Mechanical cleaning

Industry

CPC
H01L2224/81912

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81912Mechanical cleaning

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip package structure with metal-containing layer
- Patent number 12,002,746
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 11,335,634
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting Method of a semiconductor device using a colored auxiliary...
- Patent number 10,786,876
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for improving thermal performance of flip chip packages
- Patent number 9,691,683
- Issue date Jun 27, 2017
- Skyworks Solutions, Inc.
- Jaydutt Jagdish Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with improved thermal performance
- Patent number 9,401,316
- Issue date Jul 26, 2016
- Skyworks Solutions, Inc.
- Jaydutt Jagdish Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture for shaping a laminate substrate
- Patent number 9,059,240
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Edmund D. Blackshear
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER
- Publication number 20240312900
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Huan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER
- Publication number 20220270963
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Huan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20210066181
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Huan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR IMPROVING THERMAL PERFORMANCE OF FLIP CHIP PACKAGES
- Publication number 20150243580
- Publication date Aug 27, 2015
- SKYWORKS SOLUTIONS, INC.
- Jaydutt Jagdish Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXTURE FOR SHAPING A LAMINATE SUBSTRATE
- Publication number 20130323345
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Edmund D. Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Reflow and Cleaning Process and Apparatus for Performing...
- Publication number 20130146647
- Publication date Jun 13, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP PACKAGES WITH IMPROVED THERMAL PERFORMANCE
- Publication number 20130119535
- Publication date May 16, 2013
- SKYWORKS SOLUTIONS, INC.
- JAYDUTT J. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS

Mechanical cleaning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package structure with metal-containing layer

Chip package structure and method for forming the same

Mounting Method of a semiconductor device using a colored auxiliary...

Methods for improving thermal performance of flip chip packages

Electronic devices with improved thermal performance

Fixture for shaping a laminate substrate

Patents Applicationslast 30 patents

CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER

CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

METHODS FOR IMPROVING THERMAL PERFORMANCE OF FLIP CHIP PACKAGES

FIXTURE FOR SHAPING A LAMINATE SUBSTRATE

Integrated Reflow and Cleaning Process and Apparatus for Performing...

FLIP CHIP PACKAGES WITH IMPROVED THERMAL PERFORMANCE