Means for supplying the connector to be connected in the bonding apparatus

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H01L2224/756

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/756Means for supplying the connector to be connected in the bonding apparatus

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding system and bonding method
- Patent number 12,261,147
- Issue date Mar 25, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses for handling microelectronic devices
- Patent number 12,251,841
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Kuan Wei Tseng
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Mounting apparatus
- Patent number 12,191,276
- Issue date Jan 7, 2025
- Shinkawa Ltd.
- Alexander Dzhangirov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chip transferring and device/module having gas guiding st...
- Patent number 12,106,981
- Issue date Oct 1, 2024
- MICRAFT SYSTEM PLUS CO., LTD.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus and securing assembly therefor
- Patent number 12,074,133
- Issue date Aug 27, 2024
- GUANGZHOU AIFO LIGHT COMMUNICATION TECHNOLOGY COMPANY LTD.
- Guoqiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer tool and method for transferring semiconductor chips
- Patent number 12,020,973
- Issue date Jun 25, 2024
- Osram Opto Semiconductors GmbH
- Andreas Plöβl
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
System and method for connecting electronic assemblies
- Patent number 12,021,058
- Issue date Jun 25, 2024
- PINK GMBH THERMOSYSTEME
- Christoph Oetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for semiconductor device bonding
- Patent number 11,990,445
- Issue date May 21, 2024
- PYXIS CF PTE. LTD.
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid attach process and dispenser head
- Patent number 11,972,956
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method of fluidic assembly of microchips on a substrate
- Patent number 11,942,450
- Issue date Mar 26, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Melina Haupt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding for chip conveying apparatus
- Patent number 11,929,344
- Issue date Mar 12, 2024
- Disco Corporation
- Hiromitsu Yoshimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for enhanced microelectronic device handling
- Patent number 11,911,904
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Kuan Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laned belt for cleaner
- Patent number 11,872,600
- Issue date Jan 16, 2024
- Illinois Tool Works Inc.
- John Neiderman
- B08 - CLEANING
Information Patent Grant
Electronic device
- Patent number 11,843,085
- Issue date Dec 12, 2023
- Innolux Corporation
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser bonding apparatus for three-dimensional molded sculptures
- Patent number 11,813,688
- Issue date Nov 14, 2023
- LASERSSEL CO., LTD.
- Jae Joon Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Tape carrier assemblies having an integrated adhesive film
- Patent number 11,764,133
- Issue date Sep 19, 2023
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,749,667
- Issue date Sep 5, 2023
- Kioxia Corporation
- Toshihiko Ohda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 11,749,541
- Issue date Sep 5, 2023
- Shinkawa Ltd.
- Shigeyuki Sekiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for and method for aligning dipoles and method of fabrica...
- Patent number 11,728,196
- Issue date Aug 15, 2023
- Samsung Display Co., Ltd.
- Won Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement and method for joining at least two joining partners
- Patent number 11,676,933
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Steffen Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 11,651,983
- Issue date May 16, 2023
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package and apparatus for p...
- Patent number 11,646,294
- Issue date May 9, 2023
- Samsung Electronics Co., Ltd.
- Ungkeol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for bonding semiconductor substrate
- Patent number 11,631,652
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,626,295
- Issue date Apr 11, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder member mounting system
- Patent number 11,583,948
- Issue date Feb 21, 2023
- Samsung Electronics Co., Ltd.
- Soo-Hwan Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting system
- Patent number 11,587,804
- Issue date Feb 21, 2023
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for direct transfer of semiconductor device die
- Patent number 11,562,990
- Issue date Jan 24, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic-assisted solder transfer
- Patent number 11,541,472
- Issue date Jan 3, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
IC CHIP MOUNTING APPARATUS AND IC CHIP MOUNTING METHOD
- Publication number 20250183223
- Publication date Jun 5, 2025
- Sato Holdings Kabushiki Kaisha
- Yoshimitsu MAEDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP TRANSFER DEVICE, CHIP TRANSFER METHOD AND MAGNETIC DIE BONDING...
- Publication number 20250157978
- Publication date May 15, 2025
- BOE MLED TECHNOLOGY CO., LTD.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, METHOD OF MANUFACTURING SEMI...
- Publication number 20250140738
- Publication date May 1, 2025
- Mitsubishi Electric Corporation
- Takeru ZAIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL MOUNTING APPARATUS WITH BALL ATTACH VOLUME CONTROL
- Publication number 20250096189
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chen Chao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20250087625
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Young WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING DEVICE AND BONDING METHOD
- Publication number 20250015039
- Publication date Jan 9, 2025
- TORAY ENGINEERING CO., LTD.
- Tatsuya OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...
- Publication number 20240404988
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...
- Publication number 20240404989
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240363579
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Seungyeop Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR FLUXLESS THERMOCOMPRESSION BONDING
- Publication number 20240339430
- Publication date Oct 10, 2024
- ASMPT SINGAPORE PTE. LTD
- Zetao MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLY DONOR AND METHOD FOR MANUFACTURING DISPLAY DEVICE USI...
- Publication number 20240258270
- Publication date Aug 1, 2024
- LG Display Co., Ltd.
- Sunghwan YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING EQUIPMENT
- Publication number 20240234362
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Cheolan KWON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES FOR HANDLING MICROELECTRONIC DEVICES
- Publication number 20240139940
- Publication date May 2, 2024
- Micron Technology, Inc.
- Kuan Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING EQUIPMENT
- Publication number 20240136321
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Cheolan KWON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240072230
- Publication date Feb 29, 2024
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CONNECTING ELECTRONIC ASSEMBLIES
- Publication number 20240047413
- Publication date Feb 8, 2024
- PINK GMBH THERMOSYSTEME
- Christoph Oetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR DEPOSITING UNDERFILL MATERIAL
- Publication number 20240038716
- Publication date Feb 1, 2024
- Western Digital Technologies, Inc.
- Choo Par Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF
- Publication number 20230420406
- Publication date Dec 28, 2023
- KULICKE AND SOFFA HI-TECH CO., LTD.
- Lu-Min Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN ARRAYING DEVICE, ARRAY FOR PIN ARRAYING, AND PIN ARRAYING METHOD
- Publication number 20230420407
- Publication date Dec 28, 2023
- TOYAMA PREFECTURAL UNIVERSITY
- Isao SHIMOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...
- Publication number 20230386878
- Publication date Nov 30, 2023
- SAMSUNG DISPLAY CO., LTD.
- Won Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill Dams
- Publication number 20230260950
- Publication date Aug 17, 2023
- Google LLC
- ChanWei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURVED WAFER STAGE
- Publication number 20230260954
- Publication date Aug 17, 2023
- NEXPERIA B.V.
- Joep Stokkermans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
- Publication number 20230223376
- Publication date Jul 13, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20230187285
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- SANG-WON LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20230163096
- Publication date May 25, 2023
- TORAY ENGINEERING CO., LTD.
- Katsumi TERADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LANED BELT FOR CLEANER
- Publication number 20230104821
- Publication date Apr 6, 2023
- Illinois Tool Works Inc.
- John Neiderman
- B08 - CLEANING
Information Patent Application
METHOD FOR CONTROLLING BOAT/STRIP TYPE SOLDER BALL PLACEMENT SYSTEM
- Publication number 20230086461
- Publication date Mar 23, 2023
- S.S.P. INC.
- Kyouho LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Means for supplying the connector to be connected in the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding system and bonding method

Apparatuses for handling microelectronic devices

Mounting apparatus

Tools and systems for processing semiconductor devices, and methods...

Method of chip transferring and device/module having gas guiding st...

Chip bonding apparatus and securing assembly therefor

Transfer tool and method for transferring semiconductor chips

System and method for connecting electronic assemblies

Apparatus and method for semiconductor device bonding

Lid attach process and dispenser head

Device and method of fluidic assembly of microchips on a substrate

Die bonding for chip conveying apparatus

Apparatus and methods for enhanced microelectronic device handling

Laned belt for cleaner

Electronic device

Laser bonding apparatus for three-dimensional molded sculptures

Light emitting diode display with redundancy scheme

Tape carrier assemblies having an integrated adhesive film

Semiconductor manufacturing apparatus

Bonding apparatus

Apparatus for and method for aligning dipoles and method of fabrica...

Arrangement and method for joining at least two joining partners

Apparatus, system, and method for handling aligned wafer pairs

Method of manufacturing a semiconductor package and apparatus for p...

Method and apparatus for bonding semiconductor substrate

Method of applying conductive adhesive and manufacturing device usi...

Solder member mounting system

Component mounting system

Systems for direct transfer of semiconductor device die

Ultrasonic-assisted solder transfer

Patents Applicationslast 30 patents

IC CHIP MOUNTING APPARATUS AND IC CHIP MOUNTING METHOD

CHIP TRANSFER DEVICE, CHIP TRANSFER METHOD AND MAGNETIC DIE BONDING...

SEMICONDUCTOR MANUFACTURING APPARATUS, METHOD OF MANUFACTURING SEMI...

BALL MOUNTING APPARATUS WITH BALL ATTACH VOLUME CONTROL

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

BONDING DEVICE AND BONDING METHOD

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

SYSTEM AND METHOD FOR FLUXLESS THERMOCOMPRESSION BONDING

SELF-ASSEMBLY DONOR AND METHOD FOR MANUFACTURING DISPLAY DEVICE USI...

SEMICONDUCTOR MANUFACTURING EQUIPMENT

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

APPARATUSES FOR HANDLING MICROELECTRONIC DEVICES

SEMICONDUCTOR MANUFACTURING EQUIPMENT

ELECTRONIC DEVICE

SYSTEM AND METHOD FOR CONNECTING ELECTRONIC ASSEMBLIES

SYSTEM AND METHOD FOR DEPOSITING UNDERFILL MATERIAL

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF

PIN ARRAYING DEVICE, ARRAY FOR PIN ARRAYING, AND PIN ARRAYING METHOD

APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...

Underfill Dams

CURVED WAFER STAGE

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

MOUNTING DEVICE AND MOUNTING METHOD

LANED BELT FOR CLEANER

METHOD FOR CONTROLLING BOAT/STRIP TYPE SOLDER BALL PLACEMENT SYSTEM