Mechanical holding means

Industry

CPC
H01L2224/78703

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78703Mechanical holding means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electrically conductive pattern printer for downhole tools
- Patent number 10,799,908
- Issue date Oct 13, 2020
- Halliburton Energy Services, Inc.
- Robert L. Reynolds
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Support structures and clamping systems for semiconductor devices d...
- Patent number 9,038,998
- Issue date May 26, 2015
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing semiconductor device, and wire bonder
- Patent number 8,881,966
- Issue date Nov 11, 2014
- Renesas Electronics Corporation
- Kazuyuki Misumi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device support for bonding
- Patent number 8,720,767
- Issue date May 13, 2014
- Orthodyne Electronics Corporation
- Jonathan Byars
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device with copper wire ball-bonded to electrode pad...
- Patent number 8,692,370
- Issue date Apr 8, 2014
- Semiconductor Components Industries, LLC
- Takashi Kitazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,609,468
- Issue date Dec 17, 2013
- Renesas Electronics Corporation
- Atsushi Fujisawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of packaging an integrated circuit using a laser to remove m...
- Patent number 8,535,986
- Issue date Sep 17, 2013
- Infineon Technologies AG
- Liang Kng Ian Koh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gas delivery system for reducing oxidation in wire bonding operations
- Patent number 8,313,015
- Issue date Nov 20, 2012
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Closed loop wire bonding methods and bonding force calibration
- Patent number 8,302,840
- Issue date Nov 6, 2012
- Kulicke and Soffa Industries, Inc.
- Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire payout measurement and calibration techniques for a wire bondi...
- Patent number 8,302,841
- Issue date Nov 6, 2012
- Kulicke and Soffa Industries
- Ivy Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gas delivery system for reducing oxidation in wire bonding operations
- Patent number 8,066,170
- Issue date Nov 29, 2011
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Work clamp and wire bonding apparatus
- Patent number 7,975,899
- Issue date Jul 12, 2011
- Kaijo Corporation
- Riki Jindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for delivering shielding gas during wire bonding
- Patent number 7,628,307
- Issue date Dec 8, 2009
- ASM Technology Singapore Pte. Ltd.
- Yam Mo Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device clamp for reducing oxidation in wire bonding
- Patent number 7,614,538
- Issue date Nov 10, 2009
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 7,582,974
- Issue date Sep 1, 2009
- NEC Electronics Corporation
- Yoshiharu Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soft touch clamp actuation mechanism
- Patent number 7,532,428
- Issue date May 12, 2009
- ASM Technology Singapore Pte. Ltd.
- Ka Shing Kenny Kwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 7,416,970
- Issue date Aug 26, 2008
- Renesas Technology Corp.
- Tomishi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 7,226,815
- Issue date Jun 5, 2007
- Renesas Technology Corp.
- Tomishi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for reducing oxidation of electronic devices
- Patent number 7,182,793
- Issue date Feb 27, 2007
- ASM Technology Singapore Pty Ltd.
- Rong Duan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wirebonder to bond an IC chip to a substrate
- Patent number 7,152,308
- Issue date Dec 26, 2006
- Texas Instruments Incorporated
- Sean Michael Malolepszy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonder with a downholder for pressing the fingers of a system...
- Patent number 7,134,589
- Issue date Nov 14, 2006
- Unaxis International Trading Ltd
- Stéphane Balon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for lead penetrating clamping system
- Patent number 7,131,568
- Issue date Nov 7, 2006
- Micron Technology, Inc.
- Michael B. Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pattern recognition method
- Patent number 6,990,226
- Issue date Jan 24, 2006
- Amkor Technology, Inc.
- Song Hak Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamp for pattern recognition
- Patent number 6,984,879
- Issue date Jan 10, 2006
- Amkor Technology, Inc.
- Song Hak Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus of clamping semiconductor devices using sliding finger su...
- Patent number 6,981,629
- Issue date Jan 3, 2006
- Micron Technology, Inc.
- Michael B. Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die paddle clamping method for wire bond enhancement
- Patent number 6,977,214
- Issue date Dec 20, 2005
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Patent number 6,921,017
- Issue date Jul 26, 2005
- Micron Technology, Inc.
- Sven Evers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method to prevent oxidation of electronic devices
- Patent number 6,866,182
- Issue date Mar 15, 2005
- ASM Technology Singapore PTE LTD
- Yam Mo Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bondhead lead clamp apparatus
- Patent number 6,845,898
- Issue date Jan 25, 2005
- Micron Technology, Inc.
- Michael B. Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bondhead lead clamp apparatus and method
- Patent number 6,837,418
- Issue date Jan 4, 2005
- Micron Technology, Inc.
- Michael B. Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140061953
- Publication date Mar 6, 2014
- RENESAS ELECTRONICS CORPORATION
- Atsushi FUJISAWA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SUPPORT SYSTEM FOR A SEMICONDUCTOR DEVICE
- Publication number 20130019458
- Publication date Jan 24, 2013
- Orthodyne Electronics Corporation
- Jonathan M. Byars
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT STRUCTURES AND CLAMPING SYSTEMS FOR SEMICONDUCTOR DEVICES D...
- Publication number 20120274014
- Publication date Nov 1, 2012
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120267772
- Publication date Oct 25, 2012
- RENESAS ELECTRONICS CORPORATION
- Atsushi FUJISAWA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Packaging Integrated Circuits
- Publication number 20120043650
- Publication date Feb 23, 2012
- Infineon Technologies AG
- Liang Kng Ian Koh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS
- Publication number 20120031877
- Publication date Feb 9, 2012
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON...
- Publication number 20120024089
- Publication date Feb 2, 2012
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jeremiah Couey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20110304046
- Publication date Dec 15, 2011
- ON SEMICONDUCTOR TRADING, LTD. a Bermuda limited company
- Takashi Kitazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE SUPPORT FOR BONDING
- Publication number 20110212572
- Publication date Sep 1, 2011
- Orthodyne Electronics Corporation
- Jonathan Byars
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS
- Publication number 20110073635
- Publication date Mar 31, 2011
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE PAYOUT MEASUREMENT AND CALIBRATION TECHNIQUES FOR A WIRE BONDI...
- Publication number 20110000951
- Publication date Jan 6, 2011
- KULICKE AND SOFFA INDUSTRIES, INC.
- Ivy Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCED OXIDATION SYSTEM FOR WIRE BONDING
- Publication number 20100230476
- Publication date Sep 16, 2010
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND WIRE BONDER
- Publication number 20100203681
- Publication date Aug 12, 2010
- RENEASAS TECHNOLOGY CORP.
- KAZUYUKI MISUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100181628
- Publication date Jul 22, 2010
- Renesas Technology Corp.
- Kenya Kawano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLOSED LOOP WIRE BONDING METHODS AND BONDING FORCE CALIBRATION
- Publication number 20100108744
- Publication date May 6, 2010
- KULICKE AND SOFFA INDUSTRIES, INC.
- Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CLAMPING ASSEMBLY
- Publication number 20100096735
- Publication date Apr 22, 2010
- ROKKO TECHNOLOGY PTE LTD.
- Xue F. Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE UTILIZING THE SAME
- Publication number 20090294939
- Publication date Dec 3, 2009
- NEC ELECTRONICS CORPORATION
- Kazuhiko Okishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Work Clamp and Wire Bonding Apparatus
- Publication number 20090134201
- Publication date May 28, 2009
- Riki Jindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20080246166
- Publication date Oct 9, 2008
- NEC ELECTRONICS CORPORATION
- Yoshiharu Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT BLOCK
- Publication number 20080230531
- Publication date Sep 25, 2008
- CHIH-MING CHOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOFT TOUCH CLAMP ACTUATION MECHANISM
- Publication number 20080174132
- Publication date Jul 24, 2008
- Ka Shing Kenny KWAN
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
APPARATUS FOR DELIVERING SHIELDING GAS DURING WIRE BONDING
- Publication number 20080099531
- Publication date May 1, 2008
- Yam Mo WONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOVABLE ELECTRONIC FLAME-OFF DEVICE FOR A BONDING APPARATUS
- Publication number 20080073408
- Publication date Mar 27, 2008
- Ka Shing Kenny KWAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE CLAMP FOR REDUCING OXIDATION IN WIRE BONDING
- Publication number 20070284421
- Publication date Dec 13, 2007
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCED OXIDATION SYSTEM FOR WIRE BONDING
- Publication number 20070251980
- Publication date Nov 1, 2007
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20070212821
- Publication date Sep 13, 2007
- Tomishi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Surface Conditioning System for Improved Bondability
- Publication number 20070094867
- Publication date May 3, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Sean Michael Malolepszy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus of clamping semiconductor devices using sliding finger su...
- Publication number 20060157532
- Publication date Jul 20, 2006
- Michael B. Ball
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die paddle clamping method for wire bond enhancement
- Publication number 20060154404
- Publication date Jul 13, 2006
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate holding apparatus
- Publication number 20050263566
- Publication date Dec 1, 2005
- Guanghui Su
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Mechanical holding means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrically conductive pattern printer for downhole tools

Support structures and clamping systems for semiconductor devices d...

Method of manufacturing semiconductor device, and wire bonder

Semiconductor device support for bonding

Semiconductor device with copper wire ball-bonded to electrode pad...

Semiconductor device and method of manufacturing the same

Method of packaging an integrated circuit using a laser to remove m...

Gas delivery system for reducing oxidation in wire bonding operations

Closed loop wire bonding methods and bonding force calibration

Wire payout measurement and calibration techniques for a wire bondi...

Gas delivery system for reducing oxidation in wire bonding operations

Work clamp and wire bonding apparatus

Apparatus for delivering shielding gas during wire bonding

Device clamp for reducing oxidation in wire bonding

Semiconductor device and method of manufacturing same

Soft touch clamp actuation mechanism

Method for manufacturing semiconductor device

Method for manufacturing semiconductor device

System for reducing oxidation of electronic devices

Wirebonder to bond an IC chip to a substrate

Wire bonder with a downholder for pressing the fingers of a system...

Methods for lead penetrating clamping system

Pattern recognition method

Clamp for pattern recognition

Apparatus of clamping semiconductor devices using sliding finger su...

Die paddle clamping method for wire bond enhancement

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Apparatus and method to prevent oxidation of electronic devices

Bondhead lead clamp apparatus

Bondhead lead clamp apparatus and method

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SUPPORT SYSTEM FOR A SEMICONDUCTOR DEVICE

SUPPORT STRUCTURES AND CLAMPING SYSTEMS FOR SEMICONDUCTOR DEVICES D...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Packaging Integrated Circuits

GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS

METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE SUPPORT FOR BONDING

GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS

WIRE PAYOUT MEASUREMENT AND CALIBRATION TECHNIQUES FOR A WIRE BONDI...

REDUCED OXIDATION SYSTEM FOR WIRE BONDING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND WIRE BONDER

SEMICONDUCTOR DEVICE

CLOSED LOOP WIRE BONDING METHODS AND BONDING FORCE CALIBRATION

CLAMPING ASSEMBLY

LEAD FRAME AND SEMICONDUCTOR DEVICE UTILIZING THE SAME

Work Clamp and Wire Bonding Apparatus

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

HEAT BLOCK

SOFT TOUCH CLAMP ACTUATION MECHANISM

APPARATUS FOR DELIVERING SHIELDING GAS DURING WIRE BONDING

MOVABLE ELECTRONIC FLAME-OFF DEVICE FOR A BONDING APPARATUS

DEVICE CLAMP FOR REDUCING OXIDATION IN WIRE BONDING

REDUCED OXIDATION SYSTEM FOR WIRE BONDING

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Bond Surface Conditioning System for Improved Bondability

Apparatus of clamping semiconductor devices using sliding finger su...

Die paddle clamping method for wire bond enhancement

Substrate holding apparatus