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H01L2224/83012
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/83012
Mechanical cleaning
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device production method
Patent number
10,998,283
Issue date
May 4, 2021
TOSHIBA MEMORY CORPORATION
Takahiko Kawasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die tray with channels
Patent number
10,796,936
Issue date
Oct 6, 2020
INVENSAS BONDING TECHNOLOGIES, INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro-pillar assisted semiconductor bonding
Patent number
10,319,693
Issue date
Jun 11, 2019
Skorpios Technologies, Inc.
Damien Lambert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for bonding substrates
Patent number
9,673,167
Issue date
Jun 6, 2017
EV Group E. Thallner GmbH
Markus Wimplinger
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method for bonding metallic contact areas with solution of a sacrif...
Patent number
9,640,510
Issue date
May 2, 2017
EV Group E. Thallner GmbH
Bernhard Rebhan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light-emitting device with reflective resin
Patent number
9,537,065
Issue date
Jan 3, 2017
Sharp Kabushiki Kaisha
Yoshiki Sota
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and structure for wafer to wafer bonding in semiconductor pa...
Patent number
8,377,798
Issue date
Feb 19, 2013
Taiwan Semiconductor Manufacturing Co., Ltd.
Jung-Huei Peng
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE PRODUCTION METHOD
Publication number
20200035636
Publication date
Jan 30, 2020
Toshiba Memory Corporation
Takahiro KAWASAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Die tray with channels
Publication number
20180182654
Publication date
Jun 28, 2018
INVENSAS BONDING TECHNOLOGIES, INC.
Cyprian Emeka UZOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT-EMITTING DEVICE
Publication number
20140159076
Publication date
Jun 12, 2014
Sharp Kabushiki Kaisha
Yoshiki Sota
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PA...
Publication number
20120115305
Publication date
May 10, 2012
Taiwan Semiconductor Manufacturing Co., LTD
Jung-Huei PENG
B81 - MICRO-STRUCTURAL TECHNOLOGY