Means for transporting the components to be connected

Industry

CPC
H01L2224/7965

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/7965Means for transporting the components to be connected

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip bonding apparatus and securing assembly therefor
- Patent number 12,074,133
- Issue date Aug 27, 2024
- GUANGZHOU AIFO LIGHT COMMUNICATION TECHNOLOGY COMPANY LTD.
- Guoqiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for transferring a chip to a contact substrate
- Patent number 9,401,298
- Issue date Jul 26, 2016
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging or mounting a component
- Patent number 9,070,739
- Issue date Jun 30, 2015
- Novalia Ltd.
- Kate Stone
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Laminating system, IC sheet, scroll of IC sheet, and method for man...
- Patent number 9,053,401
- Issue date Jun 9, 2015
- Semiconductor Energy Laboratory Co., Ltd.
- Ryosuke Watanabe
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermally controlled fluidic self-assembly
- Patent number 7,629,026
- Issue date Dec 8, 2009
- Eastman Kodak Company
- Ravi Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for making an in-mold circuit
- Patent number 7,621,043
- Issue date Nov 24, 2009
- Checkpoint Systems, Inc.
- Andre Cote
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of electronic device
- Patent number 7,526,854
- Issue date May 5, 2009
- Renesas Technology Corp.
- Haruhiko Ishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,307,006
- Issue date Dec 11, 2007
- Semiconductor Energy Laboratory Co., Ltd.
- Susumu Okazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture of RFID tags and intermediate products therefor
- Patent number 7,229,018
- Issue date Jun 12, 2007
- Arthur A. Kurz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Enhancements in framed sheet processing
- Patent number 7,152,311
- Issue date Dec 26, 2006
- Tessera, Inc.
- Masud Beroz
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and tape carrier, and method of manufacturing...
- Patent number 6,506,980
- Issue date Jan 14, 2003
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting multiple microelectronic elements with lead deformation
- Patent number 6,365,436
- Issue date Apr 2, 2002
- Tessera, Inc.
- Tony Faraci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancements in framed sheet processing
- Patent number 6,338,982
- Issue date Jan 15, 2002
- Tessera, Inc.
- Masud Beroz
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device, method of fabricating the same and electronic...
- Patent number 6,326,233
- Issue date Dec 4, 2001
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancements in framed sheet processing
- Patent number 6,217,972
- Issue date Apr 17, 2001
- Tessera, Inc.
- Masud Beroz
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and tape carrier, and method of manufacturing...
- Patent number 6,200,824
- Issue date Mar 13, 2001
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting multiple microelectronic elements with lead deformation
- Patent number 6,147,400
- Issue date Nov 14, 2000
- Tessera, Inc.
- Tony Faraci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of fabricating the same, and electroni...
- Patent number 6,057,174
- Issue date May 2, 2000
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting multiple microelectronic elements with lead deformation
- Patent number 5,798,286
- Issue date Aug 25, 1998
- Tessera, Inc.
- Tony Faraci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming inner lead bonding on a microchip
- Patent number 5,288,008
- Issue date Feb 22, 1994
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inner lead bonding apparatus
- Patent number 5,207,369
- Issue date May 4, 1993
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 5,166,099
- Issue date Nov 24, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and tape carrier
- Patent number 4,977,441
- Issue date Dec 11, 1990
- Hitachi, Ltd.
- Hideya Ohtani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Balltape structure for tape automated bonding, multilayer packaging...
- Patent number 4,814,855
- Issue date Mar 21, 1989
- International Business Machines Corporation
- Rodney T. Hodgson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape automated manufacture of power semiconductor devices
- Patent number 4,716,124
- Issue date Dec 29, 1987
- General Electric Company
- Alexander J. Yerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape automated manufacture of power semiconductor devices
- Patent number 4,635,092
- Issue date Jan 6, 1987
- General Electric Company
- Alexander J. Yerman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONNECTION JIG TAPE
- Publication number 20220063947
- Publication date Mar 3, 2022
- Dongsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING OR MOUNTING A COMPONENT
- Publication number 20120117797
- Publication date May 17, 2012
- NOVALIA LTD.
- Kate Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Device for Transferring a Chip to a Contact Substrate
- Publication number 20080210368
- Publication date Sep 4, 2008
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminating System, Ic Sheet, Scroll of Ic Sheet, and Method for Man...
- Publication number 20080042168
- Publication date Feb 21, 2008
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Ryosuke Watanabe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Thermal release adhesive-backed carrier tapes
- Publication number 20080006922
- Publication date Jan 10, 2008
- Charles Gutentag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE EMBEDDED BRIDGE
- Publication number 20070102486
- Publication date May 10, 2007
- Checkpoint Systems, Inc.
- Andre Cote
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
IN-MOLD CHIP ATTACH
- Publication number 20070098942
- Publication date May 3, 2007
- Checkpoint Systems, Inc.
- Andre Cote
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Manufacturing method of electronic device
- Publication number 20070053310
- Publication date Mar 8, 2007
- Haruhiko Ishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20060194371
- Publication date Aug 31, 2006
- Semiconductor Energy Laboratory Co., Ltd.
- Susumu Okazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor packages with semiconductor chips
- Publication number 20060177968
- Publication date Aug 10, 2006
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally controlled fluidic self-assembly
- Publication number 20060057293
- Publication date Mar 16, 2006
- Eastman Kodak Company
- Ravi Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacture of RFID tags and intermediate products therefor
- Publication number 20060026819
- Publication date Feb 9, 2006
- Arthur A. Kurz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for attaching an integrated circuit on a silicon chip to a s...
- Publication number 20040005754
- Publication date Jan 8, 2004
- Rafsec Oy
- Samuli Stromberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Manufacturing method of tape carrier package and the system thereof
- Publication number 20030111713
- Publication date Jun 19, 2003
- Ming-Hsiang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and tape carrier, and method of manufacturing...
- Publication number 20030075795
- Publication date Apr 24, 2003
- SEIKO EPSON CORPORATION
- Nobuaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhancements in framed sheet processing
- Publication number 20020068384
- Publication date Jun 6, 2002
- Masud Beroz
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor device and tape carrier, and method of manufacturing...
- Publication number 20010039076
- Publication date Nov 8, 2001
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS

Means for transporting the components to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip bonding apparatus and securing assembly therefor

Method and device for transferring a chip to a contact substrate

Packaging or mounting a component

Laminating system, IC sheet, scroll of IC sheet, and method for man...

Thermally controlled fluidic self-assembly

Device for making an in-mold circuit

Manufacturing method of electronic device

Method of manufacturing semiconductor device

Manufacture of RFID tags and intermediate products therefor

Enhancements in framed sheet processing

Semiconductor device and tape carrier, and method of manufacturing...

Connecting multiple microelectronic elements with lead deformation

Enhancements in framed sheet processing

Semiconductor device, method of fabricating the same and electronic...

Enhancements in framed sheet processing

Semiconductor device and tape carrier, and method of manufacturing...

Connecting multiple microelectronic elements with lead deformation

Semiconductor device, method of fabricating the same, and electroni...

Connecting multiple microelectronic elements with lead deformation

Method of forming inner lead bonding on a microchip

Inner lead bonding apparatus

Manufacturing method for semiconductor device

Semiconductor device and tape carrier

Balltape structure for tape automated bonding, multilayer packaging...

Tape automated manufacture of power semiconductor devices

Tape automated manufacture of power semiconductor devices

Patents Applicationslast 30 patents

CONNECTION JIG TAPE

PACKAGING OR MOUNTING A COMPONENT

Method and Device for Transferring a Chip to a Contact Substrate

Laminating System, Ic Sheet, Scroll of Ic Sheet, and Method for Man...

Thermal release adhesive-backed carrier tapes

WIRE EMBEDDED BRIDGE

IN-MOLD CHIP ATTACH

Manufacturing method of electronic device

Method of manufacturing semiconductor device

Method for fabricating semiconductor packages with semiconductor chips

Thermally controlled fluidic self-assembly

Manufacture of RFID tags and intermediate products therefor

Method for attaching an integrated circuit on a silicon chip to a s...

Manufacturing method of tape carrier package and the system thereof

Semiconductor device and tape carrier, and method of manufacturing...

Enhancements in framed sheet processing

Semiconductor device and tape carrier, and method of manufacturing...