Mechanical treatment

Industry

CPC
H01L21/4842

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4842Mechanical treatment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacture for a cascode semiconductor device
- Patent number 12,293,961
- Issue date May 6, 2025
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive members atop semiconductor packages
- Patent number 12,272,626
- Issue date Apr 8, 2025
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having wettable lead flanks and tie bars and...
- Patent number 12,261,101
- Issue date Mar 25, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and manufacturing method thereof
- Patent number 12,243,811
- Issue date Mar 4, 2025
- Dai Nippon Printing Co., Ltd.
- Masahiro Nagata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device with grooved die pad
- Patent number 12,224,229
- Issue date Feb 11, 2025
- Kabushiki Kaisha Toshiba
- Kyo Tanabiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-cut lead-frame for integrated circuit (IC) packages
- Patent number 12,224,181
- Issue date Feb 11, 2025
- Texas Instruments Incorporated
- Tiange Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,211,764
- Issue date Jan 28, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple substrate package systems and related methods
- Patent number 12,211,775
- Issue date Jan 28, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having side wall plating
- Patent number 12,211,704
- Issue date Jan 28, 2025
- Siliconix incorporated
- Barry Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,199,019
- Issue date Jan 14, 2025
- Infineon Technologies AG
- Mohamad Yazid Bin Wagiman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 12,176,275
- Issue date Dec 24, 2024
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, encapsulated package with punched lead and sawn side fla...
- Patent number 12,165,959
- Issue date Dec 10, 2024
- Infineon Technologies AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for an improved integrated circuit package
- Patent number 12,119,263
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 12,094,725
- Issue date Sep 17, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overmolded microelectronic packages containing knurled flanges and...
- Patent number 12,087,671
- Issue date Sep 10, 2024
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spring bar leadframe, method and packaged electronic device with ze...
- Patent number 12,087,674
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package assemblies and processes for making
- Patent number 12,074,099
- Issue date Aug 27, 2024
- Materion Corporation
- Ramesh Kothandapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement of a power semiconductor module and a cooler
- Patent number 12,068,174
- Issue date Aug 20, 2024
- HITACHI ENERGY LTD
- Daniele Torresin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical couplings designed to resolve process constraints
- Patent number 12,040,197
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with packaging material and metal member protr...
- Patent number 12,009,287
- Issue date Jun 11, 2024
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing a semiconductor device
- Patent number 11,996,299
- Issue date May 28, 2024
- Mitsubishi Electric Corporation
- Yukimasa Hayashida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipating substrate for semiconductor and preparation method...
- Patent number 11,984,326
- Issue date May 14, 2024
- IMH INC.
- Jong Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tie bar removal for semiconductor device packaging
- Patent number 11,967,507
- Issue date Apr 23, 2024
- NXP USA, INC.
- Richard Te Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multi-die semiconductor devices and corresp...
- Patent number 11,948,806
- Issue date Apr 2, 2024
- STMicroelectronics S.r.l.
- Paolo Crema
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing semiconductor module
- Patent number 11,948,850
- Issue date Apr 2, 2024
- Mitsubishi Electric Corporation
- Akitoshi Shirao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package assembly
- Patent number 11,929,308
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Steffany Ann Lacierda Moreno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect singulation
- Patent number 11,908,705
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Chih-Chien Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plurality of leads and sealing resin
- Patent number 11,908,777
- Issue date Feb 20, 2024
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,901,316
- Issue date Feb 13, 2024
- Rohm Co., Ltd.
- Kentaro Chikamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor device
- Patent number 11,894,291
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Shuhei Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250149410
- Publication date May 8, 2025
- RENESAS ELECTRONICS CORPORATION
- Seiya ISOZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE
- Publication number 20250140653
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITIES IN PACKAGE CONDUCTIVE TERMINALS
- Publication number 20250140655
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jefferson LUGUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR ASSEMBLIES
- Publication number 20250132289
- Publication date Apr 24, 2025
- NEXPERIA B.V.
- Antonio B. Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE SUBSTRATE PACKAGE SYSTEMS AND RELATED METHODS
- Publication number 20250118640
- Publication date Apr 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250112135
- Publication date Apr 3, 2025
- NEXPERIA B.V.
- Yuet Keung Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT SEMICONDUCTOR PACKAGE WITH COPLANAR LEADS
- Publication number 20250112130
- Publication date Apr 3, 2025
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A SEMICONDUCTOR DIE SANDWICHED BETW...
- Publication number 20250105108
- Publication date Mar 27, 2025
- INFINEON TECHNOLOGIES AG
- Stefan MACHEINER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE CUTTING SYSTEM AND METHOD
- Publication number 20250087504
- Publication date Mar 13, 2025
- SEMES CO., LTD.
- Changhoon OK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20250079272
- Publication date Mar 6, 2025
- Fuji Electric Co., Ltd.
- Yuta SHIBASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250069996
- Publication date Feb 27, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE LEVEL COMPARTMENTAL INTEGRATED SHIELDING
- Publication number 20250070042
- Publication date Feb 27, 2025
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe, Encapsulated Package with Punched Lead and Sawn Side Fla...
- Publication number 20250054843
- Publication date Feb 13, 2025
- INFINEON TECHNOLOGIES AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELIEF SAWN QUAD FLAT NO-LEAD SEMICONDUCTOR PACKAGE
- Publication number 20250038009
- Publication date Jan 30, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Kengo Aoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods for Manufacturing Thereof
- Publication number 20250022780
- Publication date Jan 16, 2025
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A PACKAGE FOR A SEMICONDUCTOR CHIP, PACKAGE FO...
- Publication number 20250014970
- Publication date Jan 9, 2025
- ams-OSRAM International GmbH
- Mazwan Mansor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier and Method of Manufacturing the Component Carrier
- Publication number 20250014955
- Publication date Jan 9, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LEAD FRAME
- Publication number 20250006508
- Publication date Jan 2, 2025
- HAESUNG DS CO., LTD.
- Gwang Ryeol PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS
- Publication number 20250006510
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yu Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AS WELL AS A METHOD FOR MANUFACTURING SUCH SEM...
- Publication number 20250006597
- Publication date Jan 2, 2025
- NEXPERIA B.V.
- Kan Wae Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20240404928
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Masahiro NAGATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A DIE PAD AND AN ENCAPSULATION WITH TR...
- Publication number 20240387305
- Publication date Nov 21, 2024
- INFINEON TECHNOLOGIES AG
- Meng How Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240379383
- Publication date Nov 14, 2024
- TOWA CORPORATION
- Yudai TAKAMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND LEAD FRAME
- Publication number 20240371658
- Publication date Nov 7, 2024
- TOWA CORPORATION
- Syuho HANASAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...
- Publication number 20240355714
- Publication date Oct 24, 2024
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240355639
- Publication date Oct 24, 2024
- Jentech Precision Industrial Co., LTD.
- Chin-Jui YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240347430
- Publication date Oct 17, 2024
- Mitsubishi Electric Corporation
- Toshifumi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME
- Publication number 20240339382
- Publication date Oct 10, 2024
- TEXAS INSTRUMENTS INCORPORATED
- YOU CHYE HOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE
- Publication number 20240332140
- Publication date Oct 3, 2024
- Shinko Electric Industries Co., Ltd.
- Kesayuki SONEHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20240312878
- Publication date Sep 19, 2024
- ROHM CO., LTD.
- Hiroaki AOYAMA
- H01 - BASIC ELECTRIC ELEMENTS

Mechanical treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacture for a cascode semiconductor device

Conductive members atop semiconductor packages

Semiconductor package having wettable lead flanks and tie bars and...

Lead frame and manufacturing method thereof

Semiconductor device with grooved die pad

Laser-cut lead-frame for integrated circuit (IC) packages

Semiconductor device and method of manufacturing the same

Multiple substrate package systems and related methods

Semiconductor package having side wall plating

Semiconductor package

Semiconductor device and a method of manufacturing a semiconductor...

Leadframe, encapsulated package with punched lead and sawn side fla...

Methods and apparatus for an improved integrated circuit package

Leadframe package with pre-applied filler material

Overmolded microelectronic packages containing knurled flanges and...

Spring bar leadframe, method and packaged electronic device with ze...

Microelectronics package assemblies and processes for making

Arrangement of a power semiconductor module and a cooler

Mechanical couplings designed to resolve process constraints

Semiconductor device with packaging material and metal member protr...

Methods for manufacturing a semiconductor device

Heat dissipating substrate for semiconductor and preparation method...

Tie bar removal for semiconductor device packaging

Method of manufacturing multi-die semiconductor devices and corresp...

Semiconductor module and method for manufacturing semiconductor module

Flip chip package assembly

Interconnect singulation

Semiconductor package with plurality of leads and sealing resin

Semiconductor device

Manufacturing method of semiconductor device and semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE

CAVITIES IN PACKAGE CONDUCTIVE TERMINALS

METHOD OF MANUFACTURING SEMICONDUCTOR ASSEMBLIES

MULTIPLE SUBSTRATE PACKAGE SYSTEMS AND RELATED METHODS

SEMICONDUCTOR PACKAGE

FLAT SEMICONDUCTOR PACKAGE WITH COPLANAR LEADS

SEMICONDUCTOR DEVICE COMPRISING A SEMICONDUCTOR DIE SANDWICHED BETW...

SEMICONDUCTOR PACKAGE CUTTING SYSTEM AND METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

MODULE LEVEL COMPARTMENTAL INTEGRATED SHIELDING

Leadframe, Encapsulated Package with Punched Lead and Sawn Side Fla...

STRESS RELIEF SAWN QUAD FLAT NO-LEAD SEMICONDUCTOR PACKAGE

Semiconductor Devices and Methods for Manufacturing Thereof

METHOD FOR PRODUCING A PACKAGE FOR A SEMICONDUCTOR CHIP, PACKAGE FO...

Component Carrier and Method of Manufacturing the Component Carrier

METHOD OF MANUFACTURING LEAD FRAME

SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS

SEMICONDUCTOR DEVICE AS WELL AS A METHOD FOR MANUFACTURING SUCH SEM...

LEAD FRAME AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE HAVING A DIE PAD AND AN ENCAPSULATION WITH TR...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND LEAD FRAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

POWER CONVERSION DEVICE AND MANUFACTURING METHOD THEREFOR

MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME

LEAD FRAME AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE