Mechanical means

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CPC
H01L2224/7555

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/7555Mechanical means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Hot-pressing member with improved focus of pressing and longevity a...
- Patent number 12,220,891
- Issue date Feb 11, 2025
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Fei-Fan Yu
- B30 - PRESSES
Information Patent Grant
Manufacturing method of semiconductor package using jig
- Patent number 12,211,818
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,978,717
- Issue date May 7, 2024
- Kioxia Corporation
- Yuuki Kuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser reflow apparatus and laser reflow method
- Patent number 11,935,863
- Issue date Mar 19, 2024
- Disco Corporation
- Satoshi Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low warpage curing methodology by inducing curvature
- Patent number 11,929,260
- Issue date Mar 12, 2024
- Applied Materials, Inc.
- Fang Jie Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,837,574
- Issue date Dec 5, 2023
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package using jig
- Patent number 11,804,468
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus
- Patent number 11,769,749
- Issue date Sep 26, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,735,689
- Issue date Aug 22, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat assisted flip chip bonding apparatus
- Patent number 11,682,650
- Issue date Jun 20, 2023
- National Pingtung University of Science and Technology
- Wei-Hua Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement and method for joining at least two joining partners
- Patent number 11,676,933
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Steffen Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus
- Patent number 11,664,344
- Issue date May 30, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,658,147
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Ilhyoung Koo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting apparatus
- Patent number 11,616,041
- Issue date Mar 28, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 11,315,901
- Issue date Apr 26, 2022
- EV Group E. Thallner GmbH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for semi-flexible eutectic bonder piece arraneg...
- Patent number 11,211,354
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hang Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an integral join and automatic placement machine
- Patent number 11,081,464
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Nicolas Heuck
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding device
- Patent number 11,049,840
- Issue date Jun 29, 2021
- Osaka University
- Katsuaki Suganuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method of semiconductor chip and bonding apparatus of semic...
- Patent number 11,018,112
- Issue date May 25, 2021
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,985,132
- Issue date Apr 20, 2021
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor chip mounting apparatus and semiconductor chip mounti...
- Patent number 10,978,420
- Issue date Apr 13, 2021
- Shinkawa Ltd.
- Yoshihito Hagiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion device and manufacturing method and appara...
- Patent number 10,950,391
- Issue date Mar 16, 2021
- Kabushiki Kaisha Toshiba
- Shigehiko Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, and mounting device
- Patent number 10,896,901
- Issue date Jan 19, 2021
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding wafers and bonding tool
- Patent number 10,872,873
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method of bonding substrates
- Patent number 10,872,874
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- B30 - PRESSES
Information Patent Grant
Bonding method of semiconductor chip and bonding apparatus of semic...
- Patent number 10,847,497
- Issue date Nov 24, 2020
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses of bonding substrates and methods of bonding substrates
- Patent number 10,833,047
- Issue date Nov 10, 2020
- Samsung Electronics Co., Ltd.
- Hoe Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer bonding method and wafer to wafer bonding system
- Patent number 10,811,381
- Issue date Oct 20, 2020
- Samsung Electronics Co., Ltd.
- Joon-Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond chucks having individually-controllable regions, and associate...
- Patent number 10,770,422
- Issue date Sep 8, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond chucks having individually-controllable regions, and associate...
- Patent number 10,770,421
- Issue date Sep 8, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING DEVICE AND ITS OPERATING METHOD
- Publication number 20250038147
- Publication date Jan 30, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jong Hyup KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION APPARATUS AND METHOD FOR BONDING ELECTRICAL COMPO...
- Publication number 20240421118
- Publication date Dec 19, 2024
- MB Automation GmbH & Co. KG
- Benjamin Holzner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240387446
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SEMICONDUCTOR CHIP
- Publication number 20240332245
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Dae Seo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING AN ELECTRONIC COMPONENT ONTO A SUBSTRATE BY MEA...
- Publication number 20240170450
- Publication date May 23, 2024
- SAFRAN ELECTRONICS & DEFENSE
- Jean-Christophe RIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT, METHOD FOR B...
- Publication number 20240145427
- Publication date May 2, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Chingju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR BOND...
- Publication number 20240105671
- Publication date Mar 28, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20240096846
- Publication date Mar 21, 2024
- TOKYO ELECTRON LIMITED
- Hideyuki Fukushima
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS FOR APPLYING A SINTERING FORCE VIA A COMPRESSIBLE FILM
- Publication number 20240030181
- Publication date Jan 25, 2024
- ASMPT SINGAPORE PTE. LTD
- Jiapei DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR BGA COPLANARITY AND WARPAGE CONTROL
- Publication number 20230395559
- Publication date Dec 7, 2023
- NVIDIA Corporation
- Dongji Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG
- Publication number 20230369283
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20230230853
- Publication date Jul 20, 2023
- SHINKAWA LTD.
- Daisuke TANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOT-PRESSING MEMBER WITH IMPROVED FOCUS OF PRESSING AND LONGEVITY A...
- Publication number 20230123108
- Publication date Apr 20, 2023
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- FEI-FAN YU
- B30 - PRESSES
Information Patent Application
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
- Publication number 20230011327
- Publication date Jan 12, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT ASSISTED FLIP CHIP BONDING APPARATUS
- Publication number 20220384383
- Publication date Dec 1, 2022
- National Pingtung University of Science and Technology
- Wei-Hua Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20220310551
- Publication date Sep 29, 2022
- Samsung Electronics Co., Ltd.
- ILHYOUNG KOO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20220302077
- Publication date Sep 22, 2022
- TOKYO ELECTRON LIMITED
- Takashi Terada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20220293551
- Publication date Sep 15, 2022
- KIOXIA Corporation
- Yuuki KURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG FOR MANUFACTURING SEMICONDCUTOR PACKAGE AND MANUFACTURING METHO...
- Publication number 20220230985
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
- Publication number 20220173068
- Publication date Jun 2, 2022
- EV GROUP E. THALLNER GMBH
- Dominik ZINNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS
- Publication number 20220130796
- Publication date Apr 28, 2022
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20210358879
- Publication date Nov 18, 2021
- TOKYO ELECTRON LIMITED
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER REFLOW APPARATUS AND LASER REFLOW METHOD
- Publication number 20210202431
- Publication date Jul 1, 2021
- Disco Corporation
- Satoshi KOBAYASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING APPARATUS
- Publication number 20210175201
- Publication date Jun 10, 2021
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement and Method for Joining at Least Two Joining Partners
- Publication number 20200294956
- Publication date Sep 17, 2020
- Steffen Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP MOUNTING APPARATUS AND SEMICONDUCTOR CHIP MOUNTI...
- Publication number 20200251441
- Publication date Aug 6, 2020
- SHINKAWA LTD.
- Yoshihito HAGIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...
- Publication number 20200212002
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- B32 - LAYERED PRODUCTS
Information Patent Application
BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...
- Publication number 20200212003
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
- Publication number 20200168580
- Publication date May 28, 2020
- EV GROUP E. THALLNER GMBH
- Dominik ZINNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES OF BONDING SUBSTRATES AND METHODS OF BONDING SUBSTRATES
- Publication number 20200152596
- Publication date May 14, 2020
- Samsung Electronics Co., Ltd.
- Hoe Chul KIM
- H01 - BASIC ELECTRIC ELEMENTS

Mechanical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hot-pressing member with improved focus of pressing and longevity a...

Manufacturing method of semiconductor package using jig

Semiconductor manufacturing apparatus

Laser reflow apparatus and laser reflow method

Low warpage curing methodology by inducing curvature

Bonding apparatus and bonding method

Manufacturing method of semiconductor package using jig

Mounting apparatus

Dielectric-dielectric and metallization bonding via plasma activati...

Heat assisted flip chip bonding apparatus

Arrangement and method for joining at least two joining partners

Mounting apparatus

Semiconductor manufacturing apparatus

Mounting apparatus

Method for bonding substrates

Systems and methods for semi-flexible eutectic bonder piece arraneg...

Method for producing an integral join and automatic placement machine

Bonding device

Bonding method of semiconductor chip and bonding apparatus of semic...

Bonding apparatus, bonding system, bonding method and storage medium

Semiconductor chip mounting apparatus and semiconductor chip mounti...

Photoelectric conversion device and manufacturing method and appara...

Method of manufacturing semiconductor device, and mounting device

Method for bonding wafers and bonding tool

Bonding apparatus and method of bonding substrates

Bonding method of semiconductor chip and bonding apparatus of semic...

Apparatuses of bonding substrates and methods of bonding substrates

Wafer to wafer bonding method and wafer to wafer bonding system

Bond chucks having individually-controllable regions, and associate...

Bond chucks having individually-controllable regions, and associate...

Patents Applicationslast 30 patents

BONDING DEVICE AND ITS OPERATING METHOD

THERMOCOMPRESSION APPARATUS AND METHOD FOR BONDING ELECTRICAL COMPO...

JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE

DEVICE AND METHOD FOR BONDING SEMICONDUCTOR CHIP

METHOD FOR MOUNTING AN ELECTRONIC COMPONENT ONTO A SUBSTRATE BY MEA...

APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT, METHOD FOR B...

APPARATUS FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR BOND...

BONDING APPARATUS AND BONDING METHOD

APPARATUS FOR APPLYING A SINTERING FORCE VIA A COMPRESSIBLE FILM

APPARATUS AND METHOD FOR BGA COPLANARITY AND WARPAGE CONTROL

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG

MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

HOT-PRESSING MEMBER WITH IMPROVED FOCUS OF PRESSING AND LONGEVITY A...

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

HEAT ASSISTED FLIP CHIP BONDING APPARATUS

SEMICONDUCTOR MANUFACTURING APPARATUS

BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD

SEMICONDUCTOR MANUFACTURING APPARATUS

JIG FOR MANUFACTURING SEMICONDCUTOR PACKAGE AND MANUFACTURING METHO...

APPARATUS AND METHOD FOR BONDING SUBSTRATES

MOUNTING APPARATUS

BONDING APPARATUS AND BONDING METHOD

LASER REFLOW APPARATUS AND LASER REFLOW METHOD

MOUNTING APPARATUS

Arrangement and Method for Joining at Least Two Joining Partners

SEMICONDUCTOR CHIP MOUNTING APPARATUS AND SEMICONDUCTOR CHIP MOUNTI...

BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...

BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...

APPARATUS AND METHOD FOR BONDING SUBSTRATES

APPARATUSES OF BONDING SUBSTRATES AND METHODS OF BONDING SUBSTRATES