimensional mi...
- Patent number 9,505,613
- Issue date Nov 29, 2016
- NUVOTRONICS, INC.
- David W. Sherrer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic component and method of manufacturing electronic component
- Patent number 9,496,088
- Issue date Nov 15, 2016
- TDK Corporation
- Yukihiko Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method and System for Generating Spray Patterns, Electronic Device,...
- Publication number 20240244759
- Publication date Jul 18, 2024
- VAYO (SHANGHAI) TECHNOLOGY CO., LTD.
- Yongjian QU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING ARRANGEMENT
- Publication number 20240155766
- Publication date May 9, 2024
- ROBERT BOSCH GmbH
- Guenter Gera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURIN...
- Publication number 20240147624
- Publication date May 2, 2024
- Canon Kabushiki Kaisha
- NORITAKE TSUBOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING CI...
- Publication number 20230134246
- Publication date May 4, 2023
- Shinko Electric Industries Co., Ltd.
- Hikaru Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPARATION OF SOLDER BUMP FOR COMPATIBILITY WITH PRINTED ELECTRONI...
- Publication number 20210400820
- Publication date Dec 23, 2021
- Raytheon Company
- James E. Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board and Terminal
- Publication number 20210352803
- Publication date Nov 11, 2021
- Huawei Technologies Co., Ltd
- Liping Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20210037660
- Publication date Feb 4, 2021
- IBIDEN CO., LTD.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SUBSTRATE AND MANUFACTURING METHOD TH...
- Publication number 20200367365
- Publication date Nov 19, 2020
- Koito Manufacturing Co., Ltd.
- Shinya Kusazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC BOARD AND MOUNTING SHEET
- Publication number 20200163227
- Publication date May 21, 2020
- LENOVO (SINGAPORE) PTE. LTD.
- Tadashi Kosuga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING AN ELECTRIC CIRCUIT
- Publication number 20190393187
- Publication date Dec 26, 2019
- SIEMENS AKTIENGESELLSCHAFT
- STEFAN PFEFFERLEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LOW METAL LOADING FLUX
- Publication number 20180236609
- Publication date Aug 23, 2018
- Intel Corporation
- Rajen S. SIDHU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING METHOD AND PRINTED CIRCUIT BOAR...
- Publication number 20180206346
- Publication date Jul 19, 2018
- Kuo-Ping YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180047695
- Publication date Feb 15, 2018
- RENESAS ELECTRONICS CORPORATION
- Yoshikazu SHIMOTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID DISCHARGE DEVICE, FLUID DISCHARGE METHOD, AND FLUID APPLICATI...
- Publication number 20180021803
- Publication date Jan 25, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Takashi NAUCHI
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Substrates with Ultra Fine Pitch Flip Chip Bumps
- Publication number 20170374747
- Publication date Dec 28, 2017
- Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies C...
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSPENSION BOARD WITH CIRCUIT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140345920
- Publication date Nov 27, 2014
- Nitto Denko Corporation
- Terukazu IHARA
- G11 - INFORMATION STORAGE
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MOUNTING COMPONENTS ON THE PRIN...
- Publication number 20140318850
- Publication date Oct 30, 2014
- Junnosuke Yokoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20140311775
- Publication date Oct 23, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHAO-RONG LAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC CIRCUIT BOARD AND PROCESS FOR PRODUCING SAME
- Publication number 20140291385
- Publication date Oct 2, 2014
- Hiromasa KATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD SOLDER MOUNTING METHOD AND SOLDER MOUNT STRUC...
- Publication number 20140291006
- Publication date Oct 2, 2014
- Fujitsu Limited
- Keiichi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MOUNTING INTEGRATED CIRCUIT PAC...
- Publication number 20140284080
- Publication date Sep 25, 2014
- Tech-Front (Shanghai) Computer Co. Ltd.
- Jing ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERDIGITATED CHIP CAPACITOR ASSEMBLY
- Publication number 20140227891
- Publication date Aug 14, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Allan Jerome Daen Rapales
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISK HAVING AN ELECTRIC CONNECTING ELEMENT
- Publication number 20140182932
- Publication date Jul 3, 2014
- SAINT-GOBAIN GLASS FRANCE
- Harald Cholewa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFAC...
- Publication number 20140174795
- Publication date Jun 26, 2014
- Canon Kabushiki Kaisha
- Keigo Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140041920
- Publication date Feb 13, 2014
- Canon Kabushiki Kaisha
- Hideaki Hirasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID LOW METAL LOADING FLUX
- Publication number 20130341379
- Publication date Dec 26, 2013
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND SOLDERING METHOD
- Publication number 20130327563
- Publication date Dec 12, 2013
- Takahiro KITAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED SUBSTRATE MODULE
- Publication number 20130062111
- Publication date Mar 14, 2013
- UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.
- HSUN-FA LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Chip Scale Package
- Publication number 20130026638
- Publication date Jan 31, 2013
- Efren M. Lacap
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20120313489
- Publication date Dec 13, 2012
- TDK Corporation
- Yukihiko SHIRAKAWA
- H01 - BASIC ELECTRIC ELEMENTS

Means for drawing solder

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component mounting substrate and manufacturing method th...

Printed wiring board and method for manufacturing printed wiring board

Preparation of solder bump for compatibility with printed electroni...

Method for producing an electric circuit comprising a circuit carri...

Lead free solder columns and methods for making same

Substrates with ultra fine pitch flip chip bumps

Method of manufacturing electronic board and mounting sheet

Fluid discharge device, fluid discharge method, and fluid applicati...

Method of mounting electronic part, circuit substrate, and image fo...

Solder columns and methods for making same

Structure mounted with electronic component

Printed circuit board and method for producing a printed circuit board

Connection structure and image pickup apparatus

Special electric component, printed circuit board assembly, and met...

Portable terminal and a component mounting method

Composite electronic component and board having the same

Devices and methods for solder flow control in three-dimensional mi...

Flexible printed circuit board, planar light source apparatus, disp...

Hybrid low metal loading flux

Semiconductor component, semiconductor-mounted product including th...

Component-embedded substrate

Buttoned soldering pad for use with fine-pitch hot bar soldering

Semiconductor device and manufacturing method thereof

Suspension board with circuit and method of manufacturing the same

Component-mounted structure

Production method of component-embedded substrate, and component-em...

Mounting member, electronic component, and method for manufacturing...

Substrate

Devices and methods for solder flow control in three-dimensional mi...

Electronic component and method of manufacturing electronic component

Patents Applicationslast 30 patents

Method and System for Generating Spray Patterns, Electronic Device,...

CONNECTING ARRANGEMENT

ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURIN...

CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING CI...

PREPARATION OF SOLDER BUMP FOR COMPATIBILITY WITH PRINTED ELECTRONI...

Printed Circuit Board and Terminal

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

ELECTRONIC COMPONENT MOUNTING SUBSTRATE AND MANUFACTURING METHOD TH...

METHOD OF MANUFACTURING ELECTRONIC BOARD AND MOUNTING SHEET

METHOD FOR PRODUCING AN ELECTRIC CIRCUIT

HYBRID LOW METAL LOADING FLUX

PRINTED CIRCUIT BOARD MANUFACTURING METHOD AND PRINTED CIRCUIT BOAR...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

FLUID DISCHARGE DEVICE, FLUID DISCHARGE METHOD, AND FLUID APPLICATI...

Substrates with Ultra Fine Pitch Flip Chip Bumps

SUSPENSION BOARD WITH CIRCUIT AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF MOUNTING COMPONENTS ON THE PRIN...

CIRCUIT BOARD STRUCTURE

CERAMIC CIRCUIT BOARD AND PROCESS FOR PRODUCING SAME

PRINTED CIRCUIT BOARD SOLDER MOUNTING METHOD AND SOLDER MOUNT STRUC...

PRINTED CIRCUIT BOARD AND METHOD OF MOUNTING INTEGRATED CIRCUIT PAC...

INTERDIGITATED CHIP CAPACITOR ASSEMBLY

DISK HAVING AN ELECTRIC CONNECTING ELEMENT

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFAC...

PRINTED CIRCUIT BOARD

HYBRID LOW METAL LOADING FLUX

PRINTED WIRING BOARD AND SOLDERING METHOD

STACKED SUBSTRATE MODULE

Wafer-Level Chip Scale Package

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT