Mechanical treatment

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CPC
H01L21/4842

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4842Mechanical treatment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 12,176,275
- Issue date Dec 24, 2024
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, encapsulated package with punched lead and sawn side fla...
- Patent number 12,165,959
- Issue date Dec 10, 2024
- Infineon Technologies AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for an improved integrated circuit package
- Patent number 12,119,263
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 12,094,725
- Issue date Sep 17, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overmolded microelectronic packages containing knurled flanges and...
- Patent number 12,087,671
- Issue date Sep 10, 2024
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spring bar leadframe, method and packaged electronic device with ze...
- Patent number 12,087,674
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package assemblies and processes for making
- Patent number 12,074,099
- Issue date Aug 27, 2024
- Materion Corporation
- Ramesh Kothandapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement of a power semiconductor module and a cooler
- Patent number 12,068,174
- Issue date Aug 20, 2024
- HITACHI ENERGY LTD
- Daniele Torresin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical couplings designed to resolve process constraints
- Patent number 12,040,197
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with packaging material and metal member protr...
- Patent number 12,009,287
- Issue date Jun 11, 2024
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing a semiconductor device
- Patent number 11,996,299
- Issue date May 28, 2024
- Mitsubishi Electric Corporation
- Yukimasa Hayashida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipating substrate for semiconductor and preparation method...
- Patent number 11,984,326
- Issue date May 14, 2024
- IMH INC.
- Jong Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tie bar removal for semiconductor device packaging
- Patent number 11,967,507
- Issue date Apr 23, 2024
- NXP USA, INC.
- Richard Te Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multi-die semiconductor devices and corresp...
- Patent number 11,948,806
- Issue date Apr 2, 2024
- STMicroelectronics S.r.l.
- Paolo Crema
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing semiconductor module
- Patent number 11,948,850
- Issue date Apr 2, 2024
- Mitsubishi Electric Corporation
- Akitoshi Shirao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package assembly
- Patent number 11,929,308
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Steffany Ann Lacierda Moreno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect singulation
- Patent number 11,908,705
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Chih-Chien Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plurality of leads and sealing resin
- Patent number 11,908,777
- Issue date Feb 20, 2024
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,901,316
- Issue date Feb 13, 2024
- Rohm Co., Ltd.
- Kentaro Chikamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor device
- Patent number 11,894,291
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Shuhei Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having outer terminal portions with conductive...
- Patent number 11,887,915
- Issue date Jan 30, 2024
- Amkor Technology Japan, Inc.
- Masafumi Suzuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage semiconductor device lead frame and method of fabrication
- Patent number 11,881,445
- Issue date Jan 23, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and packaging process for side-wall plating w...
- Patent number 11,876,003
- Issue date Jan 16, 2024
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Longnan Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing transformers with laminate windings and bui...
- Patent number 11,869,855
- Issue date Jan 9, 2024
- Texas Instruments Incorporated
- Zhemin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MCM package isolation through leadframe design and package saw process
- Patent number 11,862,479
- Issue date Jan 2, 2024
- Texas Instruments Incorporated
- Bernard Kaebin Andres Ancheta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless leadframe and semiconductor device package therefrom
- Patent number 11,855,001
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Mohammad Waseem Hussain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double side heat dissipation for silicon chip package
- Patent number 11,842,952
- Issue date Dec 12, 2023
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe with delamination resistant feature
- Patent number 11,837,532
- Issue date Dec 5, 2023
- Texas Instruments Incorporated
- Amirul Afiq Bin Hud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded RF power package
- Patent number 11,823,986
- Issue date Nov 21, 2023
- Ampleon Netherlands B.V.
- Leonardus Theodorus Maria Raben
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plurality of leads and sealing resin
- Patent number 11,804,422
- Issue date Oct 31, 2023
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20240404928
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Masahiro NAGATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A DIE PAD AND AN ENCAPSULATION WITH TR...
- Publication number 20240387305
- Publication date Nov 21, 2024
- INFINEON TECHNOLOGIES AG
- Meng How Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240379383
- Publication date Nov 14, 2024
- TOWA CORPORATION
- Yudai TAKAMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND LEAD FRAME
- Publication number 20240371658
- Publication date Nov 7, 2024
- TOWA CORPORATION
- Syuho HANASAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...
- Publication number 20240355714
- Publication date Oct 24, 2024
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240355639
- Publication date Oct 24, 2024
- Jentech Precision Industrial Co., LTD.
- Chin-Jui YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240347430
- Publication date Oct 17, 2024
- Mitsubishi Electric Corporation
- Toshifumi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME
- Publication number 20240339382
- Publication date Oct 10, 2024
- TEXAS INSTRUMENTS INCORPORATED
- YOU CHYE HOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE
- Publication number 20240332140
- Publication date Oct 3, 2024
- Shinko Electric Industries Co., Ltd.
- Kesayuki SONEHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20240312878
- Publication date Sep 19, 2024
- ROHM CO., LTD.
- Hiroaki AOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD
- Publication number 20240297101
- Publication date Sep 5, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Yu-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240290694
- Publication date Aug 29, 2024
- ROHM CO., LTD.
- Ryotaro KAKIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER LEADFRAME PACKAGE WITH LEAD SIDEWALL SURFACE THAT IS FULLY SO...
- Publication number 20240274572
- Publication date Aug 15, 2024
- STMicroelectronics International N.V.
- Jefferson Sismundo TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER-CUT LEAD FRAME FOR INTEGRATED CIRCUIT (IC) PACKAGES
- Publication number 20240258120
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yuntao XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MULTI-DIE SEMICONDUCTOR DEVICES AND CORRESP...
- Publication number 20240249955
- Publication date Jul 25, 2024
- STMicroelectronics S.r.l
- Paolo CREMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME
- Publication number 20240243040
- Publication date Jul 18, 2024
- DANFOSS SILICON POWER GMBH
- Tobias APPEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMON LEAD FRAME, SEMICONDUCTOR DEVICE, METHOD FOR FORMING A COMMO...
- Publication number 20240234262
- Publication date Jul 11, 2024
- RENESAS ELECTRONICS CORPORATION
- Junichi NITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAV...
- Publication number 20240222139
- Publication date Jul 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SINGULATION
- Publication number 20240194494
- Publication date Jun 13, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Chih-Chien Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...
- Publication number 20240194570
- Publication date Jun 13, 2024
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME APPARATUS, SEMICONDUCTOR DEVICE AND METHOD OF MAKING A S...
- Publication number 20240178106
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Daniel Harold MATEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ATTACHED BATTERY AND METHOD THEREFOR
- Publication number 20240178111
- Publication date May 30, 2024
- NXP USA, Inc.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240170373
- Publication date May 23, 2024
- RENESAS ELECTRONICS CORPORATION
- Hideaki TAMIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20240145356
- Publication date May 2, 2024
- DAI NIPPON PRINTING CO., LTD.
- Masahiro NAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20240145351
- Publication date May 2, 2024
- STMicroelectronics S.r.l
- Matteo DE SANTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING SUCH SEMICONDUC...
- Publication number 20240145354
- Publication date May 2, 2024
- NEXPERIA B.V.
- Arnel Taduran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMON LEAD FRAME, SEMICONDUCTOR DEVICE, METHOD FOR FORMING A COMMO...
- Publication number 20240136258
- Publication date Apr 25, 2024
- RENESAS ELECTRONICS CORPORATION
- Junichi NITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH RESIN BLEED CONTROL STRUCTURE AND METHOD...
- Publication number 20240112989
- Publication date Apr 4, 2024
- NXP USA, Inc.
- Trent Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240096766
- Publication date Mar 21, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyeong Il JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE HAVING AN ELECTRICALLY CONDUCTIVE CLIP WITH A CONVEX...
- Publication number 20240087993
- Publication date Mar 14, 2024
- Wee Aun Jason Lim
- H01 - BASIC ELECTRIC ELEMENTS

Mechanical treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and a method of manufacturing a semiconductor...

Leadframe, encapsulated package with punched lead and sawn side fla...

Methods and apparatus for an improved integrated circuit package

Leadframe package with pre-applied filler material

Overmolded microelectronic packages containing knurled flanges and...

Spring bar leadframe, method and packaged electronic device with ze...

Microelectronics package assemblies and processes for making

Arrangement of a power semiconductor module and a cooler

Mechanical couplings designed to resolve process constraints

Semiconductor device with packaging material and metal member protr...

Methods for manufacturing a semiconductor device

Heat dissipating substrate for semiconductor and preparation method...

Tie bar removal for semiconductor device packaging

Method of manufacturing multi-die semiconductor devices and corresp...

Semiconductor module and method for manufacturing semiconductor module

Flip chip package assembly

Interconnect singulation

Semiconductor package with plurality of leads and sealing resin

Semiconductor device

Manufacturing method of semiconductor device and semiconductor device

Semiconductor device having outer terminal portions with conductive...

High voltage semiconductor device lead frame and method of fabrication

Semiconductor package and packaging process for side-wall plating w...

Method of manufacturing transformers with laminate windings and bui...

MCM package isolation through leadframe design and package saw process

Leadless leadframe and semiconductor device package therefrom

Double side heat dissipation for silicon chip package

Leadframe with delamination resistant feature

Molded RF power package

Semiconductor package with plurality of leads and sealing resin

Patents Applicationslast 30 patents

LEAD FRAME AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE HAVING A DIE PAD AND AN ENCAPSULATION WITH TR...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND LEAD FRAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

POWER CONVERSION DEVICE AND MANUFACTURING METHOD THEREFOR

MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME

LEAD FRAME AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

PACKAGING METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

POWER LEADFRAME PACKAGE WITH LEAD SIDEWALL SURFACE THAT IS FULLY SO...

LASER-CUT LEAD FRAME FOR INTEGRATED CIRCUIT (IC) PACKAGES

METHOD OF MANUFACTURING MULTI-DIE SEMICONDUCTOR DEVICES AND CORRESP...

LEADFRAME

COMMON LEAD FRAME, SEMICONDUCTOR DEVICE, METHOD FOR FORMING A COMMO...

MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAV...

INTERCONNECT SINGULATION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...

LEAD FRAME APPARATUS, SEMICONDUCTOR DEVICE AND METHOD OF MAKING A S...

SEMICONDUCTOR DEVICE WITH ATTACHED BATTERY AND METHOD THEREFOR

SEMICONDUCTOR DEVICE

LEAD FRAME AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING SUCH SEMICONDUC...

COMMON LEAD FRAME, SEMICONDUCTOR DEVICE, METHOD FOR FORMING A COMMO...

SEMICONDUCTOR DEVICE WITH RESIN BLEED CONTROL STRUCTURE AND METHOD...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

MOLDED PACKAGE HAVING AN ELECTRICALLY CONDUCTIVE CLIP WITH A CONVEX...