Mechanical interlocking

Industry

CPC
H01L2224/81897

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81897Mechanical interlocking

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
3D packaging with low-force thermocompression bonding of oxidizable...
- Patent number 11,134,598
- Issue date Sep 28, 2021
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding semiconductor devices on sustrate and bonding st...
- Patent number 9,613,925
- Issue date Apr 4, 2017
- Tsinghua University
- Jian Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D device packaging using through-substrate posts
- Patent number 9,515,006
- Issue date Dec 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Douglas M. Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligning conductive bump structure and method of fabrication
- Patent number 9,349,701
- Issue date May 24, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Lin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of making the same
- Patent number 9,173,282
- Issue date Oct 27, 2015
- Georgia Tech Research Corporation
- Pulugurtha Markondeya Raj
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising a nanotube-based interface connection...
- Patent number 9,145,294
- Issue date Sep 29, 2015
- STMicroelectronics S.R.L.
- Davide Giuseppe Patti
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Alignment structures for integrated-circuit packaging
- Patent number 9,111,943
- Issue date Aug 18, 2015
- Oracle International Corporation
- Eugene M. Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligning conductive bump structure and method of making the same
- Patent number 9,024,438
- Issue date May 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Lin Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Coating of Nanowires
- Publication number 20240304581
- Publication date Sep 12, 2024
- NanoWired GmbH
- Olav Birlem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP DIE ALIGNMENT
- Publication number 20230378081
- Publication date Nov 23, 2023
- International Business Machines Corporation
- Effendi Leobandung
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
DEVICE AND METHOD OF FLUIDIC ASSEMBLY OF MICROCHIPS ON A SUBSTRATE
- Publication number 20220165702
- Publication date May 26, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Melina Haupt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING M...
- Publication number 20210227735
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Gold Contacting Metal
- Publication number 20210227734
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Tin-Based Contacting Metal
- Publication number 20210227732
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Copper-Based Contacting M...
- Publication number 20210227733
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding Using Metastable Gas Atoms
- Publication number 20210219474
- Publication date Jul 15, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Nickel-Based Contacting M...
- Publication number 20210219475
- Publication date Jul 15, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Gold Contacting Metal
- Publication number 20180132397
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Silver-Based Contacting M...
- Publication number 20180132398
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Indium-Based Contacting M...
- Publication number 20180132395
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Copper-Based Contacting M...
- Publication number 20180132396
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding Using Metastable Gas Atoms
- Publication number 20180132394
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
System for Low-Force Thermocompression Bonding
- Publication number 20180132393
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Nickel-Based Contacting M...
- Publication number 20180132399
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING METHOD AND BONDING STRUCTURE FORMED USING THE SAME
- Publication number 20160172326
- Publication date Jun 16, 2016
- TSINGHUA UNIVERSITY
- Jian CAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL IMPROVEMENT FOR HOTSPOTS ON DIES IN INTEGRATED CIRCUIT PACK...
- Publication number 20150200149
- Publication date Jul 16, 2015
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE USING THE SAME
- Publication number 20140015126
- Publication date Jan 16, 2014
- SK HYNIX INC.
- Ju Heon YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packaging With Low-Force Thermocompression Bonding Of Oxidizable...
- Publication number 20130270329
- Publication date Oct 17, 2013
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION PROCESS THEREOF
- Publication number 20130187275
- Publication date Jul 25, 2013
- FUJITSU SEMICONDUCTOR LIMITED
- Hikaru Ohira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF MAKING THE SAME
- Publication number 20130107485
- Publication date May 2, 2013
- Georgia Tech Research Corporation
- Pulugurtha Markondeya Raj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING CONDUCTIVE BUMP STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20130026620
- Publication date Jan 31, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Lin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING A NANOTUBE-BASED INTERFACE CONNECTION...
- Publication number 20110316173
- Publication date Dec 29, 2011
- STMicroelectronics S.r.l.
- Davide Giuseppe PATTI
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ALIGNMENT STRUCTURES FOR INTEGRATED-CIRCUIT PACKAGING
- Publication number 20110227200
- Publication date Sep 22, 2011
- ORACLE INTERNATIONAL CORPORATION
- Eugene M. Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20090102048
- Publication date Apr 23, 2009
- Eiji Hori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal improvement for hotspots on dies in integrated circuit pack...
- Publication number 20070290322
- Publication date Dec 20, 2007
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS

Mechanical interlocking

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D packaging with low-force thermocompression bonding of oxidizable...

Metallic interconnect, a method of manufacturing a metallic interco...

Method for bonding semiconductor devices on sustrate and bonding st...

3D device packaging using through-substrate posts

Self-aligning conductive bump structure and method of fabrication

Interconnect structures and methods of making the same

Electronic device comprising a nanotube-based interface connection...

Alignment structures for integrated-circuit packaging

Self-aligning conductive bump structure and method of making the same

Patents Applicationslast 30 patents

Coating of Nanowires

MULTI-CHIP DIE ALIGNMENT

DEVICE AND METHOD OF FLUIDIC ASSEMBLY OF MICROCHIPS ON A SUBSTRATE

THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING M...

Thermocompression Bonding with Passivated Gold Contacting Metal

Thermocompression Bonding with Passivated Tin-Based Contacting Metal

Thermocompression Bonding with Passivated Copper-Based Contacting M...

Thermocompression Bonding Using Metastable Gas Atoms

Thermocompression Bonding with Passivated Nickel-Based Contacting M...

Metallic Interconnect, a Method of Manufacturing a Metallic Interco...

Thermocompression Bonding with Passivated Gold Contacting Metal

Thermocompression Bonding with Passivated Silver-Based Contacting M...

Thermocompression Bonding with Passivated Indium-Based Contacting M...

Thermocompression Bonding with Passivated Copper-Based Contacting M...

Thermocompression Bonding Using Metastable Gas Atoms

System for Low-Force Thermocompression Bonding

Thermocompression Bonding with Passivated Nickel-Based Contacting M...

BONDING METHOD AND BONDING STRUCTURE FORMED USING THE SAME

THERMAL IMPROVEMENT FOR HOTSPOTS ON DIES IN INTEGRATED CIRCUIT PACK...

SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE USING THE SAME

3D Packaging With Low-Force Thermocompression Bonding Of Oxidizable...

SEMICONDUCTOR DEVICE AND FABRICATION PROCESS THEREOF

INTERCONNECT STRUCTURES AND METHODS OF MAKING THE SAME

SELF-ALIGNING CONDUCTIVE BUMP STRUCTURE AND METHOD OF MAKING THE SAME

ELECTRONIC DEVICE COMPRISING A NANOTUBE-BASED INTERFACE CONNECTION...

ALIGNMENT STRUCTURES FOR INTEGRATED-CIRCUIT PACKAGING

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

Thermal improvement for hotspots on dies in integrated circuit pack...