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Flip chip package assembly
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Patent number 11,929,308
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Issue date Mar 12, 2024
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Texas Instruments Incorporated
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Steffany Ann Lacierda Moreno
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H01 - BASIC ELECTRIC ELEMENTS
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Interconnect singulation
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Patent number 11,908,705
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Issue date Feb 20, 2024
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Texas Instruments Incorporated
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Chih-Chien Ho
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device
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Patent number 11,901,316
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Issue date Feb 13, 2024
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Rohm Co., Ltd.
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Kentaro Chikamatsu
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H01 - BASIC ELECTRIC ELEMENTS
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Molded RF power package
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Patent number 11,823,986
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Issue date Nov 21, 2023
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Ampleon Netherlands B.V.
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Leonardus Theodorus Maria Raben
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H01 - BASIC ELECTRIC ELEMENTS
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Coated semiconductor devices
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Patent number 11,791,248
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Issue date Oct 17, 2023
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Texas Instruments Incorporated
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Sreenivasan Kalyani Koduri
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H01 - BASIC ELECTRIC ELEMENTS
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Electronic power module
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Patent number 11,776,940
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Issue date Oct 3, 2023
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Kyocera AVX Components (Salzburg) GmbH
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Louis Costa
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H01 - BASIC ELECTRIC ELEMENTS
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Adhesive dispense unit
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Patent number 11,756,812
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Issue date Sep 12, 2023
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Nexperia B.V.
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Erik Eltink
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device
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Patent number 11,735,505
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Issue date Aug 22, 2023
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Kabushiki Kaisha Toshiba
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Hidetoshi Kuraya
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H01 - BASIC ELECTRIC ELEMENTS
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