Mechanical cleaning

Industry

CPC
H01L2224/85012

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85012Mechanical cleaning

Industries

Patents Grantslast 30 patents

Information Patent Grant
Light-emitting device with reflective resin
- Patent number 9,537,065
- Issue date Jan 3, 2017
- Sharp Kabushiki Kaisha
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating wire bonding structure
- Patent number 9,289,846
- Issue date Mar 22, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ambient temperature ball bond
- Patent number 8,767,351
- Issue date Jul 1, 2014
- Seagate Technology LLC
- Leping Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Dense fluid spray cleaning process and apparatus
- Patent number 7,451,941
- Issue date Nov 18, 2008
- David P Jackson
- B24 - GRINDING POLISHING
Information Patent Grant
Method for deconstructing an integrated circuit package using lapping
- Patent number 6,813,828
- Issue date Nov 9, 2004
- Gel Pak L.L.C.
- Joseph J. Dlugokecki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip module cleaning using a carbon dioxide jet...
- Patent number 5,766,368
- Issue date Jun 16, 1998
- Eco-Snow Systems, Inc.
- Charles W. Bowers
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Method of forming lead frame with strengthened encapsulation adhesion
- Patent number 5,459,103
- Issue date Oct 17, 1995
- Texas Instruments Incorporated
- Harold T. Kelleher
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PROTECTING BOND PADS FROM CORROSION
- Publication number 20170352639
- Publication date Dec 7, 2017
- KNOWLES ELECTRONICS, LLC
- Peter V. Loeppert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRE BONDING APPARATUS AND METHOD
- Publication number 20140263584
- Publication date Sep 18, 2014
- Jia Lin Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20140159076
- Publication date Jun 12, 2014
- Sharp Kabushiki Kaisha
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System to wirebond power signals to flip-chip core
- Publication number 20070145607
- Publication date Jun 28, 2007
- Ranjan J. Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dense fluid spray cleaning process and apparatus
- Publication number 20030207655
- Publication date Nov 6, 2003
- David P. Jackson
- B08 - CLEANING
Information Patent Application
Method for deconstructing an integrated ciruit package using lapping
- Publication number 20030126741
- Publication date Jul 10, 2003
- Joseph J. Dlugokecki
- H01 - BASIC ELECTRIC ELEMENTS

Mechanical cleaning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light-emitting device with reflective resin

Method for fabricating wire bonding structure

Ambient temperature ball bond

Dense fluid spray cleaning process and apparatus

Method for deconstructing an integrated circuit package using lapping

Integrated circuit chip module cleaning using a carbon dioxide jet...

Method of forming lead frame with strengthened encapsulation adhesion

Patents Applicationslast 30 patents

METHOD FOR PROTECTING BOND PADS FROM CORROSION

WIRE BONDING APPARATUS AND METHOD

LIGHT-EMITTING DEVICE

System to wirebond power signals to flip-chip core

Dense fluid spray cleaning process and apparatus

Method for deconstructing an integrated ciruit package using lapping