Mechanical cleaning

Industry

CPC
H01L2224/81012

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81012Mechanical cleaning

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for assembling components implementing a pre-treatment of th...
- Patent number 11,855,038
- Issue date Dec 26, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Olivier Castany
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prevention of bridging between solder joints
- Patent number 11,456,269
- Issue date Sep 27, 2022
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of bridging between solder joints
- Patent number 11,004,819
- Issue date May 11, 2021
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip mounted on a packaging substrate
- Patent number 10,418,340
- Issue date Sep 17, 2019
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-strike process for bonding packages and the packages thereof
- Patent number 10,068,868
- Issue date Sep 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-strike process for bonding
- Patent number 9,576,929
- Issue date Feb 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode body, wiring substrate, and semiconductor device
- Patent number 9,425,135
- Issue date Aug 23, 2016
- Olympus Corporation
- Chihiro Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding semiconductor substrates and devices obtained th...
- Patent number 8,912,044
- Issue date Dec 16, 2014
- IMEC
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked device assembly with integrated coil and method of forming...
- Patent number 7,868,729
- Issue date Jan 11, 2011
- FREESCALE SEMICONDUCTOR, INC.
- James Jen-Ho Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and process for manufacturing the same
- Patent number 7,776,735
- Issue date Aug 17, 2010
- Renesas Technology Corp.
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for reducing cold joint defects in flip chip p...
- Patent number 7,396,752
- Issue date Jul 8, 2008
- Altera Corporation
- Albert E. Puah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible scrub ring contact
- Patent number 7,284,991
- Issue date Oct 23, 2007
- Molex Incorporated
- Atsuhito Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and process for manufacturing the same
- Patent number 7,268,430
- Issue date Sep 11, 2007
- Renesas Technology Corp.
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure of device packaging
- Patent number 7,239,027
- Issue date Jul 3, 2007
- Industrial Technology Research Institute
- Su-Tsai Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for making z-axis electrical connections
- Patent number 6,260,264
- Issue date Jul 17, 2001
- 3M Innovative Properties Company
- Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING METHOD AND PACKAGING STRUCTURE OF MULTI-LAYER STACKED HIG...
- Publication number 20240321853
- Publication date Sep 26, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Maohua DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ASSEMBLING COMPONENTS IMPLEMENTING A PRE-TREATMENT OF TH...
- Publication number 20220173069
- Publication date Jun 2, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Olivier CASTANY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS
- Publication number 20210210454
- Publication date Jul 8, 2021
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS
- Publication number 20210098404
- Publication date Apr 1, 2021
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR SUBSTRATES AND DEVICES OBTAINED TH...
- Publication number 20140170813
- Publication date Jun 19, 2014
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE BODY, WIRING SUBSTRATE, AND SEMICONDUCTOR DEVICE
- Publication number 20130256880
- Publication date Oct 3, 2013
- OLYMPUS CORPORATION
- Chihiro Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICE ASSEMBLY WITH INTEGRATED COIL AND METHOD OF FORMING...
- Publication number 20100225434
- Publication date Sep 9, 2010
- FREESCALE SEMICONDUCTOR, INC.
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for manufacturing the same
- Publication number 20080254610
- Publication date Oct 16, 2008
- Tadatomo SUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY COMPLIANT PLATE FOR WAFER BONDING
- Publication number 20070284409
- Publication date Dec 13, 2007
- Mauro Kobrinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding structure of device packaging
- Publication number 20060078715
- Publication date Apr 13, 2006
- Su-Tsai Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and process for manufacturing the same
- Publication number 20060043552
- Publication date Mar 2, 2006
- RENESAS TECHNOLOGY CORP.
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Highly compliant plate for wafer bonding
- Publication number 20060003548
- Publication date Jan 5, 2006
- Mauro J. Kobrinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible scrub ring contact
- Publication number 20050277309
- Publication date Dec 15, 2005
- Atsuhito Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package and flip chip bonding method therein
- Publication number 20030001286
- Publication date Jan 2, 2003
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS

Mechanical cleaning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for assembling components implementing a pre-treatment of th...

Prevention of bridging between solder joints

Prevention of bridging between solder joints

Semiconductor chip mounted on a packaging substrate

Multi-strike process for bonding packages and the packages thereof

Multi-strike process for bonding

Electrode body, wiring substrate, and semiconductor device

Method for bonding semiconductor substrates and devices obtained th...

Stacked device assembly with integrated coil and method of forming...

Semiconductor device and process for manufacturing the same

Method and apparatus for reducing cold joint defects in flip chip p...

Flexible scrub ring contact

Semiconductor device and process for manufacturing the same

Bonding structure of device packaging

Methods for making z-axis electrical connections

Patents Applicationslast 30 patents

PACKAGING METHOD AND PACKAGING STRUCTURE OF MULTI-LAYER STACKED HIG...

METHOD FOR ASSEMBLING COMPONENTS IMPLEMENTING A PRE-TREATMENT OF TH...

PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS

PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS

METHOD FOR BONDING SEMICONDUCTOR SUBSTRATES AND DEVICES OBTAINED TH...

ELECTRODE BODY, WIRING SUBSTRATE, AND SEMICONDUCTOR DEVICE

STACKED DEVICE ASSEMBLY WITH INTEGRATED COIL AND METHOD OF FORMING...

Semiconductor device and process for manufacturing the same

HIGHLY COMPLIANT PLATE FOR WAFER BONDING

Bonding structure of device packaging

Semiconductor device and process for manufacturing the same

Highly compliant plate for wafer bonding

Flexible scrub ring contact

Semiconductor package and flip chip bonding method therein