Mechanical working of the substrate

Industry

CPC
H05K3/0044

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/0044Mechanical working of the substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Device for temperature measurement
- Patent number 12,171,060
- Issue date Dec 17, 2024
- SMA Solar Technology AG
- Felix Muehlhausen
- G01 - MEASURING TESTING
Information Patent Grant
Catheter splines with embedded circuit elements
- Patent number 12,150,751
- Issue date Nov 26, 2024
- BIOSENSE WEBSTER (ISRAEL) LTD.
- Assaf Govari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED circuit board structure and LED testing and packaging method
- Patent number 12,150,242
- Issue date Nov 19, 2024
- Ingentec Corporation
- Yi-Chuan Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel mechanism and winding device for flexible copper clad laminate
- Patent number 12,120,828
- Issue date Oct 15, 2024
- AAC Technologies (Nanjing) Co., Ltd.
- Rui Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board and resin sheet with...
- Patent number 12,120,827
- Issue date Oct 15, 2024
- Ajinomoto Co., Inc.
- Kazuhiko Tsurui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bent laminated printed circuit board
- Patent number 12,108,524
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,101,880
- Issue date Sep 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hee-Joon Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel molded electronic assemblies with multi-surface conductive co...
- Patent number 12,096,549
- Issue date Sep 17, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board arrangement, differential probe circuit and method
- Patent number 12,069,800
- Issue date Aug 20, 2024
- Rohde & Schwarz GmbH & Co. KG
- Andreas Ziegler
- G01 - MEASURING TESTING
Information Patent Grant
Method for producing a metal-ceramic substrate, and metal-ceramic s...
- Patent number 12,058,816
- Issue date Aug 6, 2024
- Rogers Germany GmbH
- Andreas Meyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imprinted emboss in chip-on-film
- Patent number 12,044,915
- Issue date Jul 23, 2024
- Dell Products L.P.
- Guentaek Oh
- G02 - OPTICS
Information Patent Grant
3D-printed, PCB composite structures, and formation methods
- Patent number 12,035,465
- Issue date Jul 9, 2024
- Continental Automotive Systems, Inc.
- Stanton F Rak
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed film electrostatic concentration for radon detection
- Patent number 11,977,194
- Issue date May 7, 2024
- National Research Council of Canada
- Ryan Hunter Griffin
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board
- Patent number 11,903,129
- Issue date Feb 13, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chi Seong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Milling of flex foil with two conductive layers from both sides
- Patent number 11,849,544
- Issue date Dec 19, 2023
- Gentherm GmbH
- Jan Horzella
- B02 - CRUSHING, PULVERISING, OR DISINTEGRATING PREPARATORY TREATMENT OF GRAIN...
Information Patent Grant
Package substrate manufacturing method
- Patent number 11,825,607
- Issue date Nov 21, 2023
- Montage Technology (Kunshan) Co., Ltd.
- Meng Mei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems including a vapor chamber as the heat spreading substrate o...
- Patent number 11,776,875
- Issue date Oct 3, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel-molded electronic assemblies
- Patent number 11,751,338
- Issue date Sep 5, 2023
- Vicor Corporation
- Patrizio Vinciarelli
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual conductor laminated substrate
- Patent number 11,744,023
- Issue date Aug 29, 2023
- Gentherm GmbH
- Timothy Hughes
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Multi-layered diamond-like carbon coating for electronic components
- Patent number 11,729,909
- Issue date Aug 15, 2023
- Honeywell Federal Manufacturing & Technologies, LLC
- Thomas Matthew Selter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of creating exposed cavities in molded electronic devices
- Patent number 11,723,151
- Issue date Aug 8, 2023
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Asymmetrical electrolytic plating for a conductive pattern
- Patent number 11,716,819
- Issue date Aug 1, 2023
- AVERATEK CORPORATION
- Michael Riley Vinson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroless and electrolytic deposition process for forming traces...
- Patent number 11,653,453
- Issue date May 16, 2023
- CATLAM, LLC
- Kenneth S Bahl
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for producing a waveguide, circuit device and radar system
- Patent number 11,646,479
- Issue date May 9, 2023
- Infineon Technologies AG
- Markus Josef Lang
- G01 - MEASURING TESTING
Information Patent Grant
Wall for isolation enhancement
- Patent number 11,632,856
- Issue date Apr 18, 2023
- Raytheon Company
- Andrew Southworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Marking device for marking circuit boards tested by means of a test...
- Patent number 11,622,450
- Issue date Apr 4, 2023
- Ingun Prüfmittelbau GmbH
- Bernd Boscher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies for downhole use
- Patent number 11,619,128
- Issue date Apr 4, 2023
- Baker Hughes Holdings LLC
- Silke Bramlage
- E21 - EARTH DRILLING MINING
Information Patent Grant
Component embedded in component carrier and having an exposed side...
- Patent number 11,570,897
- Issue date Jan 31, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Bettina Schuster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing curved-surface metal line
- Patent number 11,564,319
- Issue date Jan 24, 2023
- Lotes Co., Ltd.
- Zuo Feng Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate and electronic component-embedded module
- Patent number 11,553,592
- Issue date Jan 10, 2023
- Murata Manufacturing Co., Ltd.
- Ryota Asai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240414850
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240407077
- Publication date Dec 5, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe Waltrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...
- Publication number 20240381538
- Publication date Nov 14, 2024
- AT&S Austria Technologie & Systemtechnik
- Heinrich TRISCHLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE, JOINED BODY, SEMICONDUCTOR DEVICE, METHOD FOR MA...
- Publication number 20240324105
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kentaro IWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237198
- Publication date Jul 11, 2024
- CARUX TECHNOLOGY PTE. LTD.
- Chueh-Yuan Nien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET
- Publication number 20240215155
- Publication date Jun 27, 2024
- Nitto Denko Corporation
- Makoto TSUNEKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNT BOARD
- Publication number 20240172366
- Publication date May 23, 2024
- NIPPON MEKTRON, LTD.
- Azumi TOMINAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING IMAGE SENSING MODULE AND METHOD FOR FABRICATING THE...
- Publication number 20240130045
- Publication date Apr 18, 2024
- Medimaging Integrated Solution, Inc.
- SHANGYI WU
- G02 - OPTICS
Information Patent Application
METHODS AND MECHANISMS FOR MAINTAINING AN ELECTRO-ACTIVE POLYMER IN...
- Publication number 20240130047
- Publication date Apr 18, 2024
- ElastiMed Ltd.
- Omer Zelka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240098912
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Jinhwan JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, METHOD OF TRIMMING SAME, AND MULTI-LAYERED WIRING...
- Publication number 20240080990
- Publication date Mar 7, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Toshimi NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKLIGHT UNIT AND DISPLAY DEVICE
- Publication number 20240080985
- Publication date Mar 7, 2024
- LG Display Co., Ltd.
- Suhun LEE
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
METHOD FOR MANUFACTURING SEMI-FLEX PRINTED CIRCUIT BOARD
- Publication number 20240049396
- Publication date Feb 8, 2024
- TRIPOD (WUXI) ELECTRONIC CO., LTD.
- Cheng Ming LU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES
- Publication number 20240040703
- Publication date Feb 1, 2024
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED CIRCUIT BOARD STRUCTURE, LED TESTING AND PACKAGING METHOD AND L...
- Publication number 20240008170
- Publication date Jan 4, 2024
- INGENTEC CORPORATION
- Yi-Chuan HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20230389179
- Publication date Nov 30, 2023
- Nitto Denko Corporation
- Kazutoshi KINOSHITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP-CHIP BONDING STRUCTURE AND CIRCUIT BOARD THEREOF
- Publication number 20230380053
- Publication date Nov 23, 2023
- Chipbond Technology Corporation
- Chun-Te Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRICAL ELECTROLYTIC PLATING FOR A CONDUCTIVE PATTERN
- Publication number 20230345642
- Publication date Oct 26, 2023
- Averatek Corporation
- Michael Riley Vinson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD AND CIRCUIT BOARD MODULE WITH DOCKING STRUCTURE AND M...
- Publication number 20230328900
- Publication date Oct 12, 2023
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...
- Publication number 20230309240
- Publication date Sep 28, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A WAVEGUIDE, CIRCUIT DEVICE AND RADAR SYSTEM
- Publication number 20230268630
- Publication date Aug 24, 2023
- INFINEON TECHNOLOGIES AG
- Markus Josef LANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, METHOD, AND SYSTEM
- Publication number 20230247758
- Publication date Aug 3, 2023
- Baker Hughes Oilfield Operations LLC
- Navin Sakthivel
- E21 - EARTH DRILLING MINING
Information Patent Application
BOARD EDGE ELECTRICAL CONTACT STRUCTURES
- Publication number 20230232533
- Publication date Jul 20, 2023
- Nokia Solutions and Networks Oy
- David NORTH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REEL MECHANISM AND WINDING DEVICE FOR FLEXIBLE COPPER CLAD LAMINATE
- Publication number 20230217597
- Publication date Jul 6, 2023
- AAC TECHNOLOGIES (NANJING) CO., LTD.
- Rui Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE SHEET, METHOD FOR MANUFACTURING ANISOTROPIC...
- Publication number 20230209711
- Publication date Jun 29, 2023
- Mitsui Chemicals, Inc.
- Katsunori Nishiura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20230171896
- Publication date Jun 1, 2023
- Innolux Corporation
- Pei-Chi Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230141270
- Publication date May 11, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Chi Seong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Embedded in Component Carrier and Having an Exposed Side...
- Publication number 20230135105
- Publication date May 4, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Bettina Schuster
- G02 - OPTICS
Information Patent Application
KIRIGAMI ENABLED METHOD FOR FABRICATION OF LARGE-FORMAT ELECTRONIC...
- Publication number 20230118070
- Publication date Apr 20, 2023
- THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Hongyu YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D-PRINTED, PCB COMPOSITE STRUCTURES, AND FORMATION METHODS
- Publication number 20230094289
- Publication date Mar 30, 2023
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Stanton F Rak
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Mechanical working of the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Device for temperature measurement

Catheter splines with embedded circuit elements

LED circuit board structure and LED testing and packaging method

Reel mechanism and winding device for flexible copper clad laminate

Method for manufacturing printed wiring board and resin sheet with...

Bent laminated printed circuit board

Printed circuit board

Panel molded electronic assemblies with multi-surface conductive co...

Circuit board arrangement, differential probe circuit and method

Method for producing a metal-ceramic substrate, and metal-ceramic s...

Imprinted emboss in chip-on-film

3D-printed, PCB composite structures, and formation methods

Printed film electrostatic concentration for radon detection

Printed circuit board

Milling of flex foil with two conductive layers from both sides

Package substrate manufacturing method

Systems including a vapor chamber as the heat spreading substrate o...

Panel-molded electronic assemblies

Dual conductor laminated substrate

Multi-layered diamond-like carbon coating for electronic components

Methods of creating exposed cavities in molded electronic devices

Asymmetrical electrolytic plating for a conductive pattern

Electroless and electrolytic deposition process for forming traces...

Method for producing a waveguide, circuit device and radar system

Wall for isolation enhancement

Marking device for marking circuit boards tested by means of a test...

Electronics assemblies for downhole use

Component embedded in component carrier and having an exposed side...

Method of manufacturing curved-surface metal line

Ceramic substrate and electronic component-embedded module

Patents Applicationslast 30 patents

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...

CERAMIC SUBSTRATE, JOINED BODY, SEMICONDUCTOR DEVICE, METHOD FOR MA...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET

COMPONENT MOUNT BOARD

LIGHT-EMITTING IMAGE SENSING MODULE AND METHOD FOR FABRICATING THE...

METHODS AND MECHANISMS FOR MAINTAINING AN ELECTRO-ACTIVE POLYMER IN...

CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME

WIRING SUBSTRATE, METHOD OF TRIMMING SAME, AND MULTI-LAYERED WIRING...

BACKLIGHT UNIT AND DISPLAY DEVICE

METHOD FOR MANUFACTURING SEMI-FLEX PRINTED CIRCUIT BOARD

METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES

LED CIRCUIT BOARD STRUCTURE, LED TESTING AND PACKAGING METHOD AND L...

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

FLIP-CHIP BONDING STRUCTURE AND CIRCUIT BOARD THEREOF

ASYMMETRICAL ELECTROLYTIC PLATING FOR A CONDUCTIVE PATTERN

CIRCUIT BOARD AND CIRCUIT BOARD MODULE WITH DOCKING STRUCTURE AND M...

CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...

METHOD FOR PRODUCING A WAVEGUIDE, CIRCUIT DEVICE AND RADAR SYSTEM

PRINTED CIRCUIT BOARD, METHOD, AND SYSTEM

BOARD EDGE ELECTRICAL CONTACT STRUCTURES

REEL MECHANISM AND WINDING DEVICE FOR FLEXIBLE COPPER CLAD LAMINATE

ANISOTROPIC CONDUCTIVE SHEET, METHOD FOR MANUFACTURING ANISOTROPIC...

MANUFACTURING METHOD OF ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD

Component Embedded in Component Carrier and Having an Exposed Side...

KIRIGAMI ENABLED METHOD FOR FABRICATION OF LARGE-FORMAT ELECTRONIC...

3D-PRINTED, PCB COMPOSITE STRUCTURES, AND FORMATION METHODS