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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/4878
Mechanical treatment
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Patents Grants
last 30 patents
Information
Patent Grant
Encapsulation warpage reduction for semiconductor die assemblies an...
Patent number
11,955,345
Issue date
Apr 9, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a power module unit
Patent number
11,915,990
Issue date
Feb 27, 2024
Siemens Aktiengesellschaft
Daniel Kappauf
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Gas quench for diffusion bonding
Patent number
11,905,583
Issue date
Feb 20, 2024
Applied Materials, Inc.
Joseph F. Behnke
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Power semiconductor device and substrate with dimple region
Patent number
11,842,968
Issue date
Dec 12, 2023
Mitsubishi Electric Corporation
Kohei Yabuta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method and equipment for forming the same
Patent number
11,810,833
Issue date
Nov 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device packaging warpage control
Patent number
11,728,285
Issue date
Aug 15, 2023
NXP USA, INC.
Vivek Gupta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package having warpage control and method of f...
Patent number
11,699,668
Issue date
Jul 11, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat dissipation component and method for manufacturing same
Patent number
11,682,604
Issue date
Jun 20, 2023
DENKA COMPANY LIMITED
Daisuke Goto
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Method for thinning solid-body layers provided with components
Patent number
11,664,277
Issue date
May 30, 2023
Siltectra GmbH
Ralf Rieske
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermally conductive structure for heat dissipation in semiconducto...
Patent number
11,658,044
Issue date
May 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chun-Hao Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor apparatus and method for manufacturing the same
Patent number
11,600,546
Issue date
Mar 7, 2023
Mitsubishi Electric Corporation
Hiroyuki Yoshihara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, method for manufacturing the same, and power...
Patent number
11,587,797
Issue date
Feb 21, 2023
Mitsubishi Electric Corporation
Masayuki Mafune
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate structures, methods for forming the same and semiconducto...
Patent number
11,482,482
Issue date
Oct 25, 2022
Advanced Semiconductor Engineering, Inc.
Ian Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module, vehicle and manufacturing method
Patent number
11,456,233
Issue date
Sep 27, 2022
Fuji Electric Co., Ltd.
Nobuhide Arai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die-attach method to compensate for thermal expansion
Patent number
11,430,744
Issue date
Aug 30, 2022
Cree, Inc.
David Seebacher
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor device and manufacturing method for power semic...
Patent number
11,342,281
Issue date
May 24, 2022
Mitsubishi Electric Corporation
Kohei Yabuta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Burst resistant thin wall heat sink
Patent number
11,131,506
Issue date
Sep 28, 2021
International Business Machines Corporation
Paul W. Coteus
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Folded sheet metal heat sink
Patent number
11,125,429
Issue date
Sep 21, 2021
SIGNIFY HOLDING B.V.
Gwendolyn Anita Luiten
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package structure and method and equipment for forming the same
Patent number
11,062,971
Issue date
Jul 13, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure for a heat transfer interface and method of manufacturing...
Patent number
11,032,942
Issue date
Jun 8, 2021
ALCATEL LUCENT
Roger Scott Kempers
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Crushable heat sink for electronic devices
Patent number
11,032,944
Issue date
Jun 8, 2021
Intel Corporation
Paul Gwin
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Cooling apparatus, semiconductor module, vehicle, and manufacturing...
Patent number
11,011,453
Issue date
May 18, 2021
Fuji Electric Co., Ltd.
Nobuhide Arai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Overmolded microelectronic packages containing knurled flanges and...
Patent number
10,998,255
Issue date
May 4, 2021
NXP USA, INC.
Audel Sanchez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Compliant Pin Fin heat sink with base integral pins
Patent number
10,991,639
Issue date
Apr 27, 2021
International Business Machines Corporation
Mark D. Schultz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally conductive structure for heat dissipation in semiconducto...
Patent number
10,957,559
Issue date
Mar 23, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Chun-Hao Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat dissipation unit
Patent number
10,900,719
Issue date
Jan 26, 2021
Asia Vital Components Co., Ltd.
Sheng-Huang Lin
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Lid for semiconductor electronic package
Patent number
10,872,838
Issue date
Dec 22, 2020
Juniper Networks, Inc.
Alexander I. Yatskov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for fabricating a heterostructure comprising a conductive s...
Patent number
10,840,110
Issue date
Nov 17, 2020
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Bastien Letowski
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory heat dissipation unit
Patent number
10,842,014
Issue date
Nov 17, 2020
Tung-Yi Wu
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Power module and production method of the same
Patent number
10,825,759
Issue date
Nov 3, 2020
Delta Electronics (Shanghai) Co., Ltd.
Shouyu Hong
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
Publication number
20240128145
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
HYEONSEOK LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power Semiconductor Device and Method of Manufacturing the Same, an...
Publication number
20240074122
Publication date
Feb 29, 2024
MITSUBISHI ELECTRIC CORPORATION
Yasuyuki SANDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL AND MECHANICAL ENHANCED THERMAL MODULE STRUCTURE ON HETEROG...
Publication number
20240063087
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Company Limited
Sheng-Liang Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR FORMING THE SAME
Publication number
20230420334
Publication date
Dec 28, 2023
Infineon Technologies Austria AG
Timo Bohnenberger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package Structure and Method and Equipment for Forming the Same
Publication number
20230369162
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL AND METHOD OF F...
Publication number
20230299017
Publication date
Sep 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Shen YEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20230154882
Publication date
May 18, 2023
Fuji Electric Co., Ltd.
Ryotaro TSURUOKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING A POWER MODULE UNIT
Publication number
20230131848
Publication date
Apr 27, 2023
SIEMENS AKTIENGESELLSCHAFT
DANIEL KAPPAUF
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
Publication number
20230066652
Publication date
Mar 2, 2023
NXP USA, Inc.
Vivek Gupta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FORMING A SEMICONDUCTOR PACKAGE DEVICE
Publication number
20230062499
Publication date
Mar 2, 2023
SILICON MOTION, INC.
Yi-Hung CHIEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230066154
Publication date
Mar 2, 2023
Fuji Electric Co., Ltd.
Kazuo ENOMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CYCLIC COOLING EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING METHO...
Publication number
20230010115
Publication date
Jan 12, 2023
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GAS QUENCH FOR DIFFUSION BONDING
Publication number
20220396857
Publication date
Dec 15, 2022
Applied Materials, Inc.
Joseph F. Behnke
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL AND METHOD OF F...
Publication number
20220367382
Publication date
Nov 17, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Shen YEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PACKAGING CHIP
Publication number
20220367209
Publication date
Nov 17, 2022
WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
Baoguan Yin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENCAPSULATION WARPAGE REDUCTION FOR SEMICONDUCTOR DIE ASSEMBLIES AN...
Publication number
20220359230
Publication date
Nov 10, 2022
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
Publication number
20220352049
Publication date
Nov 3, 2022
Mitsubishi Electric Corporation
Hiroyuki YOSHIHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...
Publication number
20220254738
Publication date
Aug 11, 2022
Mitsubishi Electric Corporation
Kohei YABUTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE STRUCTURES, METHODS FOR FORMING THE SAME AND SEMICONDUCTO...
Publication number
20220084926
Publication date
Mar 17, 2022
Advanced Semiconductor Engineering, Inc.
Ian HU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Base Plate for a Semiconductor Module Arrangement and Method for Pr...
Publication number
20220005708
Publication date
Jan 6, 2022
Marco Rasel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package Structure and Method and Equipment for Forming the Same
Publication number
20210343619
Publication date
Nov 4, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE METAL MATERIAL, METHOD FOR PRODUCING SAME, AND ELECTRONIC...
Publication number
20210245245
Publication date
Aug 12, 2021
Hitachi, Ltd
Tomotake TOHEI
B22 - CASTING POWDER METALLURGY
Information
Patent Application
Method for Thinning Solid-Body Layers Provided with Components
Publication number
20210225709
Publication date
Jul 22, 2021
SILTECTRA GMBH
Ralf Rieske
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
OVERMOLDED MICROELECTRONIC PACKAGES CONTAINING KNURLED FLANGES AND...
Publication number
20210217685
Publication date
Jul 15, 2021
NXP USA, Inc.
AUDEL SANCHEZ
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT SPREADING PLATE HAVING ATLEAST ONE COOLING FIN METHOD FOR PROD...
Publication number
20210210403
Publication date
Jul 8, 2021
Heraeus Deutschland GmBH & Co., KG
Ronald EISELE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY CONDUCTIVE STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTO...
Publication number
20210202270
Publication date
Jul 1, 2021
Taiwan Semiconductor Manufacturing Co., LTD
Chun-Hao Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT DISSIPATION COMPONENT AND METHOD FOR MANUFACTURING SAME
Publication number
20200335415
Publication date
Oct 22, 2020
DENKA COMPANY LIMITED
Daisuke GOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE, VEHICLE AND MANUFACTURING METHOD
Publication number
20200266126
Publication date
Aug 20, 2020
Fuji Electric Co., Ltd.
Nobuhide ARAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...
Publication number
20200251423
Publication date
Aug 6, 2020
MITSUBISHI ELECTRIC CORPORATION
Kohei YABUTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package Structure and Method and Equipment for Forming the Same
Publication number
20200219786
Publication date
Jul 9, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS